Download or read book Chemical mechanical Polishing written by and published by . This book was released on 2001 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book ULSI Process Integration 6 written by C. Claeys and published by The Electrochemical Society. This book was released on 2009-09 with total page 547 pages. Available in PDF, EPUB and Kindle. Book excerpt: ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).

Download or read book Advances in Chemical Mechanical Planarization CMP written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP

Download or read book Role of Chemical Engineering in Processing of Minerals and Materials written by and published by Allied Publishers. This book was released on 2003 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Chemical Mechanical Planarization Volume 767 written by Duane S. Boning and published by . This book was released on 2003-08-27 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical-mechanical planarization (CMP) has emerged as a critical fabrication technology for advanced integrated circuits. Even as the applications of CMP have diversified and we have begun to understand aspects of the physics and chemistry of the process, a new generation of CMP innovations is unfolding. New slurries and consumables are under development. New applications to novel devices continue to appear. This book, the most recent in a successful series on CMP, offers a review of the advances to date and provides a comprehensive discussion of the future challenges that must be overcome. Presentations from academia, government labs and industry are featured. Topics include; CMP modeling; CMP science; CMP slurries and particles for planarization of copper, oxide, and other materials; planarization applications including shallow trench isolation (STI), copper damascene, and novel devices and CMP integration.

Download or read book Chemical Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2013-03-14 with total page 432 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Download or read book Microelectronic Applications of Chemical Mechanical Planarization written by Yuzhuo Li and published by John Wiley & Sons. This book was released on 2007-12-04 with total page 760 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Download or read book Integrated Modeling of Chemical Mechanical Planarization for Sub Micron IC Fabrication written by Jianfeng Luo and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.

Download or read book Ferroelectric Thin Films written by and published by . This book was released on 2000 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Materials Science and Technology of Optical Fabrication written by Tayyab I. Suratwala and published by John Wiley & Sons. This book was released on 2018-10-16 with total page 422 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covers the fundamental science of grinding and polishing by examining the chemical and mechanical interactions over many scale lengths Manufacturing next generation optics has been, and will continue to be, enablers for enhancing the performance of advanced laser, imaging, and spectroscopy systems. This book reexamines the age-old field of optical fabrication from a materials-science perspective, specifically the multiple, complex interactions between the workpiece (optic), slurry, and lap. It also describes novel characterization and fabrication techniques to improve and better understand the optical fabrication process, ultimately leading to higher quality optics with higher yield. Materials Science and Technology of Optical Fabrication is divided into two major parts. The first part describes the phenomena and corresponding process parameters affecting both the grinding and polishing processes during optical fabrication. It then relates them to the critical resulting properties of the optic (surface quality, surface figure, surface roughness, and material removal rate). The second part of the book covers a number of related topics including: developed forensic tools used to increase yield of optics with respect to surface quality (scratch/dig) and fracture loss; novel characterization and fabrication techniques used to understand/quantify the fundamental phenomena described in the first part of the book; novel and recent optical fabrication processes and their connection with the fundamental interactions; and finally, special techniques utilized to fabricate optics with high damage resistance. Focuses on the fundamentals of grinding and polishing, from a materials science viewpoint, by studying the chemical and mechanical interactions/phenomena over many scale lengths between the workpiece, slurry, and lap Explains how these phenomena affect the major characteristics of the optic workpiece—namely surface figure, surface quality, surface roughness, and material removal rate Describes methods to improve the major characteristics of the workpiece as well as improve process yield, such as through fractography and scratch forensics Covers novel characterization and fabrication techniques used to understand and quantify the fundamental phenomena of various aspects of the workpiece or fabrication process Details novel and recent optical fabrication processes and their connection with the fundamental interactions Materials Science and Technology of Optical Fabrication is an excellent guidebook for process engineers, fabrication engineers, manufacturing engineers, optical scientists, and opticians in the optical fabrication industry. It will also be helpful for students studying material science and applied optics/photonics.

Download or read book Dynamics in Small Confining Systems written by and published by . This book was released on 2000 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Influences of Interface and Dislocation Behavior on Microstructure Evolution Volume 652 written by Mark Aindow and published by . This book was released on 2001-08-20 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Download or read book Dynamics in Small Confining Systems V Volume 651 written by J. M. Drake and published by . This book was released on 2001-08-02 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Download or read book Solid Freeform and Additive Fabrication 2000 Volume 625 written by Stephen C. Danforth and published by Mrs Proceedings. This book was released on 2000-10-02 with total page 240 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Download or read book Surface Engineering 2002 Synthesis Characterization and Applications Volume 750 written by A. Kumar and published by . This book was released on 2003-06-02 with total page 648 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a forum for international and interdisciplinary discussion of phenomena where materials performance may be enhanced through engineered surfaces and interfaces. The materials science of hard and wear-resistant coatings, including nanostructured coatings, is a scientifically challenging problem with immediate technological applications in machine and machining tools, magnetic recording and other manufacturing industries. Hard coating systems designed for use in next-generation materials applications must achieve a combination of physical properties. The performance and reliability of MEMS devices strongly depend on the near-surface properties and many materials issues at the micro- and nanoscale remain to be resolved. This book reviews key aspects, discusses ongoing research and speculates on future trends. Topics include: nano- and micrometer-scale characterization and properties; synthesis and characterization of nanostructured materials; deposition, characterization and properties of films and coatings; industrial applications of surface engineering; atomistic and continuum modeling of materials properties; surface engineering issues for bio/microelectronics applications; and surface engineering issues in MEMS structures and devices.

Download or read book Book Review Index written by and published by . This book was released on 2003 with total page 1520 pages. Available in PDF, EPUB and Kindle. Book excerpt: Vols. 8-10 of the 1965-1984 master cumulation constitute a title index.

Download or read book Molecular Electronics Volume 582 written by Sokrates T. Pantelides and published by . This book was released on 2001-01-19 with total page 144 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.