Download or read book Interface Engineering of Capacitive Micromachined Ultrasonic Transducers for Medical Applications written by Der-Song Lin and published by Stanford University. This book was released on 2011 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt: Capacitive micromachined ultrasonic transducers (CMUTs), have been widely studied in academia and industry over the last decade. CMUTs provide many benefits over traditional piezoelectric transducers including improvement in performance through wide bandwidth, and ease of electronics integration, with the potential to batch fabricate very large 2D arrays with low-cost and high-yield. Though many aspects of CMUT technology have been studied over the years, packaging the CMUT into a fully practical system has not been thoroughly explored. Two important interfaces of packaging that this thesis explores are device encapsulation (the interface between CMUTs and patients) and full electronic integration of large scale 2D arrays (the interface between CMUTs and electronics). In the first part of the work, I investigate the requirements for the CMUT encapsulation. For medical usage, encapsulation is needed to electrically insulate the device, mechanically protect the device, and maintain transducer performance, especially the access of the ultrasound energy. While hermetic sealing can protect many other MEMS devices, CMUTs require mechanical interaction to a fluid, which makes fulfilling the previous criterion very challenging. The proposed solution is to use a viscoelastic material with the glass-transition-temperature lower than room temperature, such as Polydimethylsiloxane (PDMS), to preserve the CMUT static and dynamic performance. Experimental implementation of the encapsulated imaging CMUT arrays shows the device performance was maintained; 95 % of efficiency, 85% of the maximum output pressure, and 91% of the fractional bandwidth (FBW) can be preserved. A viscoelastic finite element model was also developed and shows the performance effects of the coating can be accurately predicted. Four designs, providing acoustic crosstalk suppression, flexible substrate, lens focusing, and blood flow monitoring using PDMS layer were also demonstrated. The second part of the work, presents contributions towards the electronic integration and packaging of large-area 2-D arrays. A very large 2D array is appealing for it can enable advanced novel imaging applications, such as a reconfigurable array, and a compression plate for breast cancer screening. With these goals in mind, I developed the first large-scale fully populated and integrated 2D CMUTs array with 32 by 192 elements. In this study, I demonstrate a flexible and reliable integration approach by successfully combining a simple UBM preparation technique and a CMUTs-interposer-ASICs sandwich design. The results show high shear strength of the UBM (26.5 g), 100% yield of the interconnections, and excellent CMUT resonance uniformity ([lowercase Sigma] = 0.02 MHz). As demonstrated, this allows for a large-scale assembly of a tile-able array by using an interposer. Interface engineering is crucial towards the development of CMUTs into a practical ultrasound system. With the advances in encapsulation technique with a viscoelastic polymer and the combination of the UBM technique to the TSV fabrication for electronics integration, a fully integrated CMUT system can be realized.

Download or read book Nanostructure Based Sensors for Gas Sensing from Devices to Systems written by Sabrina Grassini and published by MDPI. This book was released on 2019-10-29 with total page 86 pages. Available in PDF, EPUB and Kindle. Book excerpt: The development of solid state gas sensors based on microtransducers and nanostructured sensing materials is the key point in the design of portable measurement systems able to reach sensing and identification performance comparable with analytical ones. In such a context several efforts must be spent of course in the development of the sensing material, but also in the choice of the transducer mechanism and its structure, in the electrical characterization of the performance and in the design of suitable measurement setups. This call for papers invites researchers worldwide to report about their novel results on the most recent advances and overview in design and measurements for applications in gas sensors, along with their relevant features and technological aspects. Original research papers are welcome (but not limited) on all aspects that focus on the most recent advances in: (i) basic principles and modeling of gas and VOCs sensors; (ii) new gas sensor principles and technologies; (iii) Characterization and measurements methodologies; (iv) transduction and sampling systems; (vi) package optimization; (vi) gas sensor based systems and applications.

Download or read book 3D and Circuit Integration of MEMS written by Masayoshi Esashi and published by John Wiley & Sons. This book was released on 2021-03-16 with total page 528 pages. Available in PDF, EPUB and Kindle. Book excerpt: Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.

Download or read book MEMS Technology for Biomedical Imaging Applications written by Qifa Zhou and published by MDPI. This book was released on 2019-10-23 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt: Biomedical imaging is the key technique and process to create informative images of the human body or other organic structures for clinical purposes or medical science. Micro-electro-mechanical systems (MEMS) technology has demonstrated enormous potential in biomedical imaging applications due to its outstanding advantages of, for instance, miniaturization, high speed, higher resolution, and convenience of batch fabrication. There are many advancements and breakthroughs developing in the academic community, and there are a few challenges raised accordingly upon the designs, structures, fabrication, integration, and applications of MEMS for all kinds of biomedical imaging. This Special Issue aims to collate and showcase research papers, short commutations, perspectives, and insightful review articles from esteemed colleagues that demonstrate: (1) original works on the topic of MEMS components or devices based on various kinds of mechanisms for biomedical imaging; and (2) new developments and potentials of applying MEMS technology of any kind in biomedical imaging. The objective of this special session is to provide insightful information regarding the technological advancements for the researchers in the community.

Download or read book Computational Science and Engineering written by Arpan Deyasi and published by CRC Press. This book was released on 2016-12-19 with total page 355 pages. Available in PDF, EPUB and Kindle. Book excerpt: Computational Science and Engineering contains peer-reviewed research presented at the International Conference on Computational Science and Engineering (RCC Institute of Information Technology, Kolkata, India, 4-6 October 2016). The contributions cover a wide range of topics: - electronic devices - photonics - electromagnetics - soft computing - artificial intelligence - modern communication systems Focussing on strong theoretical and methodological approaches and applications, Computational Science and Engineering will be of interest to academia and professionals involved or interested in the above mentioned domains.

Download or read book Acoustical Imaging written by Walter Arnold and published by Springer Science & Business Media. This book was released on 2004-09-16 with total page 802 pages. Available in PDF, EPUB and Kindle. Book excerpt: Acoustical imaging has become an indispensable tool in a variety of fields. Since its introduction, the applications have grown and cover a variety of techniques, producing significant results in fields as disparate as medicine and seismology. Cutting-edge trends continue to be discussed worldwide. This book contains the proceedings of the 27th International Symposium on Acoustical Imaging (AI27), which took place in Saarbrücken, Germany, from March 24th to March 27th 2003. The Symposium belongs to a conference series in existence since 1968. AI27 comprised sessions on: Medical Imaging, Non-Destructive Testing, Seismic Imaging, Physics and Mathematics of Acoustical Imaging, Acoustic Microscopy. During two well-attended workshops the applications of quantitative acoustical imaging in biology and medical applications, and in near-field imaging of materials, were discussed. Based on its cross-disciplinary aspects, the authors of the papers of AI27 present experiments, theory and construction of new instruments.

Download or read book Mems Nems written by Cornelius T. Leondes and published by Springer Science & Business Media. This book was released on 2007-10-08 with total page 2142 pages. Available in PDF, EPUB and Kindle. Book excerpt: This significant and uniquely comprehensive five-volume reference is a valuable source for research workers, practitioners, computer scientists, students, and technologists. It covers all of the major topics within the subject and offers a comprehensive treatment of MEMS design, fabrication techniques, and manufacturing methods. It also includes current medical applications of MEMS technology and provides applications of MEMS to opto-electronic devices. It is clearly written, self-contained, and accessible, with helpful standard features including an introduction, summary, extensive figures and design examples with comprehensive reference lists.

Download or read book Advances in Glass Science and Technology written by Vincenzo Maria Sglavo and published by BoD – Books on Demand. This book was released on 2018-06-06 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt: In this book, some recent advances in glass science and technology are collected. In the first part, the structure and crystallization of innovative glass compositions are analysed. In the second part, innovative applications are described from the use of glass in optical devices and lasers to fibres in composites, micropatterned components in sensors and microdevices, beads in building walls and sealing in solid oxide fuel cells.

Download or read book Electroceramic Based MEMS written by Nava Setter and published by Springer Science & Business Media. This book was released on 2006-03-30 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book is focused on the use of functional oxide and nitride films to enlarge the application range of MEMS (microelectromechanical systems), including micro-sensors, micro-actuators, transducers, and electronic components for microwaves and optical communications systems. Applications, emerging applications, fabrication technology and functioning issues are presented and discussed. The book covers the following topics: Part A: Applications and devices with electroceramic-based MEMS: Chemical microsensors Microactuators based on thin films Micromachined ultrasonic transducers Thick-film piezoelectric and magnetostrictive devices Pyroelectric microsystems RF bulk acoustic wave resonators and filters High frequency tunable devices MEMS for optical functionality Part B: Materials, fabrication technology, and functionality: Ceramic thick films for MEMS Piezoelectric thin films for MEMS Materials and technology in thin films for tunable high frequency devices Permittivity, tunability and loss in ferroelectrics for reconfigurable high frequency electronics Microfabrication of piezoelectric MEMS Nano patterning methods for electroceramics Soft lithography emerging techniques The book is addressed to engineers, scientists and researchers of various disciplines, device engineers, materials engineers, chemists, physicists and microtechnologists who are working and/or interested in this fast growing and highly promising field. The publication of this book follows a Special Issue on electroceramic-based MEMS that was published in the Journal of Electroceramics at the beginning of 2004. The ten invited papers of that special issue were adapted by the authors into chapters of the present book and five additional chapters were added.

Download or read book Medical Imaging written by Krzysztof Iniewski and published by John Wiley & Sons. This book was released on 2009-02-18 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: A must-read for anyone working in electronics in the healthcare sector This one-of-a-kind book addresses state-of-the-art integrated circuit design in the context of medical imaging of the human body. It explores new opportunities in ultrasound, computed tomography (CT), magnetic resonance imaging (MRI), nuclear medicine (PET, SPECT), emerging detector technologies, circuit design techniques, new materials, and innovative system approaches. Divided into four clear parts and with contributions from a panel of international experts, Medical Imaging systematically covers: X-ray imaging and computed tomography–X-ray and CT imaging principles; Active Matrix Flat Panel Imagers (AMFPI) for diagnostic medical imaging applications; photon counting and integrating readout circuits; noise coupling in digital X-ray imaging Nuclear medicine–SPECT and PET imaging principles; low-noise electronics for radiation sensors Ultrasound imaging–Electronics for diagnostic ultrasonic imaging Magnetic resonance imaging–Magnetic resonance imaging principles; MRI technology

Download or read book Medical Imaging written by and published by . This book was released on 2005 with total page 766 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book MOEMS Display and Imaging Systems written by Hakan Urey and published by SPIE-International Society for Optical Engineering. This book was released on 2003 with total page 356 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Mems Packaging written by Yung-cheng Lee and published by World Scientific. This book was released on 2018-01-03 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.

Download or read book Nanomedical Device and Systems Design written by Frank Boehm and published by CRC Press. This book was released on 2016-04-19 with total page 746 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanomedical Device and Systems Design: Challenges, Possibilities, Visions serves as a preliminary guide toward the inspiration of specific investigative pathways that may lead to meaningful discourse and significant advances in nanomedicine/nanotechnology. This volume considers the potential of future innovations that will involve nanomedical devic

Download or read book IoT Sensors written by Vinod Kumar Khanna and published by CRC Press. This book was released on 2024-11-29 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces the basics of the Internet of Things (IoT) and explores the foundational role of sensors in IoT applications. The IoT is a network of devices and objects: sensors, actuators, hardware, software, human beings, domestic appliances, health monitoring equipment, and other things connected to the internet, which is designed to operate in a coordinated fashion to receive, process, and interpret signals and take appropriate action. It provides a seamless real-time interface between the physical and digital worlds by integrating sensors with networking, computation, and actuation facilities. This book sketches a perspective of the IoT with sensors as the focus of attention. Diverse applications of the IoT that are destined to make an impact on our everyday lives in the near future are discussed. It presents a comprehensive overview of the most recent sensor technologies used in the IoT to keep the reader abreast of the current advances at the frontiers of knowledge. The book will cater to student and professional audiences, and will be useful for postgraduate and Ph.D. students studying physics, engineering, and computer science as well as researchers, engineers, and industrial workers engaged in this fast-progressing field. Key Features: • Explains the basic concepts and important terms of ‘Internet of Things’ in simple language • Provides an up-to-date coverage of the key sensors used in IoT applications • Explores IoT applications in smart cities, smart agriculture, smart factory, and many more

Download or read book Sensors and Microsystems written by G. Di Francia and published by Springer Nature. This book was released on 2020-02-21 with total page 411 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book showcases the state of the art in the field of sensors and microsystems, revealing the impressive potential of novel methodologies and technologies. It covers a broad range of aspects, including: bio-, physical and chemical sensors; actuators; micro- and nano-structured materials; mechanisms of interaction and signal transduction; polymers and biomaterials; sensor electronics and instrumentation; analytical microsystems, recognition systems and signal analysis; and sensor networks, as well as manufacturing technologies, environmental, food and biomedical applications. The book gathers a selection of papers presented at the 20th AISEM National Conference on Sensors and Microsystems, held in Naples, Italy in February 2019, the event brought together researchers, end users, technology teams and policy makers.

Download or read book Ultrasonic Transducers written by K Nakamura and published by Elsevier. This book was released on 2012-08-23 with total page 749 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ultrasonic transducers are key components in sensors for distance, flow and level measurement as well as in power, biomedical and other applications of ultrasound. Ultrasonic transducers reviews recent research in the design and application of this important technology.Part one provides an overview of materials and design of ultrasonic transducers. Piezoelectricity and basic configurations are explored in depth, along with electromagnetic acoustic transducers, and the use of ceramics, thin film and single crystals in ultrasonic transducers. Part two goes on to investigate modelling and characterisation, with performance modelling, electrical evaluation, laser Doppler vibrometry and optical visualisation all considered in detail. Applications of ultrasonic transducers are the focus of part three, beginning with a review of surface acoustic wave devices and air-borne ultrasound transducers, and going on to consider ultrasonic transducers for use at high temperature and in flaw detection systems, power, biomedical and micro-scale ultrasonics, therapeutic ultrasound devices, piezoelectric and fibre optic hydrophones, and ultrasonic motors are also described.With its distinguished editor and expert team of international contributors,Ultrasonic transducers is an authoritative review of key developments for engineers and materials scientists involved in this area of technology as well as in its applications in sectors as diverse as electronics, wireless communication and medical diagnostics. - Reviews recent research in the design and application of ultrasonic transducers - Provides an overview of the materials and design of ultrasonic transducers, with an in-depth exploration of piezoelectricity and basic configurations - Investigates modelling and characterisation, applications of ultrasonic transducers, and ultrasonic transducers for use at high temperature and in flaw detection systems