Download or read book Electromigration in Aluminum Gold and Silver Thin Films written by Hans Joachim Geier and published by . This book was released on 1974 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Investigation of Electromigration in Thin Film Aluminum at Low Temperatures written by David W. Banton (CAPT, USAF.) and published by . This book was released on 1986 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1994 with total page 892 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Physics of Thin Films written by Georg Hass and published by Elsevier. This book was released on 2013-10-22 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physics of Thin Films: Advances in Research and Development, Volume 7 is a collection of papers about film growth and structure, optical properties, and semiconducting films. The book covers topics such as diffraction theory; film support and filter fabrication; aging, usage, and cleaning of filters; and properties and applications of III-V compound films. It also discusses topics such as the preparation of use and unbacked metal filters; electromigration in thin films; and the built-up molecular films and their applications. The text is recommended for physicists and engineers involved in thin film physics, especially those who would like to know more about the progresses in the field.
Download or read book Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging written by James R. Lloyd and published by . This book was released on 1985 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Measurement of Electromigration in Aluminum Thin Films Using Resistive Techniques written by Lawrence Stearns Potter and published by . This book was released on 1968 with total page 82 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thin Films for Emerging Applications written by Maurice H. Francombe and published by Academic Press. This book was released on 2013-10-22 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: Following in the long-standing tradition of excellence established by this serial, this volume provides a focused look at contemporary applications. High Tc superconducting thin films are discussed in terms of ion beam and sputtering deposition, vacuum evaporation, laser ablation, MOCVD, and other deposition processes in addition to their ultimate applications. Detailed treatment is also given to permanent magnet thin films, lateral diffusion and electromigration in metallic thin films, and fracture and cracking phenomena in thin films adhering to high-elongation substrates.
Download or read book Electromigration in Metals written by Paul S. Ho and published by Cambridge University Press. This book was released on 2022-05-12 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Download or read book Electromigration in Thin Film Aluminum Alloy Interconnects written by Lawrence Edward Felton and published by . This book was released on 1986 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electromigration in thin films of aluminium written by S. Roberts and published by . This book was released on 1982 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Investigation of Electromigration in Thin Film Aluminum at Low Temperatures written by David W. Banton and published by . This book was released on 1986 with total page 109 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis project collects electromigration induced time to failure data from unglassed and glassed one percent silicon doped aluminum test patterns at four current densities: 4.5, 4.75, 5.5, and 6.25 mega-amps per square centimeter. At 4.5 mega-amps per square centimeter, unglassed pattern time to failure data is collected between negative thirteen and seventy degrees centigrade. From the data, the activation energy is calculated to be approximately 0.3 electron-volts. At 4.75 mega-amps per square centimeter, unglassed pattern time to failure data is collected between negative fifty and eighty degrees centigrade. From the data, the activation energy is calculated to be between approximately 0.3 electron-volts between ten and eighty degrees centigrade. At 5.5 mega-amps per square centimeter, unglassed pattern time to failure data is collected between negative fifty and twenty degrees centigrade. From the data, the activation energy is calculated to be between 0.35 and 0.43 volts for temperatures between negative seven and twenty degrees centigrade. At 6.25 mega-amps per square centimeter, glassed pattern time to failure data is collected between negative thirteen and eighty degrees centigrade. From the data, the activation energy is calculated to be approximately 0.3 electronvolts at temperatures between twenty and eighty degress centigrade. These ranges of activation energies indicate that surface electromigration is the dominant failure mechanism. Keywords: Electromigration; Low temperature; Silicon doped aluminum; Thin films; Aluminum.
Download or read book The Nature and Behavior of Grain Boundaries written by Anning Hu and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: In view of the dramatically increased interest in the study of grain boundaries during the past few years, the Physical Metal lurgy Committee of The Institute of Metals Division of The Metal lurgical Society, AIME, sponsored a four-session symposium on the NATURE AND BEHAVIOR OF GRAIN BOUNDARIES, at the TMS-AIME Fall Meeting in Detroit, Michigan, October 18-19, 1971. The main ob jectives of this symposium were to examine the more recent develop ments, theoretical and experimental, in our understanding of grain boundaries, and to stimulate further studies in these and related areas. This volume contains most of the papers presented at the Symposium. It is regrettable that space limitations allow the inclusion of only four of the unsolicited papers, in addition to thirteen invited papers. The papers are grouped into three sections according to their major content: STRUCTURE OF GRAIN BOUNDARIES, ENERGETICS OF GRAIN BOUNDARIES, and GRAIN BOUNDARY MOTION AND RELATED PHENOMENA. Grain boundaries, or crystal interfaces, have been of both academic and practical interest for many years. An early seminar on "Metal Interfaces" was documented in 1952 by ASM. The Fourth Metallurgical Colloquium held in France, 1960, had a broad coverage on "Properties of Grain Boundaries". More recently the Australian Institute of Metals sponsored a conference on interfaces, with the proceedings being published by Butterworths in 1969.
Download or read book Study of the Early Stage of Electromigration in Gold Thin Films written by Shanyan Bai and published by . This book was released on 1998 with total page 418 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book A Study of Electromigration in Thin Gold Films written by William Lee Harrod and published by . This book was released on 1975 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electromigration of Thin Film Aluminium Interconnects written by O. F. Carr and published by . This book was released on 1994 with total page 142 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thin Films written by J. M. Poate and published by John Wiley & Sons. This book was released on 1978 with total page 596 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microcircuit Reliability Bibliography written by and published by . This book was released on 1978 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt:
