Download or read book Contribution la mod lisation lectrothermique written by Hussein Dia and published by . This book was released on 2011 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Une forte exigence de robustesse s'est imposée dans tous les domaines d'application des composants de puissance. Dans ce cadre très contraint, seule une analyse fine des phénomènes liés directement ou indirectement aux défaillances peut garantir une maîtrise de la fiabilité des fonctions assurées par les nouveaux composants de puissance. Cependant, ces phénomènes impliquent des couplages entre des effets électriques, thermiques et mécaniques, rendant leur étude très complexe. Le recours à la modélisation multi-physique bien adaptée s'avère alors déterminant. Dans ce mémoire de thèse, nous proposons une méthodologie de modélisation électrique prenant en compte les effets de la température sur les phénomènes localisés qui initient une défaillance souvent fatale. En prévision de la simulation électrothermique couplée impliquant des transistors MOS de puissance, un modèle électrique thermosensible de ce composant et de sa diode structurelle a été développé. Corrélativement un ensemble de bancs expérimentaux a été mis en œuvre pour l'extraction des paramètres et pour la validation du modèle. Une attention particulière a été accordée à l'étude des phénomènes parasites qui pourraient survenir de manière très localisée suite à une répartition inhomogène de la température et à l'apparition de points chauds. Ainsi les fonctionnements limites en avalanche, avec le déclenchement du transistor bipolaire parasite et de son retournement ont été modélisés. Des bancs spécifiques pour la validation du modèle pour les régimes extrêmes ont été utilisés en prenant des précautions liées à la haute température. Enfin, Le modèle électrique thermosensible complet développé a été utilisé par la société Epsilon ingénierie pour faire des simulations électrothermiques du MOS de puissance en mode d'avalanche en adaptant le logiciel Epsilon-R3D.

Download or read book Contribution la mod lisation lectrothermique written by Hussein Dia and published by Editions Universitaires Europeennes. This book was released on 2011-11-28 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt: Une forte exigence de robustesse s'est imposée dans tous les domaines d'application des composants de puissance. Dans ce cadre très contraint, seule une analyse fine des phénomènes liés directement ou indirectement aux défaillances peut garantir une maîtrise de la fiabilité des fonctions assurées par les nouveaux composants de puissance. Cependant, ces phénomènes impliquent des couplages entre des effets électriques, thermiques et mécaniques, rendant leur étude très complexe. Le recours à la modélisation multi-physique bien adaptée s'avère alors déterminant. Dans ce mémoire de thèse, nous proposons une méthodologie de modélisation électrique prenant en compte les effets de la température sur les phénomènes localisés qui initient une défaillance souvent fatale. En prévision de la simulation électrothermique couplée impliquant des transistors MOS de puissance, un modèle électrique thermosensible de ce composant et de sa diode structurelle a été développé. Corrélativement un ensemble de bancs expérimentaux a été mis en œuvre pour l'extraction des paramètres et pour la validation du modèle. Une attention particulière a été accordée à l'étude des phénomènes parasites qui pourraient survenir de manière très localisée suite à une répartition inhomogène de la température et à l'apparition de points chauds. Ainsi les fonctionnements limites en avalanche, avec le déclenchement du transistor bipolaire parasite et de son retournement ont été modélisés. Des bancs spécifiques pour la validation du modèle pour les régimes extrêmes ont été utilisés en prenant des précautions liées à la haute température. Enfin, Le modèle électrique thermosensible complet développé a été utilisé par la société Epsilon ingénierie pour faire des simulations électrothermiques du MOS de puissance en mode d'avalanche en adaptant le logiciel Epsilon-R3D.

Download or read book CONTRIBUTION A LA SIMULATION ELECTROTHERMIQUE EN ELECTRONIQUE DE PUISSANCE DEVELOPPEMENT D UNE METHODE DE SIMULATION POUR CIRCUITS DE COMMUTATION SOUMIS A DES COMMANDES VARIABLES written by PATRICK.. VALES and published by . This book was released on 1997 with total page 163 pages. Available in PDF, EPUB and Kindle. Book excerpt: DANS LES CIRCUITS DE PUISSANCE CONCUS ACTUELLEMENT, LES EFFETS ELECTROTHERMIQUES NE PEUVENT PLUS ETRE IGNORES. UNE METHODOLOGIE EST PROPOSEE EN VUE DE LA SIMULATION COMPORTEMENTALE DES CIRCUITS DE PUISSANCE SOUMIS AUX INTERACTIONS ELECTROTHERMIQUES. L'OBJECTIF EST DE CREER UN LOGICIEL QUI OPTIMISE LE TEMPS DE CALCUL TOUT EN TENANT COMPTE DES CONSTANTES DE TEMPS ELECTRIQUE ET THERMIQUE QUI SONT GENERALEMENT TRES DIFFERENTES. UN PROGRAMME SUPERVISEUR ECRIT EN FORTRAN, GERE AU MOYEN D'APPELS SYSTEME, UN DIALOGUE INTERACTIF ENTRE UN SIMULATEUR THERMIQUE RAPIDE ET UN SIMULATEUR ELECTRIQUE GENERAL. CE PROCESSUS DE COUPLAGE EXPLICITE ENTRE DEUX SIMULATEURS SPECIFIQUES, NECESSITE UN ENVIRONNEMENT DE TRAVAIL MULTITACHE. LE LOGICIEL DEVELOPPE, PERMET DE PREVOIR LA DERIVE DE LA PUISSANCE DISSIPEE DANS LA ZONE ACTIVE DES COMPOSANTS, AINSI QUE LES EFFETS DU COUPLAGE THERMIQUE ENTRE COMPOSANTS VOISINS. LA METHODE DE SIMULATION A ETE APPLIQUEE DE FACON ORIGINALE A L'ETUDE DES CIRCUITS DE COMMUTATION SOUMIS A DES COMMANDES VARIABLES. UNE PHASE DE VALIDATION MONTRE D'UNE PART LA COHERENCE DE LA METHODE UTILISEE ET D'AUTRE PART, UNE BONNE COMPARAISON ENTRE RESULTATS SIMULES ET EXPERIMENTAUX. POUR LES CIRCUITS DE COMMUTATION, LES TEMPS DE SIMULATION IMPLIQUES SONT CONSIDERABLEMENT REDUITS PAR RAPPORT A LA METHODE IMPLICITE DE SIMULATION, QUI CONSISTE A RESOUDRE L'ENSEMBLE DES EQUATIONS ELECTRIQUES ET THERMIQUES DANS LE SIMULATEUR ELECTRIQUE SEUL.

Download or read book Contribution la simulation lectrothermique en lectronique de puissance written by Patrick Vales and published by . This book was released on 1997 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Real Time Modelling and Processing for Communication Systems written by Muhammad Alam and published by Springer. This book was released on 2017-12-27 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents cutting-edge work on real-time modelling and processing, a highly active research field in both the research and industrial domains. Going beyond conventional real-time systems, major efforts are required to develop accurate and computational efficient real-time modelling algorithms and design automation tools that reflect the technological advances in high-speed and ultra-low-power transceiver communication architectures based on nanoscale devices. The book addresses basic and more advanced topics, such as I/O buffer circuits for ensuring reliable chip-to-chip communication, I/O buffer behavioural modelling, multiport empirical models for memory interfaces, compact behavioural modelling for memristive devices, and resource reservation modelling for distributed embedded systems. The respective chapters detail new research findings, new models, algorithms, implementations and simulations of the above-mentioned topics. As such, the book will help both graduate students and researchers understand the latest research into real-time modelling and processing.

Download or read book MODELISATION ELECTROTHERMIQUE A L ETAT PASSANT DE COMPOSANTS DE PUISSANCE INTEGRES OU DE MODULES HYBRIDES MULTI PUCES written by KAIS.. BELLIL and published by . This book was released on 1999 with total page 135 pages. Available in PDF, EPUB and Kindle. Book excerpt: LE DEVELOPPEMENT D'UNE CAO EFFICACE ET FIABLE DES CIRCUITS HYBRIDES ET INTEGRES DE PUISSANCE PASSE PAR LA PRISE EN COMPTE DES EFFETS ELECTROTHERMIQUES DANS LES MODELES DE COMPOSANTS DE PUISSANCE. LE TRAVAIL QUE NOUS PRESENTONS ICI EST UNE CONTRIBUTION AUX EFFORTS DEJA DEPLOYES DANS CE DOMAINE. IL CONCERNE PLUS PARTICULIEREMENT LA MODELISATION ELECTROTHERMIQUE DE COMPOSANTS DE PUISSANCE INTEGRES OU DE MODULES HYBRIDES MULTI-PUCES. NOTRE ANALYSE EST LIMITEE A L'ETUDE DE L'ETAT PASSANT EN REGIME DE FONCTIONNEMENT STATIQUE OU DYNAMIQUE LORSQUE LES ONDES DE COURANT SONT IMPOSEES AUX COMPOSANTS DE PUISSANCE PAR LE CIRCUIT EXTERIEUR. CETTE CLASSE DE PROBLEMES EST EN EFFET IMPORTANTE LORSQU'ON CONSIDERE LES APPLICATIONS DE L'ELECTRONIQUE AUTOMOBILE OU DES CONVERTISSEURS DE PUISSANCE FONCTIONNANT A FAIBLE FREQUENCE DE COMMUTATION. LA METHODE QUE NOUS PROPOSONS CONSISTE A ETUDIER LES INTERACTIONS ENTRE LES PARAMETRES ELECTRIQUES ET THERMIQUES DANS UNE MEME BOUCLE DE CALCUL. DANS CE BUT, NOUS ASSOCIONS UNE MODELISATION ELECTRIQUE SIMPLIFIEE DES COMPOSANTS DE PUISSANCE A UN CALCUL THERMIQUE TRIDIMENSIONNEL QUI PREND EN COMPTE LE TRANSFERT DE CHALEUR DANS LES ZONES ACTIVES ET LEUR ENVIRONNEMENT THERMIQUE. CETTE APPROCHE PERMET DE DECRIRE L'ETAT INTERNE DE LA DISSIPATION DE PUISSANCE DANS LES ZONES ACTIVES, DE RECHERCHER LA LIMITE DE STABILITE ELECTROTHERMIQUE GLOBALE OU DE REVELER, LE CAS ECHEANT, UNE LIMITE DE STABILITE ELECTROTHERMIQUE LOCALE LORSQUE LES FORMES D'ONDE DU COURANT IMPOSEES AUX COMPOSANTS SONT CONNUES. DES EXEMPLES CONCRETS DE CALCUL ELECTROTHERMIQUE VALIDENT LA METHODE EN REGIME STATIQUE ET DYNAMIQUE.

Download or read book Contribution la simulation lectrothermique des circuits int gr s analogiques written by Kraidy Jacques Ecrabey and published by . This book was released on 1996 with total page 162 pages. Available in PDF, EPUB and Kindle. Book excerpt: LA CAPACITE GRANDISSANTE DES CIRCUITS INTEGRES A DISSIPER DE LA PUISSANCE S'ACCOMPAGNE DE PROBLEMES THERMIQUES QUE LES CONCEPTEURS DOIVENT INTEGRER DES LES PREMIERES ETAPES DE LA CONCEPTION. CES PROBLEMES THERMIQUES PEUVENT CONSIDERABLEMENT DETERIORER LES PERFORMANCES ELECTRIQUES DES CIRCUITS. NOTRE LABORATOIRE TRAVAILLE SUR UN PROJET DE DEVELOPPEMENT D'UN SIMULATEUR ELECTROTHERMIQUE PERMETTANT D'ETUDIER CES PROBLEMES. SE SITUANT DANS CE PROJET, CE TRAVAIL DE THESE PRESENTE DES MODELES THERMIQUES DE BOITIERS DE CIRCUITS INTEGRES POUR UNE MEILLEURE PRISE EN COMPTE DES TRANSFERTS THERMIQUES QUI Y ONT LIEU. LE MODELE EST UN ENSEMBLE DE CELLULES RC OBTENUES PAR MAILLAGE DU BOITIER. EN LE VALIDANT PAR DES MESURES DE THERMOGRAPHIE INFRAROUGE EFFECTUEES SUR UN CIRCUIT INTEGRE INDUSTRIEL, NOUS AVONS MONTRE L'INFLUENCE DES TRANSFERTS DE CHALEUR DANS L'HABILLAGE DU CIRCUIT SUR LA DISTRIBUTION THERMIQUE A LA SURFACE DE SON LAYOUT AINSI QUE LEUR INFLUENCE SUR SES CARACTERISTIQUES ELECTRIQUES. D'AUTRE PART NOUS AVONS DEVELOPPE UNE METHODE NUMERIQUE DE RESOLUTION AFIN D'AUGMENTER LA VITESSE DU SIMULATEUR. CETTE METHODE EST BASEE SUR LA METHODE DU GRADIENT CONJUGUEE A LAQUELLE NOUS AVONS COUPLE UN PRECONDITIONNEMENT. LES TEMPS DE SIMULATIONS DE CETTE METHODE SONT COMPARES AUX TEMPS DE SIMULATION DE LA METHODE DE GAUSS-SEIDEL RELAXEE. NOUS OBTENONS UN GAIN DE TEMPS DE 50%

Download or read book Beyond CMOS written by Alessandro Cresti and published by John Wiley & Sons. This book was released on 2023-08-29 with total page 453 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Density Functional Theory written by Sajjad Haider and published by BoD – Books on Demand. This book was released on 2024-01-24 with total page 114 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a comprehensive overview of density functional theory (DFT), from its basics to its practical application and implementation. It also discusses the breakthroughs in the field and the complete integration of physical and chemical aspects. It examines both orbital and time-dependent functions along with their variations according to semiquantitative analysis. The book also discusses analytical and computational techniques and principles, considering the classical and quantum approaches. Also covered are important topics such as HOMO (highest occupied molecular orbital), LUMO (lowest unoccupied molecular orbital), MEP (minimum energy paths), KS-DFT (Kohn-Sham density functional theory), UHFD (Unrestricted Hartree-Fock-Dirac), and Gaussian methods.

Download or read book Proceedings of the 1st International Conference on Electronic Engineering and Renewable Energy written by Bekkay Hajji and published by Springer. This book was released on 2018-08-01 with total page 786 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proceedings present a selection of refereed papers presented at the 1st International Conference on Electronic Engineering and Renewable Energy (ICEERE 2018) held during 15-17 April 2018, Saidi, Morocco. The contributions from electrical engineers and experts highlight key issues and developments essential to the multifaceted field of electrical engineering systems and seek to address multidisciplinary challenges in Information and Communication Technologies. The book has a special focus on energy challenges for developing the Euro-Mediterranean regions through new renewable energy technologies in the agricultural and rural areas. The book is intended for academia, including graduate students, experienced researchers and industrial practitioners working in the fields of Electronic Engineering and Renewable Energy.

Download or read book Semiconductor Device Modeling with Spice written by Giuseppe Massabrio and published by McGraw Hill Professional. This book was released on 1998-12-22 with total page 500 pages. Available in PDF, EPUB and Kindle. Book excerpt: Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.

Download or read book Power Electronics Semiconductor Devices written by Robert Perret and published by John Wiley & Sons. This book was released on 2013-03-01 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book relates the recent developments in several key electrical engineering R&D labs, concentrating on power electronics switches and their use. The first sections deal with key power electronics technologies, MOSFETs and IGBTs, including series and parallel associations. The next section examines silicon carbide and its potentiality for power electronics applications and its present limitations. Then, a dedicated section presents the capacitors, key passive components in power electronics, followed by a modeling method allowing the stray inductances computation, necessary for the precise simulation of switching waveforms. Thermal behavior associated with power switches follows, and the last part proposes some interesting prospectives associated to Power Electronics integration.

Download or read book 2000 IEEE 31 Comhdh il Bhliant il Na Saineolaithe Ar Leictreonaic Chumhachta Imeachta Na Comhdh la written by and published by . This book was released on 2000 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Analyse Et Caract risation Des Couplages Substrat Et de la Connectique Dans Les Circuits 3D written by Fengyuan Sun and published by Editions Publibook. This book was released on 2016 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposal of doubling the number of transistors on an IC chip (with minimum costs and subtle innovations) every 24 months by Gordon Moore in 1965 (the so-called called Moore's law) has been the most powerful driver for the emphasis of the microelectronics industry in the past 50 years. This law enhances lithography scaling and integration, in 2D, of all functions on a single chip, increasingly through system-on-chip (SOC). On the other hand, the integration of all these functions can be achieved through 3D integrations . Generally speaking, 3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They are different and mostly the TSV (through-silicon via) separates 3D IC packaging from 3D IC/Si integrations since the latter two uses TSVs, but 3D IC packaging does not. TSV (with a new concept that every chip or interposer could have two surfaces with circuits) is the heart of 3D IC/Si integrations. Continued technology scaling together with the integration of disparate technologies in a single chip means that device performance continues to outstrip interconnect and packaging capabilities, and hence there exist many difficult engineering challenges, most notably in power management, noise isolation, and intra and inter-chip communication. 3D Si integration is the right way to go and compete with Moore's law (more than Moore versus more Moore). However, it is still a long way to go. In this book, Fengyuan SUN proposes new substrate network extraction techniques. Using this latter, the substrate coupling and loss in IC's can be analyzed. He implements some Green/TLM (Transmission Line Matrix) algorithms in MATLAB. It permits to extract impedances between any number of embedded contacts or/and TSVS. He does investigate models of high aspect ratio TSV, on both analytical and numerical methods electromagnetic simulations. This model enables to extract substrate and TSV impedance, S parameters and parasitic elements, considering the variable resistivity of the substrate. It is full compatible with SPICE-like solvers and should allow an investigation in depth of TSV impact on circuit performance.

Download or read book Passive RF and Microwave Integrated Circuits written by Leo Maloratsky and published by Elsevier. This book was released on 2003-12-01 with total page 385 pages. Available in PDF, EPUB and Kindle. Book excerpt: The growth in RF and wireless/mobile computing devices that operate at microwave frequencies has resulted in explosive demand for integrated circuits capable of operating at such frequencies in order to accomplish functions like frequency division, phase shifting, attenuation, and isolators and circulators for antennas. This book is an introduction to such ICs, combining theory and practical applications of those devices. In addition to this combined theory and application approach, the author discusses the critical importance of differing fabrication materials on the performance of ICs at different frequencies. This is an area often overlooked when choosing ICs for RF and microwave applications, yet it can be a crucial factor in how an IC performs in a given application. - Gives reader a solid background in an increasingly important area of circuit design - Emphasis on combination of theoretical discussions with practical application examples - In-depth discussion of critical, but often overlooked topic of different fabrication material performances at varying frequencies

Download or read book Electrical Contacts written by Milenko Braunovic and published by CRC Press. This book was released on 2017-12-19 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt: Various factors affect the performance of electrical contacts, including tribological, mechanical, electrical, and materials aspects. Although these behaviors have been studied for many years, they are not widely used or understood in practice. Combining approaches used across the globe, Electrical Contacts: Fundamentals, Applications, and Technology integrates advances in research and development in the tribological, material, and analytical aspects of electrical contacts with new data on electrical current transfer at the micro- and nanoscales. Taking an application-oriented approach, the authors illustrate how material characteristics, tribological behavior, and loading impact the degradation of contacts, formation of intermetallics, and overall reliability and performance. Coverage is divided broadly into three sections, with the first focused on mechanics, tribology, materials, current and heat transfer, and basic reliability issues of electrical contacts. The next section explores applications, such as power connections, electronic connections, and sliding contacts, while the final section presents the diagnostic and monitoring techniques used to investigate and measure phenomena occurring at electrical contact interfaces. Numerous references to current literature reflect the fact that this book is the most comprehensive survey in the field. Explore an impressive collection of data, theory, and practical applications in Electrical Contacts: Fundamentals, Applications, and Technology, a critical tool for anyone investigating or designing electrical equipment with improved performance and reliability in mind.

Download or read book Advanced DC DC Power Converters and Switching Converters written by Salvatore Musumeci and published by MDPI. This book was released on 2021-03-30 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nowadays, power electronics is an enabling technology in the energy development scenario. Furthermore, power electronics is strictly linked with several fields of technological growth, such as consumer electronics, IT and communications, electrical networks, utilities, industrial drives and robotics, and transportation and automotive sectors. Moreover, the widespread use of power electronics enables cost savings and minimization of losses in several technology applications required for sustainable economic growth. The topologies of DC–DC power converters and switching converters are under continuous development and deserve special attention to highlight the advantages and disadvantages for use increasingly oriented towards green and sustainable development. DC–DC converter topologies are developed in consideration of higher efficiency, reliable control switching strategies, and fault-tolerant configurations. Several types of switching converter topologies are involved in isolated DC–DC converter and nonisolated DC–DC converter solutions operating in hard-switching and soft-switching conditions. Switching converters have applications in a broad range of areas in both low and high power densities. The articles presented in the Special Issue titled "Advanced DC-DC Power Converters and Switching Converters" consolidate the work on the investigation of the switching converter topology considering the technological advances offered by innovative wide-bandgap devices and performance optimization methods in control strategies used.