Download or read book Advances in Microelectronics Reviews Vol 2 written by Sergey Yurish and published by Lulu.com. This book was released on 2019-02-07 with total page 516 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 2nd volume of 'Advances in Microelectronics: Reviews' Book Series is written by 57 contributors from academy and industry from 11 countries (Bulgaria, Hungary, Iran, Japan, Malaysia, Romania, Russia, Slovak Republic, Spain, Ukraine and USA). The book contains 13 chapters from different areas of microelectronics: MEMS, materials characterization, and various microelectronic devices. With unique combination of information in each volume, the Book Series will be of value for scientists and engineers in industry and at universities. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.

Download or read book Advances in Microelectronics Reviews Vol 1 written by Sergey Yurish and published by Lulu.com. This book was released on 2017-12-24 with total page 536 pages. Available in PDF, EPUB and Kindle. Book excerpt: The 1st volume of 'Advances in Microelectronics: Reviews' Book Series contains 19 chapters written by 72 authors from academia and industry from 16 countries. With unique combination of information in each volume, the 'Advances in Microelectronics: Reviews' Book Series will be of value for scientists and engineers in industry and at universities. In order to offer a fast and easy reading of the state of the art of each topic, every chapter in this book is independent and self-contained. All chapters have the same structure: first an introduction to specific topic under study; second particular field description including sensing applications. Each of chapter is ending by well selected list of references with books, journals, conference proceedings and web sites. This book ensures that readers will stay at the cutting edge of the field and get the right and effective start point and road map for the further researches and developments.

Download or read book Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices written by Ephraim Suhir and published by CRC Press. This book was released on 2021-01-28 with total page 344 pages. Available in PDF, EPUB and Kindle. Book excerpt: Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. Describes how to use the developed methods of analytical predictive modeling to minimize thermal stresses and strains in solder joint of IC devices Shows how to build the preprocessing models in finite-element analyses (FEA) by comparing the FEA and analytical data Covers how to design the most effective test vehicles for testing solder joints Details how to design and organize, in addition to or sometimes even instead of highly accelerated life tests (HALT), highly focused and highly cost-effective failure oriented accelerated testing (FOAT) to understand the physic of failure of solder joint interconnections Outlines how to convert the low cycle fatigue conditions into elastic fatigue conditions and to assess the fatigue lifetime in such cases Illustrates ways to replace time- and labor-consuming, expensive, and possibly misleading temperature cycling tests with simpler and physically meaningful accelerated tests This book is aimed towards professionals in electronic and photonic packaging, electronic and optical materials, materials engineering, and mechanical design.

Download or read book Advanced Computing and Systems for Security written by Rituparna Chaki and published by Springer. This book was released on 2018-05-10 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains extended version of selected works that have been discussed and presented in the fourth International Doctoral Symposium on Applied Computation and Security Systems (ACSS 2017) held in Patna, India during March 17-19, 2017. The symposium was organized by the Departments of Computer Science & Engineering and A. K. Choudhury School of Information Technology, both from University of Calcutta in collaboration with NIT, Patna. The International partners for ACSS 2016 had been Ca Foscari University of Venice, Italy and Bialystok University of Technology, Poland. This bi-volume book has a total of 21 papers divided in 7 chapters. The chapters reflect the sessions in which the works have been discussed during the symposium. The different chapters in the book include works on biometrics, image processing, pattern recognition, algorithms, cloud computing, wireless sensor networks and security systems.

Download or read book Chemistry in Microelectronics written by Yannick Le Tiec and published by John Wiley & Sons. This book was released on 2013-02-28 with total page 261 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronics is a complex world where many sciences need to collaborate to create nano-objects: we need expertise in electronics, microelectronics, physics, optics and mechanics also crossing into chemistry, electrochemistry, as well as biology, biochemistry and medicine. Chemistry is involved in many fields from materials, chemicals, gases, liquids or salts, the basics of reactions and equilibrium, to the optimized cleaning of surfaces and selective etching of specific layers. In addition, over recent decades, the size of the transistors has been drastically reduced while the functionality of circuits has increased. This book consists of five chapters covering the chemicals and sequences used in processing, from cleaning to etching, the role and impact of their purity, along with the materials used in “Front End Of the Line” which corresponds to the heart and performance of individual transistors, then moving on to the “Back End Of the Line” which is related to the interconnection of all the transistors. Finally, the need for specific functionalization also requires key knowledge on surface treatments and chemical management to allow new applications. Contents 1. Chemistry in the “Front End of the Line” (FEOL): Deposits, Gate Stacks, Epitaxy and Contacts, François Martin, Jean-Michel Hartmann, Véronique Carron and Yannick Le Tiec. 2. Chemistry in Interconnects, Vincent Jousseaume, Paul-Henri Haumesser, Carole Pernel, Jeffery Butterbaugh, Sylvain Maîtrejean and Didier Louis. 3. The Chemistry of Wet Surface Preparation: Cleaning, Etching and Drying, Yannick Le Tiec and Martin Knotter. 4. The Use and Management of Chemical Fluids in Microelectronics, Christiane Gottschalk, Kevin Mclaughlin, Julie Cren, Catherine Peyne and Patrick Valenti. 5. Surface Functionalization for Micro- and Nanosystems: Application to Biosensors, Antoine Hoang, Gilles Marchand, Guillaume Nonglaton, Isabelle Texier-Nogues and Francoise Vinet. About the Authors Yannick Le Tiec is a technical expert at CEA-Leti, Minatec since 2002. He is a CEA-Leti assignee at IBM, Albany (NY) to develop the advanced 14 nm CMOS node and the FDSOI technology. He held different technical positions from the advanced 300 mm SOI CMOS pilot line to different assignments within SOITEC for advanced wafer development and later within INES to optimize solar cell ramp-up and yield. He has been part of the ITRS Front End technical working group at ITRS since 2008.

Download or read book Dielectric Films for Advanced Microelectronics written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2007-04-04 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.

Download or read book Cooling Of Microelectronic And Nanoelectronic Equipment Advances And Emerging Research written by Madhusudan Iyengar and published by World Scientific. This book was released on 2014-08-25 with total page 471 pages. Available in PDF, EPUB and Kindle. Book excerpt: To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting.This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

Download or read book STI Review Volume 1998 Issue 2 Special Issue on Public Private Partnerships in Science and Technology written by OECD and published by OECD Publishing. This book was released on 1999-02-09 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt: This special issue of the STI Review focuses on Public-Private Partnerships in Science and Technology.

Download or read book New Developments in Liquid Crystals written by Georgiy Tkachenko and published by BoD – Books on Demand. This book was released on 2009-11-01 with total page 246 pages. Available in PDF, EPUB and Kindle. Book excerpt: Liquid crystal technology is a subject of many advanced areas of science and engineering. It is commonly associated with liquid crystal displays applied in calculators, watches, mobile phones, digital cameras, monitors etc. But nowadays liquid crystals find more and more use in photonics, telecommunications, medicine and other fields. The goal of this book is to show the increasing importance of liquid crystals in industrial and scientific applications and inspire future research and engineering ideas in students, young researchers and practitioners.

Download or read book Technical Change and Economic Growth written by George M. Korres and published by Routledge. This book was released on 2016-12-05 with total page 289 pages. Available in PDF, EPUB and Kindle. Book excerpt: Technological change is not only a determinant of growth but is also a pivotal factor in international competition and the modernization of an economy. In one of the most in-depth and detailed studies of its kind, George Korres analyzes the macroeconomic and the microeconomic factors influencing the economics of innovation and the economic relations between technology, innovation, knowledge and productivity. In particular, this book examines both the theoretical framework and the applications for empirical results. This second edition contributes updated figures and estimations for technical change from EU member states and features new subjects, including growth models, productivity models, production function models and non-parametric models. In one of the most in-depth and detailed studies of its kind, this book captures all the existing contemporary techniques in the theoretical fields as well as the empirical applications of the models.

Download or read book Progress in Adhesion and Adhesives written by K. L. Mittal and published by John Wiley & Sons. This book was released on 2015-07-27 with total page 466 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is based on the 13 review articles written by subject experts and published in 2014 in the Journal Reviews of Adhesion and Adhesives. The rationale for publication of this book is that currently the RAA has limited circulation, so this book provides broad exposure and dissemination of the concise, critical, illuminating, and thought-provoking review articles. The subjects of the reviews fall into 4 general areas: 1. Polymer surface modification 2. Biomedical, pharmaceutical and dental fields 3. Adhesives and adhesive joints 4. General Adhesion Aspects The topics covered include: Adhesion of condensed bodies at microscale; imparting adhesion property to silicone material; functionally graded adhesively bonded joints; synthetic adhesives for wood panels; adhesion theories in wood adhesive bonding; adhesion and surface issues in biocomposites and bionanocomposites; adhesion phenomena in pharmaceutical products and applications of AFM; cyanoacrylate adhesives in surgical applications; ways to generate monosort functionalized polyolefin surfaces; nano-enhanced adhesives; bonding dissimilar materials in dentistry; flame treatment of polymeric materials—relevance to adhesion; and mucoadhesive polymers for enhancing retention of ocular drug delivery.

Download or read book Advanced Electronic Packaging written by Richard K. Ulrich and published by John Wiley & Sons. This book was released on 2006-02-24 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt: As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Download or read book Fiftieth Anniversary 1912 1962 written by Institute of Radio Engineers and published by . This book was released on 1962 with total page 1190 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Internal Standardization and Calibration Architectures for Chemical Sensors written by Ronald E. Shaffer and published by SPIE-International Society for Optical Engineering. This book was released on 1999 with total page 348 pages. Available in PDF, EPUB and Kindle. Book excerpt: This work brings together a selection of papers dealing with various aspects of internal standardization and calibration architectures for chemical sensors.

Download or read book Current Advancements in Stereo Vision written by Asim Bhatti and published by BoD – Books on Demand. This book was released on 2012-07-11 with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book is a new edition of stereo vision book series of INTECH Open Access Publisher and it presents diverse range of ideas and applications highlighting current research/technology trends and advances in the field of stereo vision. The topics covered in this book include fundamental theoretical aspects of robust stereo correspondence estimation, novel and robust algorithms, hardware implementation for fast execution and applications in wide range of disciplines. Particularly interesting approaches include neuromorphic engineering, probabilistic analysis and anisotropic reaction diffusion addressing the problem of stereo correspondence and the applications in mobile robotics for autonomous terrain mapping and navigation. SterCentre for Intelligent Systems Research (CISR), Institute of Technology, Research and Innovation (ITRI),eo algorithm with anisotropic reaction-diffusion systems utilizing biologically motivated reaction-diffusion systems with anisotropic diffusion coefficients makes it an interesting addition to the book.

Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Download or read book Review written by and published by . This book was released on 1990 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: