Download or read book Characterization and Metrology for ULSI Technology 2003 written by David G. Seiler and published by American Institute of Physics. This book was released on 2003-10-08 with total page 868 pages. Available in PDF, EPUB and Kindle. Book excerpt: The worldwide semiconductor community faces increasingly difficult challenges as it moves into the manufacturing of chips with feature sizes approaching 100 nm and beyond. The magnitude of these challenges demands special attention from the metrology and analytical measurements community. New paradigms must be found. Adequate research and development for new metrology concepts are urgently needed. Topics include: integrated circuit history, challenges and overviews, front end, lithography, interconnect and back end, and critical analytical techniques. Characterization and metrology are key enablers for developing new semiconductor technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continue the advances in semiconductor technology. It covers major aspects of process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. The editors believe that this book of collected papers provides a concise and effective portrayal of industry characterization needs and the way they are being addressed by industry, academia, and government to continue the dramatic progress in semiconductor technology. Hopefully, it will also provide a basis for stimulating advances in metrology and new ideas for research and development.
Download or read book Characterization and Metrology for ULSI Technology 2000 written by David G. Seiler and published by . This book was released on 2001 with total page 734 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Characterization and Metrology for ULSI Technology 2000 written by David G. Seiler and published by American Institute of Physics. This book was released on 2001-03-01 with total page 708 pages. Available in PDF, EPUB and Kindle. Book excerpt: The worldwide semiconductor community faces increasingly difficult challenges as it moves into the manufacturing of chips with feature sizes approaching 100 nm. Some of the challenges are materials-related, such as transistors with high-k dielectrics and on-chip interconnects made from copper and low-k dielectrics. The magnitude of these challenges demands special attention from those in the metrology and analytical measurements community. Characterization and metrology are key enablers for developing semiconductor process technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continue the advances in semiconductor technology. It covers major aspects of the process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. It provides a concise and effective portrayal of industry characterization needs and some of the problems that must be addressed by industry, academia, and government to continue the dramatic progress in semiconductor technology. It also provides a basis for stimulating practical perspectives and new ideas for research and development.
Download or read book Characterization and Metrology for ULSI Technology 2005 written by David G. Seiler and published by American Institute of Physics. This book was released on 2005-09-29 with total page 714 pages. Available in PDF, EPUB and Kindle. Book excerpt: The worldwide semiconductor community faces increasingly difficult challenges in the era of silicon nanotechnology and beyond. The magnitude of these challenges demands special attention from the metrology and analytical measurements community. New paradigms must be found. Adequate research and development for new metrology concepts are urgently needed. Characterization and metrology are key enablers for developing new semiconductor technology and in improving manufacturing. This book summarizes major issues and gives critical reviews of important measurement techniques that are crucial to continuing the advances in semiconductor technology. It covers major aspects of process technology and most characterization techniques for silicon research, including development, manufacturing, and diagnostics. The book also covers emerging nano-devices and the corresponding metrology challenges that arise.
Download or read book Characterization and Metrology for ULSI Technology written by and published by . This book was released on 2005 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Characterization and Metrology for ULSI Technology 1998 International Conference 23 27 March 1998 written by D.G. Seiler and published by American Institute of Physics. This book was released on 1998-12-14 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proceedings of the 1998 International Conference on Characterization and Metrology for ULSI Technology was dedicated to summarizing major issues and giving critical reviews of important semiconductor techniques that are crucial to continue the advances in semiconductor technology. Characterization and metrology are key enablers for developing semiconductor process technology and in improving manufacturing. This is the only book that we know of that emphasizes the science and technology of semiconductor characterization in the factory environment. The increasing importance of monitoring and controlling semiconductor processes make it particularly timely.
Download or read book Characterization and Metrology for ULSI Technology written by and published by . This book was released on 1998 with total page 960 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book National Semiconductor Metrology Program written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book National Semiconductor Metrology Program NIST List OF Publications LP 103 May 2000 written by and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book NISTIR written by and published by . This book was released on 2001 with total page 62 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Istfa 2003 written by ASM International and published by ASM International. This book was released on 2003-01-01 with total page 534 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book NIST Special Publication written by and published by . This book was released on 2001 with total page 82 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Silicon Wafer Cleaning Technology written by Karen Reinhardt and published by William Andrew. This book was released on 2008-12-10 with total page 749 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process Editors are two of the top names in the field and are both extensively published Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol
Download or read book High Dielectric Constant Materials written by Howard Huff and published by Springer Science & Business Media. This book was released on 2005-11-02 with total page 723 pages. Available in PDF, EPUB and Kindle. Book excerpt: Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology.
Download or read book Semiconductor Material and Device Characterization written by Dieter K. Schroder and published by John Wiley & Sons. This book was released on 2015-06-29 with total page 800 pages. Available in PDF, EPUB and Kindle. Book excerpt: This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.
Download or read book Microelectronic Failure Analysis written by and published by ASM International. This book was released on 2002-01-01 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides new or expanded coverage on the latest techniques for microelectronic failure analysis. The CD-ROM includes the complete content of the book in fully searchable Adobe Acrobat format. Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee
Download or read book ULSI Process Integration II written by Cor L. Claeys and published by The Electrochemical Society. This book was released on 2001 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:
