Download or read book ELECTRODEPOSITION D ALLIAGES ZN NI MODIFIES SUR ALLIAGE D ALUMINIUM 2024T3 written by CLAUDE.. BORIES and published by . This book was released on 1998 with total page 151 pages. Available in PDF, EPUB and Kindle. Book excerpt: CES TRAVAUX PORTENT SUR L'ETUDE DES PROCESSUS D'ELECTROCRISTALLISATION D'ALLIAGES ZINC-NICKEL DANS DES CONDITIONS SPECIFIQUES AU SUBSTRAT EN ALLIAGE D'ALUMINIUM. NOUS PROPOSONS TOUT D'ABORD, A PARTIR D'ANALYSE PAR DIFFRACTION DES RAYONS X, UN DIAGRAMME DE PHASES ELECTRODEPOSEES DES ALLIAGES ZINC-NICKEL ENTRE 0 ET 20% DE NICKEL OU, CONTRAIREMENT AU DIAGRAMME THERMODYNAMIQUE, LA PHASE DELTA EST ABSENTE ET LES DOMAINES D'EXISTENCE DES PHASES ETA ET GAMMA SONT PLUS ETENDUS. SI LE CHOIX D'ELECTROLYTE DE PH INFERIEUR A 4 PERMET DE LIMITER LA FORMATION D'UNE COUCHE D'OXYDE A L'INTERFACE DEPOT-SUBSTRAT, CETTE CONDITION NECESSAIRE N'EST PAS SUFFISANTE POUR LA SUPPRIMER. NOUS MONTRONS QUE L'ADHERENCE DES REVETEMENTS EST CONDITIONNEE PAR LES PROCESSUS DE GERMINATION ET CROISSANCE DANS LES PREMIERS INSTANTS DE DEPOT. LES REVETEMENTS BIPHASES ETA GAMMA AYANT UNE TENEUR EN NICKEL INFERIEURE A 14% SONT CARACTERISES PAR UNE GERMINATION A TROIS DIMENSIONS DONT LE FAIBLE POUVOIR COUVRANT ENGENDRE L'OXYDATION SIMULTANEE DU SUBSTRAT LORS DE L'ELECTROLYSE ET LA FRAGILISATION DE L'INTERFACE DEPOT-SUBSTRAT. POUR DES ALLIAGES MONOPHASES GAMMA DONT LA TENEUR EN NICKEL EST PLUS ELEVEE, LA GERMINATION A DEUX DIMENSIONS DEVIENT RAPIDEMENT COUVRANTE ET LIMITE L'OXYDATION DU SUBSTRAT, L'ADHERENCE DES REVETEMENTS EST DANS CE CAS MAXIMALE. NOUS MONTRONS LES MODIFICATIONS ENGENDREES PAR LA PRESENCE DE SACCHARINE ADDITIONNEE A L'ELECTROLYTE SUR LES PREMIERS INSTANTS DE GERMINATION, SON EFFET SUR LA TAILLE DE GRAIN ET SUR LES CONTRAINTES RESIDUELLES. NOUS ETUDIONS, PAR LE TRACE DES COURBES DE POLARISATION, LE CARACTERE PROTECTEUR DE CES DEPOTS ET RECHERCHONS UN TRAITEMENT DE CONVERSION CHIMIQUE EN PRESENCE D'UNE MOLECULE ORGANIQUE FAVORISANT LA FORMATION IN SITU D'UN COMPOSE INHIBITEUR DE CORROSION. LA PRESENCE D'UN COMPOSE CHIMISORBE, FORME A PARTIR DE LA 8HYDROXYQUINOLEINE ET DES ESPECES METALLIQUES, MODIFIE LA REACTIVITE DES REVETEMENTS ZINC-NICKEL EN MILIEU CORROSIF EN LIMITANT LES COURANTS DE DISSOLUTION ANODIQUE.

Download or read book Gilded Metals written by Terry Drayman-Weisser and published by . This book was released on 2000 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through this lavishly illustrated volume, readers will discover how various cultures, ranging from ancient societies to more recent Western cultures, created gilded surfaces and how the allure of gold inspired new and ingenious technologies. Among others, practical techniques covered include foil and leaf gilding, depletion and diffusion techniques, fire gilding and electroplating. Conservation issues are also addressed.

Download or read book Surface Photovoltage Analysis Of Photoactive Materials written by Thomas Dittrich and published by World Scientific. This book was released on 2020-02-04 with total page 318 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surface photovoltage (SPV) techniques provide information about photoactive materials with respect to charge separation in space. This book aims to share experience in measuring and analyzing SPV signals and addresses researchers and developers interested in learning more about and in applying SPV methods. For this purpose, basics about processes in photoactive materials and principles of SPV measurements are combined with examples from research and development over the last two decades.SPV measurements with Kelvin probes, fixed capacitors, electron beams and photoelectrons are explained. Details are given for continuous, modulated and transient SPV spectroscopy. Simulation principles of SPV signals by random walks are introduced and applied for small systems. Application examples are selected for the characterization of silicon surfaces, gallium arsenide layers, electronic states in colloidal quantum dots, transport phenomena in metal oxides and local charge separation across photocatalytic active crystallites.

Download or read book Stress corrosion Cracking written by Russell H. Jones and published by ASM International(OH). This book was released on 1992 with total page 466 pages. Available in PDF, EPUB and Kindle. Book excerpt: Details the many conditions under which stress-corrosion cracking (SCC) can occur, the parameters which control SCC, and the methodologies for mitigating and testing for SCC, plus information on mechanisms of SCC with experimental data on a variety of materials. Contains information about environmen

Download or read book Polylactic Acid written by Vincenzo Piemonte and published by Nova Science Publishers. This book was released on 2014-01-19 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the synthesis, properties and applications of PLA through fourteen original chapters that will guide the reader through a fascinating journey into the world of PLA, providing interesting insights for those who intend to use this polymer for innovative applications, or simply those who want learn more about this very important biodegradable and bio-based plastic. PLA biodegradability introduces this polymer in a world of eco-friendly and human-friendly applications in several technological fields. In short, this book will appeal to all the readers who not only want to have a reference book of consolidated notions on PLA, but also, and especially, to those who want to discover new potentials and new application fields of this unique biodegradable polymer.

Download or read book Chemical Mechanical Planarization of Microelectronic Materials written by Joseph M. Steigerwald and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

Download or read book Stress corrosion Cracking of Titanium written by and published by . This book was released on 1966 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Oxidation of Tungsten written by Vincent David Barth and published by . This book was released on 1961 with total page 192 pages. Available in PDF, EPUB and Kindle. Book excerpt: The report presents a detailed review of available information on the oxidation of W and its alloys. W is relatively inert below 700 C. As the temperature is increased above this level, however, oxidation becomes progressively more rapid, reaching catastrophic rates at temperatures around 1200 C and above. Various theories for the mechanism and rates of W oxidation at different temperatures are reviewed, and the effect of pressure and water vapor on the stability of W oxides is discussed in detail. The elevatedtemperature reactions of W with other materials, such as refractory oxides, and with gases other than oxygen also are covered. Information on the protection of W by alloying and coating is included. (Author).

Download or read book Diffusion in Materials DIMAT 2011 written by I. Bezverkhyy and published by . This book was released on 2012 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The International Conference on Diffusion in Materials (DIMAT) is the benchmark conference series for diffusion in solids. DIMAT 2011 was organized by the University of Bourgogne in association with CNRS, Dijon (France). The conference showcased new results concerning theoretical tools as well as applied research approaches. Diffusion processes affect all types of materials: nanomaterials, materials for energy, metallurgy, glasses and ceramics, but each requires its own numerical tools.Volume is indexed by Thomson Reuters CPCI-S (WoS). This volume comprises most of the contributions presented at DIMAT 2011: 4 plenary lectures delivered by famous high-level scientists plus 88 contributions in the form of keynote lectures, talks and posters.

Download or read book The Rotating Disc Electrode written by I︠U︡riĭ Viktorovich Pleskov and published by Springer. This book was released on 1976-12 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: Important advances in a subject are as often promoted by a new technique as by new concepts and theories. In the study of electrode reactions which involve diffusion in a primary or a secondary step, the development and use of techniques involving rotating disc electrodes and derived instrumentation based on ring-disc and split-ring systems has enabled advances of great importance to be made in the quantitative examination of diffusion processes at electrodes and their role in electrode processes generally. The technique allows precisely defined mass-transport conditions to be set up which can be subjected to exact mathe matical analysis so that quantitative treatment of hydrodynamic and diffusion behavior can be made. Of special interest for elec trochemists is the opportunity which the rotating ring-disc system offers for studying solution-soluble intermediates in sequential electrode processes and the kinetics of their reactions in solution. In this book by Pleskov and Filinovskii, both the experimental techniques and the mathematical analysis for the treatments of results for various conditions and types of reaction are described in detail. We believe that presentation of work that has been car ried out by means of rotating electrode techniques, to a large extent by Russian workers, in the form of a concise book will be of great value both to electrochemists and kineticists, and those interested in the physics of fluid motion.

Download or read book Guide for Aluminum Hull Welding written by and published by . This book was released on 2004 with total page 96 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Mechanical Response of Engineering Materials written by Albert E. Segall and published by Kendall/Hunt Publishing Company. This book was released on 2014-06-02 with total page 236 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book The Structural Use of Aluminium written by Council for Codes of Practice and published by . This book was released on 1969-06-18 with total page 186 pages. Available in PDF, EPUB and Kindle. Book excerpt: Aluminium, Aluminium alloys, Structural design, Design, Construction materials, Metal sections, Structural members, Structural systems, Loading, Acceptance (approval), Approval testing, Joints, Corrosion protection, Joining processes

Download or read book Forms Supplement written by and published by . This book was released on 1984 with total page 32 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Specification for Tube of 99 Aluminium written by British Standards Institute Staff and published by . This book was released on 1986-02-28 with total page 6 pages. Available in PDF, EPUB and Kindle. Book excerpt: Aluminium, Seamless pipes, Pipes, Cold-working, Drawing (forming process), Purity, Chemical composition, Thickness, Diameter, Tensile strength, Air transport engineering, Hydraulic tests, Test pressure, Non-destructive testing

Download or read book Specification for Aluminium Collapsible Tubes written by British Standards Institute Staff and published by . This book was released on 1984-09-01 with total page 22 pages. Available in PDF, EPUB and Kindle. Book excerpt: Tubes (packages), Deformable packages, Packages, Packaging, Aluminium, Coatings, Dimensions, Closures, Caps (closures), Orifices, Length, Diameter, Thickness, Seals, Threads, Leak tests, Annealing, Mechanical testing, Crushing tests, Adhesion tests, Test equipment, Electrical testing, Circuits, Flexibility

Download or read book Adhesion 13 written by K.W. Allen and published by Springer. This book was released on 2012-04-22 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: As I turn to write this Prefaee to another volume of papers presented at the Annual Conferenee on Adhesion and Adhesives, I am reflecting on how fortuna te we are to he ahle to eontinue to attraet hoth speakers and audienee of such high standard year after year. This field of scienee and technology continues to grow in size and importance, so that it is not so surprising that those interested from a very eonsiderahle range of countries and diseiplines are willing to come together and spend a couple of days each year exchanging ideas and views, hoth formally and informally. So, once again, I can and must express thanks to all those who have made this volume possihle: hoth those who presented the papers, and then rewrote them for puhlication, and those who through their attendance made the conference a vi ahle reality. K. W. ALLEN v Contents v PreJace.