Download or read book Development of Failure Criterion and Reliability Model for Plastic Encapsulated Microcircuits at Elevated Environment written by Wai Kiong Poon and published by . This book was released on 2000 with total page 158 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Abstracts and Technical Reviews written by United States. National Aeronautics and Space Administration. Office of Reliability and Quality Assurance and published by . This book was released on 1969 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microcircuit Reliability Bibliography written by and published by . This book was released on 1978 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Research and Technology Program Digest written by United States. National Aeronautics and Space Administration and published by . This book was released on with total page 792 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Research and Technology Program Digest Flash Index written by and published by . This book was released on 1967 with total page 794 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1982 with total page 1282 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.
Download or read book The International Journal of Microcircuits and Electronic Packaging written by and published by . This book was released on 1996 with total page 442 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book International Aerospace Abstracts written by and published by . This book was released on 1997 with total page 940 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Annual Reliability and Maintainability Symposium written by Institute of Electrical and Electronics Engineers and published by . This book was released on 1997 with total page 476 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microelectronic Interconnections and Assembly written by G.G. Harman and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Download or read book Rapra Review Reports written by and published by iSmithers Rapra Publishing. This book was released on with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Plastic Encapsulated Microelectronics written by Michael Pecht and published by Wiley-Interscience. This book was released on 1995-02-20 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt: Until now, professionals in search of detailed information about the latest developments in PEM design and production have had to waste valuable time browsing through countless professional journals, monographs, and databases.
Download or read book Reliability of Organic Compounds in Microelectronics and Optoelectronics written by Willem Dirk van Driel and published by Springer Nature. This book was released on 2022-01-31 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Download or read book Proceedings of the International Symposium on Microelectronics written by and published by . This book was released on 2001 with total page 816 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Download or read book Advances in Electronic Packaging written by and published by . This book was released on 1999 with total page 1138 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Technical Abstract Bulletin written by and published by . This book was released on 1980 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt:
