Download or read book Advances in CMP Polishing Technologies written by Toshiro Doi and published by William Andrew. This book was released on 2011-12-06 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Download or read book Advances in Chemical Mechanical Planarization CMP written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP

Download or read book Chemical Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2004-01-26 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Download or read book Advances in Abrasive Based Machining and Finishing Processes written by S. Das and published by Springer Nature. This book was released on 2020-05-10 with total page 282 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the advances in abrasive based machining and finishing in broad sense. Specifically, the book covers the novel machining and finishing strategies implemented in various advanced machining processes for improving machining accuracy and overall quality of the product. This book presents the capability of advanced machining processes using abrasive grain. It also covers ways for enhancing the production rate as well as quality. It fulfills the gap between the production of any complicated components and successful machining with abrasive particles.

Download or read book Chemical Mechanical Planarization of Microelectronic Materials written by Joseph M. Steigerwald and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

Download or read book Semiconductor Manufacturing Handbook written by Hwaiyu Geng and published by McGraw Hill Professional. This book was released on 2005-05-18 with total page 915 pages. Available in PDF, EPUB and Kindle. Book excerpt: WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged with optimizing the design and performance of manufacturing processes will find all the information necessary to produce the highest quality chips at the lowest price in the shortest time possible. The Semiconductor Manufacturing Handbook provides leading-edge information on semiconductor wafer processes, MEMS, nanotechnology, and FPD, plus the latest manufacturing and automation technologies, including: Yield Management Automated Material Handling System Fab and Cleanroom Design and Operation Gas Abatement and Waste Treatment Management And much more Written by 60 international experts, and peer reviewed by a seasoned advisory board, this handbook covers the fundamentals of relevant technology and its real-life application and operational considerations for planning, implementing, and controlling manufacturing processes. It includes hundreds of detailed illustrations and a list of relevant books, technical papers, and websites for further research. This inclusive, wide-ranging coverage makes the Semiconductor Manufacturing Handbook the most comprehensive single-volume reference ever published in the field. STATE-OF-THE-ART SEMICONDUCTOR TECHNOLOGIES AND MANUFACTURING PROCESSES: SEMICONDUCTOR FUNDAMENTALS How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask WAFER PROCESSING TECHNOLOGIES Microlithography * Ion Implantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning FINAL MANUFACTURING Packaging * Grinding, Stress Relief, Dicing * Inspection, Measurement, and Testing NANOTECHNOLOGY, MEMS, AND FPD GAS AND CHEMICALS Specialty Gas System and DCA * Gas Abatement Systems * Chemical and Slurries Delivery System * Ultra Pure Water FAB YIELD, OPERATIONS, AND FACILITIES Yield Management * Automated Materials Handling System * Metrology * Six Sigma * Advanced Process Control * EHS * Fab Design and Construction * Cleanroom * Vibration and Acoustic Control * ESD * Airborne Molecular Control * Particle Monitoring * Wastewater Neutralization Systems

Download or read book Handbook of Lapping and Polishing written by Ioan D. Marinescu and published by CRC Press. This book was released on 2006-11-20 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lapping and polishing are currently the most precise surface finishing processes for mechanical and electronic components. Unfortunately, most improvements in either methods or understanding of the physical processes involved are closely guarded as proprietary information. The Handbook of Lapping and Polishing is the first source in English to brin

Download or read book Integrated Modeling of Chemical Mechanical Planarization for Sub Micron IC Fabrication written by Jianfeng Luo and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.

Download or read book Handbook of Manufacturing Engineering and Technology written by Andrew Y. C. Nee and published by Springer. This book was released on 2014-10-31 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Springer Reference Work Handbook of Manufacturing Engineering and Technology provides overviews and in-depth and authoritative analyses on the basic and cutting-edge manufacturing technologies and sciences across a broad spectrum of areas. These topics are commonly encountered in industries as well as in academia. Manufacturing engineering curricula across universities are now essential topics covered in major universities worldwide.

Download or read book Polishing of Diamond Materials written by Yiqing Chen and published by Springer Science & Business Media. This book was released on 2013-02-13 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: Diamond has a unique combination of properties, such as the highest hardness and thermal conductivity among any known material, high electrical resistivity, a large optical band gap and a high transmission, good resistance to chemical erosion, low adhesion and friction, and extremely low thermal expansion coefficient. As such, diamond has been a desirable material in a wide range of applications in mechanical, chemical, optical, thermal and electrical engineering. In many of the cases, the surface of a diamond component or element must have a superior finish, often down to a surface roughness of nanometers. Nevertheless, due to its extreme hardness and chemical inertness, the polishing of diamond and its composites has been a sophisticated process. Polishing of Diamond Materials will provide a state-of-the-art analysis, both theoretically and experimentally, of the most commonly used polishing techniques for mono/poly-crystalline diamond and chemical vapour deposition (CVD) diamond films, including mechanical, chemo-mechanical, thermo-chemical, high energy beam, dynamic friction and other polishing techniques. The in-depth discussions will be on the polishing mechanisms, possible modelling, material removal rate and the quality control of these techniques. A comparison of their advantages and drawbacks will be carried out to provide the reader with a useful guideline for the selection and implementation of these polishing techniques. Polishing of Diamond Materials will be of interest to researchers and engineers in hard materials and precision manufacturing, industry diamond suppliers, diamond jewellery suppliers and postgraduate students in the area of precision manufacturing.

Download or read book Semiconductor Manufacturing Technology written by Chue San Yoo and published by World Scientific. This book was released on 2008 with total page 483 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook contains all the materials that an engineer needs to know to start a career in the semiconductor industry. It also provides readers with essential background information for semiconductor research. It is written by a professional who has been working in the field for over two decades and teaching the material to university students for the past 15 years. It includes process knowledge from raw material preparation to the passivation of chips in a modular format.

Download or read book Tribocorrosion of Passive Metals and Coatings written by D Landolt and published by Elsevier. This book was released on 2011-10-12 with total page 585 pages. Available in PDF, EPUB and Kindle. Book excerpt: Tribocorrosion causes the degradation or alteration of materials through the combined action of corrosion and wear. It limits the performance and life-time of installations, machines and devices with moving parts, and controls certain manufacturing processes such as chemical–mechanical polishing. The effects of tribocorrosion are most pronounced on passive metals which owe their corrosion resistance to a thin protecting oxide film. Most corrosion-resistant engineering alloys belong to this category.This book provides an introduction to the developing field of tribocorrosion and an overview of the latest research. Part one reviews basic notions of corrosion and tribology, before presenting the most recent results on the growth and structure of passive oxide films. Tribocorrosion mechanisms under fretting, sliding and erosion conditions, respectively, are then discussed. Part two focuses on methods for measuring and preventing tribocorrosion. It includes chapters on electrochemical techniques, the design of tribocorrosion test equipment, data evaluation and the optimisation of materials' properties for tribocorrosion systems. Part three presents a selection of tribocorrosion problems in engineering and medicine. Three chapters address the tribocorrosion of medical implants including test methods and clinical implications. Other chapters examine tribocorrosion issues in nuclear power plants, marine environments, automotive cooling circuits, elevated-temperature metal working and chemical–mechanical polishing.With its distinguished editors and international team of expert contributors Tribocorrosion of passive metals and coatings is an invaluable reference tool for engineers and researchers in industry and academia confronted with tribocorrosion problems. - Comprehensively reviews current research on the tribocorrosion of passive metals and coatings, with particular reference to the design of tribocorrosion test equipment, data evaluation and the optimisation of materials' properties for tribocorrosion systems - Chapters discuss tribocorrosion mechanisms under fretting, sliding and erosion conditions before focussing on methods for measuring and preventing tribocorrosion - Includes a comprehensive selection of tribocorrosion problems in engineering and medicine, such as the tribocorrosion of medical implants, and tribocorrosion issues in nuclear power plants, marine environments, automotive cooling circuits and elevated-temperature metal working

Download or read book Introduction to Microfabrication written by Sami Franssila and published by John Wiley & Sons. This book was released on 2005-01-28 with total page 424 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microfabrication is the key technology behind integrated circuits,microsensors, photonic crystals, ink jet printers, solar cells andflat panel displays. Microsystems can be complex, but the basicmicrostructures and processes of microfabrication are fairlysimple. Introduction to Microfabrication shows how the commonmicrofabrication concepts can be applied over and over again tocreate devices with a wide variety of structures andfunctions. Featuring: * A comprehensive presentation of basic fabrication processes * An emphasis on materials and microstructures, rather than devicephysics * In-depth discussion on process integration showing how processes,materials and devices interact * A wealth of examples of both conceptual and real devices Introduction to Microfabrication includes 250 homework problems forstudents to familiarise themselves with micro-scale materials,dimensions, measurements, costs and scaling trends. Both researchand manufacturing topics are covered, with an emphasis on silicon,which is the workhorse of microfabrication. This book will serve as an excellent first text for electricalengineers, chemists, physicists and materials scientists who wishto learn about microstructures and microfabrication techniques,whether in MEMS, microelectronics or emerging applications.

Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

Download or read book Microelectronic Applications of Chemical Mechanical Planarization written by Yuzhuo Li and published by John Wiley & Sons. This book was released on 2007-10-19 with total page 764 pages. Available in PDF, EPUB and Kindle. Book excerpt: An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Download or read book Introduction to Semiconductor Manufacturing Technology written by Hong Xiao and published by . This book was released on 2001 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: For courses in Semiconductor Manufacturing Technology, IC Fabrication Technology, and Devices: Conventional Flow. This up-to-date text on semiconductor manufacturing processes takes into consideration the rapid development of the industry's technology. It thoroughly describes the complicated and new IC chip fabrication processes in detail with minimum mathematics, physics, and chemistry. Advanced technologies are covered along with older ones to assist students in understanding the development processes from a historic point of view.

Download or read book Atomic Layer Deposition for Semiconductors written by Cheol Seong Hwang and published by Springer Science & Business Media. This book was released on 2013-10-18 with total page 266 pages. Available in PDF, EPUB and Kindle. Book excerpt: Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.