Download or read book Electromigration Testing of Al Alloy Films written by P. B. Ghate and published by . This book was released on 1980 with total page 85 pages. Available in PDF, EPUB and Kindle. Book excerpt: A search for reliability improvement of Al film interconnections has led to the introduction of Al-Alloy films such as Al+Cu, Al+Cu+Si and so on. This report describes the results of an in-depth study of Al, Al+Cu (2 wt % Cu) and Al+Cu+Si (2 wt % Cu + 1% Si) film interconnections and Silicon/Al-Alloy film contacts as they impact reliability of integrated circuits. Resistivity, microstructure and composition of Al-Alloy films vacuum deposited from an induction heated source (IN-Source) and dc magnetron sputter deposition techniques have been investigated and it is concluded that IN-Source and dc magnetron sputter deposition tecniques are equally capable of producing Al, Al+Cu (2 wt %) and Al+Cu+Si (2 wt % Cu + 1% Si) films of comparable compositions, resistivity and microstructure. Chemical Analysis X-Ray Fluorescence Electron Microprobe, Scanning and Transmission Electron Microscopy and Ion Microprobe have been employed for Al-Alloy film characterization. Availability of automated dc magnetron sputter (M-S) deposition equipment was a primary factor in the selection of magnetron sputter deposited Al-Alloy films for electromigration testing. (Author).
Download or read book A One Semester Course in Modeling of VSLI Interconnections written by Ashok Goel and published by Momentum Press. This book was released on 2014-12-29 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.
Download or read book Microstructure and Electromigration Effects in AL and AL ALLOY Thin Films written by John E. Sanchez and published by . This book was released on 1991 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microstructure and Electromigration Effects in A1 and A1 Alloy Thin Films written by John Espinoza Sanchez (Jr) and published by . This book was released on 1991 with total page 276 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1994 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Modeling and Testing of Electromigration Effects in Integrated Circuit Interconnects and Contacts Under Time varying Current Conditions written by Boon-Khim Liew and published by . This book was released on 1990 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electromigration Studies on A1 alloy Thin Film Conductors by Means of 1 f Noise Measurements and High resolution Resistance Experiments written by Jan Richard Kraayeveld and published by . This book was released on 1995 with total page 98 pages. Available in PDF, EPUB and Kindle. Book excerpt: Zusammenfassung niederländisch.
Download or read book Electromigration In Ulsi Interconnections written by Cher Ming Tan and published by World Scientific. This book was released on 2010-06-25 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained.The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed.
Download or read book Wafer Level Integrated Systems written by Stuart K. Tewksbury and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy. However, silicon monolithic circuits have progressed to such complex functions that a transition from a philosophy of integrated circuits (Ie's) to one of integrated sys tems is necessary. Wafer-scale integration has played an important role over the past few years in highlighting the system level issues which will most significantly impact the implementation of complex monolithic systems and system components. Rather than being a revolutionary approach, wafer-scale integration will evolve naturally from VLSI as defect avoidance, fault tolerance and testing are introduced into VLSI circuits. Successful introduction of defect avoidance, for example, relaxes limits imposed by yield and cost on Ie dimensions, allowing the monolithic circuit's area to be chosen according to the natural partitioning of a system into individual functions rather than imposing area limits due to defect densities. The term "wafer level" is perhaps more appropriate than "wafer-scale". A "wafer-level" monolithic system component may have dimensions ranging from conventional yield-limited Ie dimensions to full wafer dimensions. In this sense, "wafer-scale" merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit.
Download or read book Handbook of Semiconductor Interconnection Technology written by Geraldine Cogin Shwartz and published by CRC Press. This book was released on 2006-02-22 with total page 533 pages. Available in PDF, EPUB and Kindle. Book excerpt: First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first ed
Download or read book High Speed VLSI Interconnections written by Ashok K. Goel and published by John Wiley & Sons. This book was released on 2007-10-19 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.
Download or read book Microelectronic Materials written by C.R.M. Grovenor and published by Routledge. This book was released on 2017-10-05 with total page 557 pages. Available in PDF, EPUB and Kindle. Book excerpt: This practical book shows how an understanding of structure, thermodynamics, and electrical properties can explain some of the choices of materials used in microelectronics, and can assist in the design of new materials for specific applications. It emphasizes the importance of the phase chemistry of semiconductor and metal systems for ensuring the long-term stability of new devices. The book discusses single-crystal and polycrystalline silicon, aluminium- and gold-based metallisation schemes, packaging semiconductor devices, failure analysis, and the suitability of various materials for optoelectronic devices and solar cells. It has been designed for senior undergraduates, graduates, and researchers in physics, electronic engineering, and materials science.
Download or read book Electromigration in Thin Film Amorphous and Polycrystalline Alloys written by Michael Francis Chisholm and published by . This book was released on 1989 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Physics 1981 written by and published by . This book was released on 1981 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Technical Abstract Bulletin written by and published by . This book was released on 1981 with total page 230 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ULSI Science and Technology 1997 written by Hisham Z. Massoud and published by The Electrochemical Society. This book was released on 1997 with total page 686 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book On Chip Power Delivery and Management written by Inna P. Vaisband and published by Springer. This book was released on 2016-04-26 with total page 750 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
