Download or read book Circuit Design for Reliability written by Ricardo Reis and published by Springer. This book was released on 2014-11-08 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents physical understanding, modeling and simulation, on-chip characterization, layout solutions, and design techniques that are effective to enhance the reliability of various circuit units. The authors provide readers with techniques for state of the art and future technologies, ranging from technology modeling, fault detection and analysis, circuit hardening, and reliability management.

Download or read book CMOS RF Circuit Design for Reliability and Variability written by Jiann-Shiun Yuan and published by Springer. This book was released on 2016-04-13 with total page 108 pages. Available in PDF, EPUB and Kindle. Book excerpt: The subject of this book is CMOS RF circuit design for reliability. The device reliability and process variation issues on RF transmitter and receiver circuits will be particular interest to the readers in the field of semiconductor devices and circuits. This proposed book is unique to explore typical reliability issues in the device and technology level and then to examine their impact on RF wireless transceiver circuit performance. Analytical equations, experimental data, device and circuit simulation results will be given for clear explanation. The main benefit the reader derive from this book will be clear understanding on how device reliability issues affects the RF circuit performance subjected to operation aging and process variations.

Download or read book Hot Carrier Reliability of MOS VLSI Circuits written by Yusuf Leblebici and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: As the complexity and the density of VLSI chips increase with shrinking design rules, the evaluation of long-term reliability of MOS VLSI circuits is becoming an important problem. The assessment and improvement of reliability on the circuit level should be based on both the failure mode analysis and the basic understanding of the physical failure mechanisms observed in integrated circuits. Hot-carrier induced degrada tion of MOS transistor characteristics is one of the primary mechanisms affecting the long-term reliability of MOS VLSI circuits. It is likely to become even more important in future generation chips, since the down ward scaling of transistor dimensions without proportional scaling of the operating voltage aggravates this problem. A thorough understanding of the physical mechanisms leading to hot-carrier related degradation of MOS transistors is a prerequisite for accurate circuit reliability evaluation. It is also being recognized that important reliability concerns other than the post-manufacture reliability qualification need to be addressed rigorously early in the design phase. The development and use of accurate reliability simulation tools are therefore crucial for early assessment and improvement of circuit reliability : Once the long-term reliability of the circuit is estimated through simulation, the results can be compared with predetermined reliability specifications or limits. If the predicted reliability does not satisfy the requirements, appropriate design modifications may be carried out to improve the resistance of the devices to degradation.

Download or read book Soft Error Reliability of VLSI Circuits written by Behnam Ghavami and published by Springer Nature. This book was released on 2020-10-13 with total page 114 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is intended for readers who are interested in the design of robust and reliable electronic digital systems. The authors cover emerging trends in design of today’s reliable electronic systems which are applicable to safety-critical applications, such as automotive or healthcare electronic systems. The emphasis is on modeling approaches and algorithms for analysis and mitigation of soft errors in nano-scale CMOS digital circuits, using techniques that are the cornerstone of Computer Aided Design (CAD) of reliable VLSI circuits. The authors introduce software tools for analysis and mitigation of soft errors in electronic systems, which can be integrated easily with design flows. In addition to discussing soft error aware analysis techniques for combinational logic, the authors also describe new soft error mitigation strategies targeting commercial digital circuits. Coverage includes novel Soft Error Rate (SER) analysis techniques such as process variation aware SER estimation and GPU accelerated SER analysis techniques, in addition to SER reduction methods such as gate sizing and logic restructuring based SER techniques.

Download or read book Integrated Circuit Quality and Reliability written by Eugene R. Hnatek and published by . This book was released on 1987 with total page 736 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examines all important aspects of integrated circuit design, fabrication, assembly and test processes as they relate to quality and reliability. This second edition discusses in detail: the latest circuit design technology trends; the sources of error in wafer fabrication and assembly; avenues of contamination; new IC packaging methods; new in-line process monitors and test structures; and more.;This work should be useful to electrical and electronics, quality and reliability, and industrial engineers; computer scientists; integrated circuit manufacturers; and upper-level undergraduate, graduate and continuing-education students in these disciplines.

Download or read book Reliability of Nanoscale Circuits and Systems written by Miloš Stanisavljević and published by Springer Science & Business Media. This book was released on 2010-10-20 with total page 215 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is intended to give a general overview of reliability, faults, fault models, nanotechnology, nanodevices, fault-tolerant architectures and reliability evaluation techniques. Additionally, the book provides an in depth state-of-the-art research results and methods for fault tolerance as well as the methodology for designing fault-tolerant systems out of highly unreliable components.

Download or read book Design of Systems and Circuits for Maximum Reliability Or Maximum Production Yield written by Peter W. Becker and published by McGraw-Hill Companies. This book was released on 1977 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Lifetime Reliability aware Design of Integrated Circuits written by Mohsen Raji and published by Springer Nature. This book was released on 2022-11-16 with total page 113 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the state-of-the-art research in design of modern electronic systems used in safety-critical applications such as medical devices, aircraft flight control, and automotive systems. The authors discuss lifetime reliability of digital systems, as well as an overview of the latest research in the field of reliability-aware design of integrated circuits. They address modeling approaches and techniques for evaluation and improvement of lifetime reliability for nano-scale CMOS digital circuits, as well as design algorithms that are the cornerstone of Computer Aided Design (CAD) of reliable VLSI circuits. In addition to developing lifetime reliability analysis and techniques for clocked storage elements (such as flip-flops), the authors also describe analysis and improvement strategies targeting commercial digital circuits.

Download or read book Design for Testability Debug and Reliability written by Sebastian Huhn and published by Springer Nature. This book was released on 2021-04-19 with total page 164 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces several novel approaches to pave the way for the next generation of integrated circuits, which can be successfully and reliably integrated, even in safety-critical applications. The authors describe new measures to address the rising challenges in the field of design for testability, debug, and reliability, as strictly required for state-of-the-art circuit designs. In particular, this book combines formal techniques, such as the Satisfiability (SAT) problem and the Bounded Model Checking (BMC), to address the arising challenges concerning the increase in test data volume, as well as test application time and the required reliability. All methods are discussed in detail and evaluated extensively, while considering industry-relevant benchmark candidates. All measures have been integrated into a common framework, which implements standardized software/hardware interfaces.

Download or read book Fundamentals of Electromigration Aware Integrated Circuit Design written by Jens Lienig and published by Springer. This book was released on 2018-02-23 with total page 159 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.

Download or read book Fundamentals of Digital Engineering written by R. Katz and published by BiblioGov. This book was released on 2013-08 with total page 66 pages. Available in PDF, EPUB and Kindle. Book excerpt: The concept of designing for reliability will be introduced along with a brief overview of reliability, redundancy and traditional methods of fault tolerance is presented, as applied to current logic devices. The fundamentals of advanced circuit design and analysis techniques will be the primary focus. The introduction will cover the definitions of key device parameters and how analysis is used to prove circuit correctness. Basic design techniques such as synchronous vs asynchronous design, metastable state resolution time/arbiter design, and finite state machine structure/implementation will be reviewed. Advanced topics will be explored such as skew-tolerant circuit design, the use of triple-modular redundancy and circuit hazards, device transients and preventative circuit design, lock-up states in finite state machines generated by logic synthesizers, device transient characteristics, radiation mitigation techniques. worst-case analysis, the use of timing analyzer and simulators, and others. Case studies and lessons learned from spaceflight designs will be given as examples.

Download or read book The Circuit Designer s Companion written by Tim Williams and published by Elsevier. This book was released on 2013-10-22 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Circuit Designer’s Companion covers the theoretical aspects and practices in analogue and digital circuit design. Electronic circuit design involves designing a circuit that will fulfill its specified function and designing the same circuit so that every production model of it will fulfill its specified function, and no other undesired and unspecified function. This book is composed of nine chapters and starts with a review of the concept of grounding, wiring, and printed circuits. The subsequent chapters deal with the passive and active components of circuitry design. These topics are followed by discussions of the principles of other design components, including linear integrated circuits, digital circuits, and power supplies. The remaining chapters consider the vital role of electromagnetic compatibility in circuit design. These chapters also look into safety, design of production, testability, reliability, and thermal management of the designed circuit. This book is of great value to electrical and design engineers.

Download or read book Design of Systems and Circuits for Maximum Reliability Or Maximum Production Yield written by Peter W. Becker and published by . This book was released on 1977 with total page 293 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Integrated Circuit Hybrid and Multichip Module Package Design Guidelines written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-03-31 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost * Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data * Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures * Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved * Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. of related interest... PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert Hannemann and Michael Pecht For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) pp. SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht This comprehensive, fundamentals first handbook outlines the soldering methods and techniques used in the manufacture of microelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes and classification; the material dynamics of heat soldering when assembling differing materials; wave and reflow soldering; controlling contamination during manufacturing cleanings; techniques for assuring reliability and quality control during manufacturing; rework, repair, and manual assembly; the modern assembly / repair station; and more. The book also provides clear guidelines on assembly techniques as well as an appendix of various solder equipment manufacturers. 1993 (0-471-59167-X) 312 pp.

Download or read book Practical Electronic Reliability Engineering written by Jerome Klion and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is intended for the engineer or engineering student with little or no prior background in reliability. Its purpose is to provide the background material and guidance necessary to comprehend and carry out all the tasks associated with a reliability program from specification generation to final demonstration of reliability achieved. Most available texts on reliability concentrate on the mathematics and statistics used for reliability analysis, evaluation, and demonstration. They are more often suited more for the professional with a heavier mathematical background that most engineers have, and more often than not, ignore or pay short-shrift to basic engineering design and organizational efforts associated with a reliability program. A reliability engineer must be familiar with both the mathematics and engineering aspects of a reliability program. This text: 1. Describes the mathematics needed for reliability analysis, evaluation, and demonstration commensurate with an engineer's background. 2. Provides background material, guidance, and references necessary to the structure and implementation of a reliability program including: • identification of the reliability standards in most common use • how to generate and respond to a reliability specification • how reliability can be increased • the tasks which make up a reliability program and how to judge the need and scope of each; how each is commonly performed; caution and comments about their application.

Download or read book Passive Components for Circuit Design written by Ian Sinclair and published by Elsevier. This book was released on 2000-11-20 with total page 305 pages. Available in PDF, EPUB and Kindle. Book excerpt: Passive Components for Circuit Design is a unique introduction to this key area of analog electronics designed for technician engineers and anyone involved in circuit design. The coverage encompasses all component types capable of power amplification: resistors, capacitors, transformers, solenoids, motors and transducers. The behaviour of the components is explored along with the different types available and the principles of circuit design. Tolerances, stability, variation with temperature, reliability and manufacturing standards are all covered. Reading this book will improve your skills in component selection and analog circuit design. These are essential skills not only for the analog designer, but for all circuit designers, professional or amateur. Gain a deeper understanding of using passive components Understand the range of components and their applications before designing and specifying Acquire a working knowledge with a minimum of maths

Download or read book Circuit Design Reliability Through Redundancy written by James R. Trew and published by . This book was released on 1960 with total page 31 pages. Available in PDF, EPUB and Kindle. Book excerpt: A compilation of abstracts.