Download or read book Nelson s Directory of Investment Research written by and published by . This book was released on 2008 with total page 1336 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Quality Engineering written by Chao-Ton Su and published by CRC Press. This book was released on 2016-04-19 with total page 391 pages. Available in PDF, EPUB and Kindle. Book excerpt: As quality becomes an increasingly essential factor for achieving business success, building quality improvement into all stages—product planning, product design, and process design—instead of just manufacturing has also become essential. Quality Engineering: Off-Line Methods and Applications explores how to use quality engineering methods and other modern techniques to ensure design optimization at every stage. The book takes a broad approach, focusing on the user’s perspective and building a well-structured framework for the study and implementation of quality engineering. Starting with the basics, this book presents an overall picture of quality engineering. The author delineates quality engineering methods such as DOE, Taguchi, and RSM as well as computational intelligence approaches. He discusses how to use a general computational intelligence approach to improve product quality and process performance. He also provides extensive examples and case studies, numerous exercises, and a glossary of basic terms. By adopting quality engineering, the defect rate during manufacturing shows noticeable improvement, the production cost is significantly lower, and the quality and reliability of products can be enhanced. Taking an integrated approach that makes the methods of upstream quality improvement accessible, without extensive mathematical treatments, this book is both a practical reference and an excellent textbook.

Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Download or read book Assembly and Reliability of Lead Free Solder Joints written by John H. Lau and published by Springer Nature. This book was released on 2020-05-29 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Download or read book Fan Out Wafer Level Packaging written by John H. Lau and published by Springer. This book was released on 2018-04-05 with total page 319 pages. Available in PDF, EPUB and Kindle. Book excerpt: This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.

Download or read book Solder Joint Reliability written by John H. Lau and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 649 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Download or read book A History of the Personal Computer written by Roy A. Allan and published by Allan Publishing. This book was released on 2001 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is an exciting history of the personal computer revolution. Early personal computing, the "first" personal computer, invention of the micrprocessor at Intel and the first microcomputer are detailed. It also traces the evolution of the personal computer from the software hacker, to its use as a consumer appliance on the Internet. This is the only book that provides such comprehensive coverage. It not only describes the hardware and software, but also the companies and people who made it happen.

Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Download or read book High Speed Digital System Design written by Anatoly Belous and published by Springer Nature. This book was released on 2019-11-13 with total page 961 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes for readers the entire, interconnected complex of theoretical and practical aspects of designing and organizing the production of various electronic devices, the general and main distinguishing feature of which is the high speed of processing and transmitting of digital signals. The authors discuss all the main stages of design - from the upper system level of the hierarchy (telecommunications system, 5G mobile communications) to the lower level of basic semiconductor elements, printed circuit boards. Since the developers of these devices in practice deal with distorted digital signals that are transmitted against a background of interference, the authors not only explain the physical nature of such effects, but also offer specific solutions as to how to avoid such parasitic effects, even at the design stage of high-speed devices.

Download or read book Corporate Social Responsibility written by Andrew Crane and published by Routledge. This book was released on 2014 with total page 630 pages. Available in PDF, EPUB and Kindle. Book excerpt: As a relatively young subject matter, corporate social responsibility has unsurprisingly developed and evolved in numerous ways since the first edition of this textbook was published. Retaining the features which made the first edition a top selling text in the field, the new edition continues to be the only textbook available which provides a ready-made, enhanced course pack for CSR classes. Authoritative editor introductions provide accessible entry points to the subjects covered - an approach which is particularly suited to advanced undergraduate and postgraduate teaching that emphasises a research-led approach. New case studies are integrated throughout the text to enable students to think and analyze the subject from every angle. The entire textbook reflects the global nature of CSR as a discipline and further pedagogical features include chapter learning outcomes; study questions; ‘challenges for practice’ boxes and additional ‘further reading’ features at the end of each chapter. This highly rated textbook now also benefits from a regularly updated companion website which features a brand new 'CSR Case Club' presenting students and lecturers with further case suggestions with which to enhance learning; lecture slides; updates from the popular Crane and Matten blog, links to further reading and career sites, YouTube clips and suggested answers to study questions. An Ivey CaseMate has also been created for this book at https://www.iveycases.com/CaseMateBookDetail.aspx?id=335.

Download or read book Worldwide Automotive Supplier Directory written by and published by . This book was released on 2006 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book The Mexican Securities Market written by and published by . This book was released on 199? with total page 36 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Against Entrepreneurship written by Anders Örtenblad and published by Springer Nature. This book was released on 2020-10-28 with total page 297 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explores whether there is reason to be against entrepreneurship. Just like literature on the darker sides of entrepreneurs and entrepreneurship, the book is an answer to the one-sided, overly positive and uncritical image of entrepreneurship. The “twist” in this book, in comparison with literature on dark sides of entrepreneurship, is to explore being against entrepreneurship. From various perspectives such as lexical semantics, Marxism, philosophy of science and psychology, the contributors contemplate on why there may be reason to be against entrepreneurship discourse as well as entrepreneurship practice. Some chapters are based on first-hand empirical data, others are conceptual. The main overall conclusion is that there are some strong arguments for being against entrepreneurship discourse, as well as for being against certain aspects of entrepreneurship practice. Before it is reasonable to be against entrepreneurship practice in total, a convincing and practicable alternative needs to be developed. This book will be valuable reading for entrepreneurship scholars, as well as academics working in the fields of business ethics, (critical) management, and international business.

Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

Download or read book Guide to Purchasing Green Power written by and published by Environmental Protection Agency. This book was released on 2004 with total page 52 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This guide can be downloaded from: www.eere.energy.gov/femp/technologies/renewable%5Fpurchasepower.cfm, www.epa.gov/greenpower/buygreenpower.htm, www.thegreenpowergroup.org/publications.html, www.resource-solutions.org."--Verso. t.p.

Download or read book Materials for Advanced Packaging written by Daniel Lu and published by Springer. This book was released on 2016-11-18 with total page 974 pages. Available in PDF, EPUB and Kindle. Book excerpt: Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Download or read book 3D Integration for VLSI Systems written by Chuan Seng Tan and published by CRC Press. This book was released on 2016-04-19 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th