Download or read book Design Study of Wafer Seals for Future Hypersonic Vehicles written by National Aeronautics and Space Administration (NASA) and published by Createspace Independent Publishing Platform. This book was released on 2018-06-24 with total page 24 pages. Available in PDF, EPUB and Kindle. Book excerpt: Future hypersonic vehicles require high temperature, dynamic seals in advanced hypersonic engines and on the vehicle airframe to seal the perimeters of movable panels, flaps, and doors. Current seals do not meet the demanding requirements of these applications, so NASA Glenn Research Center is developing improved designs to overcome these shortfalls. An advanced ceramic wafer seal design has shown promise in meeting these needs. Results from a design of experiments study performed on this seal revealed that several installation variables played a role in determining the amount of leakage past the seals. Lower leakage rates were achieved by using a tighter groove width around the seals, a higher seal preload, a tighter wafer height tolerance, and a looser groove length. During flow testing, a seal activating pressure acting behind the wafers combined with simulated vibrations to seat the seals more effectively against the sealing surface and produce lower leakage rates. A seal geometry study revealed comparable leakage for full-scale wafers with 0.125 and 0.25 in. thicknesses. For applications in which lower part counts are desired, fewer 0.25-in.-thick wafers may be able to be used in place of 0.125-in.-thick wafers while achieving similar performance. Tests performed on wafers with a rounded edge (0.5 in. radius) in contact with the sealing surface resulted in flow rates twice as high as those for wafers with a flat edge. Half-size wafers had leakage rates approximately three times higher than those for full-size wafers. Dunlap, Patrick H. and Finkbeiner, Joshua R. and Steinetz, Bruce M. and DeMange, Jeffrey J. Glenn Research Center NASA/TM-2005-213858, E-15228, AIAA Paper 2005-4153
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Download or read book Proceedings of the 2022 International Conference on Smart Manufacturing and Material Processing SMMP2022 written by A. Nayyar and published by IOS Press. This book was released on 2022-11-29 with total page 278 pages. Available in PDF, EPUB and Kindle. Book excerpt: Smart manufacturing is a broad category of manufacturing that employs computer-integration, high levels of adaptability and rapid design changes, together with digital information technology and a technically-trained workforce. This book presents the proceedings of SMMP2022, the 2022 International Conference on Smart Manufacturing and Material Processing, held on 12 and 13 August 2022 as a virtual event due to continuing restrictions related to the COVID-19 pandemic, and hosted from Shanghai, China. The conference provides a platform for researchers and scientists from smart manufacturing and material sciences to come together with researchers from various other application areas to discuss problems and solutions, identify new issues, and shape future directions for research. The conference received 60 submissions. These were submitted to a rigorous peer review process by a committee of experts from various disciplines, after which, 23 were accepted for presentation at the conference and publication here. The topics covered include materials processing and product manufacture, sensors and smart material systems, functional materials, industrial automation and process control, and discussion of the state-of-the-art and future direction of smart manufacturing and material sciences. Providing an overview of current developments in smart manufacturing and material processing, the book will be of interest to all those working in the field.
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