Download or read book Advanced Test Methods for SRAMs written by Alberto Bosio and published by Springer Science & Business Media. This book was released on 2009-10-08 with total page 179 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern electronics depend on nanoscaled technologies that present new challenges in terms of testing and diagnostics. Memories are particularly prone to defects since they exploit the technology limits to get the highest density. This book is an invaluable guide to the testing and diagnostics of the latest generation of SRAM, one of the most widely applied types of memory. Classical methods for testing memory are designed to handle the so-called "static faults," but these test solutions are not sufficient for faults that are emerging in the latest Very Deep Sub-Micron (VDSM) technologies. These new fault models, referred to as "dynamic faults", are not covered by classical test solutions and require the dedicated test sequences presented in this book.

Download or read book ISTFA 2017 Proceedings from the 43rd International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2017-12-01 with total page 666 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.

Download or read book Microelectronics Failure Analysis written by and published by ASM International. This book was released on 2004-01-01 with total page 813 pages. Available in PDF, EPUB and Kindle. Book excerpt: For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the work of expert contributors who rallied to the job in response to a committee's call for help (the committee was assigned to the update by the Electron

Download or read book Aeronautics and Space Report of the President written by United States. President and published by . This book was released on 1990 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Aeronautics and Space Report of the President Activities written by United States. President and published by . This book was released on 1990 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Direct Copper Interconnection for Advanced Semiconductor Technology written by Dongkai Shangguan and published by CRC Press. This book was released on 2024-06-28 with total page 549 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general.

Download or read book Silicon Systems For Wireless Lan written by Zoran Stamenkovic and published by World Scientific. This book was released on 2020-11-27 with total page 430 pages. Available in PDF, EPUB and Kindle. Book excerpt: Today's integrated silicon circuits and systems for wireless communications are of a huge complexity.This unique compendium covers all the steps (from the system-level to the transistor-level) necessary to design, model, verify, implement, and test a silicon system. It bridges the gap between the system-world and the transistor-world (between communication, system, circuit, device, and test engineers).It is extremely important nowadays (and will be more important in the future) for communication, system, and circuit engineers to understand the physical implications of system and circuit solutions based on hardware/software co-design as well as for device and test engineers to cope with the system and circuit requirements in terms of power, speed, and data throughput.Related Link(s)

Download or read book Advances in Smart Grid Technology written by Pierluigi Siano and published by Springer Nature. This book was released on 2020-09-22 with total page 531 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book comprises the select proceedings of the International Conference on Power Engineering Computing and Control (PECCON) 2019. This volume focuses on the different renewable energy sources which are integrated in a smart grid and their operation both in the grid connected mode and islanded mode. The contents highlight the role of power converters in the smart grid environment, battery management, electric vehicular technology and electric charging station as a load for the power network. This book can be useful for beginners, researchers as well as professionals interested in the area of smart grid technology.

Download or read book Nanoscale Semiconductor Memories written by Santosh K. Kurinec and published by CRC Press. This book was released on 2017-07-28 with total page 448 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nanoscale memories are used everywhere. From your iPhone to a supercomputer, every electronic device contains at least one such type. With coverage of current and prototypical technologies, Nanoscale Semiconductor Memories: Technology and Applications presents the latest research in the field of nanoscale memories technology in one place. It also covers a myriad of applications that nanoscale memories technology has enabled. The book begins with coverage of SRAM, addressing the design challenges as the technology scales, then provides design strategies to mitigate radiation induced upsets in SRAM. It discusses the current state-of-the-art DRAM technology and the need to develop high performance sense amplifier circuitry. The text then covers the novel concept of capacitorless 1T DRAM, termed as Advanced-RAM or A-RAM, and presents a discussion on quantum dot (QD) based flash memory. Building on this foundation, the coverage turns to STT-RAM, emphasizing scalable embedded STT-RAM, and the physics and engineering of magnetic domain wall "racetrack" memory. The book also discusses state-of-the-art modeling applied to phase change memory devices and includes an extensive review of RRAM, highlighting the physics of operation and analyzing different materials systems currently under investigation. The hunt is still on for universal memory that fits all the requirements of an "ideal memory" capable of high-density storage, low-power operation, unparalleled speed, high endurance, and low cost. Taking an interdisciplinary approach, this book bridges technological and application issues to provide the groundwork for developing custom designed memory systems.

Download or read book Soft Errors in Modern Electronic Systems written by Michael Nicolaidis and published by Springer Science & Business Media. This book was released on 2010-09-24 with total page 331 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive presentation of the most advanced research results and technological developments enabling understanding, qualifying and mitigating the soft errors effect in advanced electronics, including the fundamental physical mechanisms of radiation induced soft errors, the various steps that lead to a system failure, the modelling and simulation of soft error at various levels (including physical, electrical, netlist, event driven, RTL, and system level modelling and simulation), hardware fault injection, accelerated radiation testing and natural environment testing, soft error oriented test structures, process-level, device-level, cell-level, circuit-level, architectural-level, software level and system level soft error mitigation techniques. The book contains a comprehensive presentation of most recent advances on understanding, qualifying and mitigating the soft error effect in advanced electronic systems, presented by academia and industry experts in reliability, fault tolerance, EDA, processor, SoC and system design, and in particular, experts from industries that have faced the soft error impact in terms of product reliability and related business issues and were in the forefront of the countermeasures taken by these companies at multiple levels in order to mitigate the soft error effects at a cost acceptable for commercial products. In a fast moving field, where the impact on ground level electronics is very recent and its severity is steadily increasing at each new process node, impacting one after another various industry sectors (as an example, the Automotive Electronics Council comes to publish qualification requirements on soft errors), research and technology developments and industrial practices have evolve very fast, outdating the most recent books edited at 2004.

Download or read book Design and Test Technology for Dependable Systems on chip written by Raimund Ubar and published by IGI Global. This book was released on 2011-01-01 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This book covers aspects of system design and efficient modelling, and also introduces various fault models and fault mechanisms associated with digital circuits integrated into System on Chip (SoC), Multi-Processor System-on Chip (MPSoC) or Network on Chip (NoC)"--

Download or read book Ionizing Radiation Effects in Electronics written by Marta Bagatin and published by CRC Press. This book was released on 2018-09-03 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ionizing Radiation Effects in Electronics: From Memories to Imagers delivers comprehensive coverage of the effects of ionizing radiation on state-of-the-art semiconductor devices. The book also offers valuable insight into modern radiation-hardening techniques. The text begins by providing important background information on radiation effects, their underlying mechanisms, and the use of Monte Carlo techniques to simulate radiation transport and the effects of radiation on electronics. The book then: Explains the effects of radiation on digital commercial devices, including microprocessors and volatile and nonvolatile memories—static random-access memories (SRAMs), dynamic random-access memories (DRAMs), and Flash memories Examines issues like soft errors, total dose, and displacement damage, together with hardening-by-design solutions for digital circuits, field-programmable gate arrays (FPGAs), and mixed-analog circuits Explores the effects of radiation on fiber optics and imager devices such as complementary metal-oxide-semiconductor (CMOS) sensors and charge-coupled devices (CCDs) Featuring real-world examples, case studies, extensive references, and contributions from leading experts in industry and academia, Ionizing Radiation Effects in Electronics: From Memories to Imagers is suitable both for newcomers who want to become familiar with radiation effects and for radiation experts who are looking for more advanced material or to make effective use of beam time.

Download or read book Scientific and Technical Aerospace Reports written by and published by . This book was released on 1991 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Multi run Memory Tests for Pattern Sensitive Faults written by Ireneusz Mrozek and published by Springer. This book was released on 2018-07-06 with total page 142 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes efficient techniques for production testing as well as for periodic maintenance testing (specifically in terms of multi-cell faults) in modern semiconductor memory. The author discusses background selection and address reordering algorithms in multi-run transparent march testing processes. Formal methods for multi-run test generation and many solutions to increase their efficiency are described in detail. All methods presented ideas are verified by both analytical investigations and numerical simulations. Provides the first book related exclusively to the problem of multi-cell fault detection by multi-run tests in memory testing process; Presents practical algorithms for design and implementation of efficient multi-run tests; Demonstrates methods verified by analytical and experimental investigations.

Download or read book Industrial Engineering and Applications written by L.-C. Tang and published by IOS Press. This book was released on 2023-08-09 with total page 880 pages. Available in PDF, EPUB and Kindle. Book excerpt: The field of industrial engineering (IE) has a very wide scope, from production processes and automation to supply chain management, but the scope of IE techniques has expanded beyond the traditional domains of application, and is now relevant to areas that matter most to society at large. This book presents the proceedings of ICIEA 2023, the 10th International Conference on Industrial Engineering and Applications, held in Phuket, Thailand, from 4 to 6 April 2023. The conference was conducted in hybrid mode, with close to 100 delegates attending in person and about 50 participants attending online. A total of 272 submissions were received for the conference, of which 120 were accepted for presentation with 83 of those published here as full papers. These papers cover a wide range of topics within the scope of industrial and systems engineering, including but not limited to: supply chain and logistics; quality and reliability; advanced manufacturing; and production scheduling to ergonomics and man-machine systems interfaces. In particular, a significant number of papers are devoted to machine learning techniques and applications beyond the traditional manufacturing sector, to include healthcare, sustainability assessment, and other social issues. Offering an overview of recent research and novel applications, the book will be of interest to all those whose work involves the application of industrial engineering techniques.

Download or read book Rad hard Semiconductor Memories written by Cristiano Calligaro and published by CRC Press. This book was released on 2022-09-01 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rad-hard Semiconductor Memories is intended for researchers and professionals interested in understanding how to design and make a preliminary evaluation of rad-hard semiconductor memories, making leverage on standard CMOS manufacturing processes available from different silicon foundries and using different technology nodes.In the first part of the book, a preliminary overview of the effects of radiation in space, with a specific focus on memories, will be conducted to enable the reader to understand why specific design solutions are adopted to mitigate hard and soft errors. The second part will be devoted to RHBD (Radiation Hardening by Design) techniques for semiconductor components with a specific focus on memories. The approach will follow a top-down scheme starting from RHBD at architectural level (how to build a rad-hard floor-plan), at circuit level (how to mitigate radiation effects by handling transistors in the proper way) and at layout level (how to shape a layout to mitigate radiation effects).After the description of the mitigation techniques, the book enters in the core of the topic covering SRAMs (synchronous, asynchronous, single port and dual port) and PROMs (based on AntiFuse OTP technologies), describing how to design a rad-hard flash memory and fostering RHBD toward emerging memories like ReRAM. The last part will be a leap into emerging memories at a very early stage, not yet ready for industrial use in silicon but candidates to become an option for the next wave of rad-hard components. Technical topics discussed in the book include:  Radiation effects on semiconductor components (TID, SEE) Radiation Hardening by Design (RHBD) Techniques Rad-hard SRAMs Rad-hard PROMs Rad-hard Flash NVMs Rad-hard ReRAMs Rad-hard emerging technologies

Download or read book ISTFA 2019 Proceedings of the 45th International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.