Download or read book Advanced Chip Design written by Kishore Mishra and published by Createspace Independent Publishing Platform. This book was released on 2013 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book is intended for digital and system design engineers with emphasis on design and system architecture. The book is broadly divided into two sections - chapters 1 through 10, focusing on the digital design aspects and chapters 11 through 20, focusing on the system aspects of chip design. It comes with real-world examples in Verilog and introduction to SystemVerilog Assertions (SVA).
Download or read book VLSI Memory Chip Design written by Kiyoo Itoh and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: A systematic description of microelectronic device design. Topics range from the basics to low-power and ultralow-voltage designs, subthreshold current reduction, memory subsystem designs for modern DRAMs, and various on-chip supply-voltage conversion techniques. It also covers process and device issues as well as design issues relating to systems, circuits, devices and processes, such as signal-to-noise and redundancy.
Download or read book Introduction to Advanced System on Chip Test Design and Optimization written by Erik Larsson and published by Springer Science & Business Media. This book was released on 2006-03-30 with total page 397 pages. Available in PDF, EPUB and Kindle. Book excerpt: SOC test design and its optimization is the topic of Introduction to Advanced System-on-Chip Test Design and Optimization. It gives an introduction to testing, describes the problems related to SOC testing, discusses the modeling granularity and the implementation into EDA (electronic design automation) tools. The book is divided into three sections: i) test concepts, ii) SOC design for test, and iii) SOC test applications. The first part covers an introduction into test problems including faults, fault types, design-flow, design-for-test techniques such as scan-testing and Boundary Scan. The second part of the book discusses SOC related problems such as system modeling, test conflicts, power consumption, test access mechanism design, test scheduling and defect-oriented scheduling. Finally, the third part focuses on SOC applications, such as integrated test scheduling and TAM design, defect-oriented scheduling, and integrating test design with the core selection process.
Download or read book Advanced Flip Chip Packaging written by Ho-Ming Tong and published by Springer Science & Business Media. This book was released on 2013-03-20 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Flip Chip Packaging presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
Download or read book Interconnect Centric Design for Advanced SOC and NOC written by Jari Nurmi and published by Springer Science & Business Media. This book was released on 2006-03-20 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.
Download or read book Advanced ASIC Chip Synthesis written by Himanshu Bhatnagar and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 341 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced ASIC Chip Synthesis: Using Synopsys® Design Compiler® Physical Compiler® and PrimeTime®, Second Edition describes the advanced concepts and techniques used towards ASIC chip synthesis, physical synthesis, formal verification and static timing analysis, using the Synopsys suite of tools. In addition, the entire ASIC design flow methodology targeted for VDSM (Very-Deep-Sub-Micron) technologies is covered in detail. The emphasis of this book is on real-time application of Synopsys tools, used to combat various problems seen at VDSM geometries. Readers will be exposed to an effective design methodology for handling complex, sub-micron ASIC designs. Significance is placed on HDL coding styles, synthesis and optimization, dynamic simulation, formal verification, DFT scan insertion, links to layout, physical synthesis, and static timing analysis. At each step, problems related to each phase of the design flow are identified, with solutions and work-around described in detail. In addition, crucial issues related to layout, which includes clock tree synthesis and back-end integration (links to layout) are also discussed at length. Furthermore, the book contains in-depth discussions on the basis of Synopsys technology libraries and HDL coding styles, targeted towards optimal synthesis solution. Target audiences for this book are practicing ASIC design engineers and masters level students undertaking advanced VLSI courses on ASIC chip design and DFT techniques.
Download or read book VLSI Chip Design with the Hardware Description Language VERILOG written by Ulrich Golze and published by Springer Science & Business Media. This book was released on 2013-11-11 with total page 363 pages. Available in PDF, EPUB and Kindle. Book excerpt: The art of transforming a circuit idea into a chip has changed permanently. Formerly, the electrical, physical and geometrical tasks were predominant. Later, mainly net lists of gates had to be constructed. Nowadays, hardware description languages (HDL) similar to programming languages are central to digital circuit design. HDL-based design is the main subject of this book. After emphasizing the economic importance of chip design as a key technology, the book deals with VLSI design (Very Large Scale Integration), the design of modern RISC processors, the hardware description language VERILOG, and typical modeling techniques. Numerous examples as well as a VERILOG training simulator are included on a disk.
Download or read book Advanced Multicore Systems On Chip written by Abderazek Ben Abdallah and published by Springer. This book was released on 2017-09-10 with total page 292 pages. Available in PDF, EPUB and Kindle. Book excerpt: From basic architecture, interconnection, and parallelization to power optimization, this book provides a comprehensive description of emerging multicore systems-on-chip (MCSoCs) hardware and software design. Highlighting both fundamentals and advanced software and hardware design, it can serve as a primary textbook for advanced courses in MCSoCs design and embedded systems. The first three chapters introduce MCSoCs architectures, present design challenges and conventional design methods, and describe in detail the main building blocks of MCSoCs. Chapters 4, 5, and 6 discuss fundamental and advanced on-chip interconnection network technologies for multi and many core SoCs, enabling readers to understand the microarchitectures for on-chip routers and network interfaces that are essential in the context of latency, area, and power constraints. With the rise of multicore and many-core systems, concurrency is becoming a major issue in the daily life of a programmer. Thus, compiler and software development tools are critical in helping programmers create high-performance software. Programmers should make sure that their parallelized program codes will not cause race condition, memory-access deadlocks, or other faults that may crash their entire systems. As such, Chapter 7 describes a novel parallelizing compiler design for high-performance computing. Chapter 8 provides a detailed investigation of power reduction techniques for MCSoCs at component and network levels. It discusses energy conservation in general hardware design, and also in embedded multicore system components, such as CPUs, disks, displays and memories. Lastly, Chapter 9 presents a real embedded MCSoCs system design targeted for health monitoring in the elderly.
Download or read book System on Chip Design with Arm Cortex M Processors written by Joseph Yiu and published by Arm Education Media. This book was released on 2019-08-29 with total page 334 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Arm(R) Cortex(R)-M processors are already one of the most popular choices for loT and embedded applications. With Arm Flexible Access and DesignStart(TM), accessing Arm Cortex-M processor IP is fast, affordable, and easy. This book introduces all the key topics that system-on-chip (SoC) and FPGA designers need to know when integrating a Cortex-M processor into their design, including bus protocols, bus interconnect, and peripheral designs. Joseph Yiu is a distinguished Arm engineer who began designing SoCs back in 2000 and has been a leader in this field for nearly twenty years. Joseph's book takes an expert look at what SoC designers need to know when incorporating Cortex-M processors into their systems. He discusses the on-chip bus protocol specifications (AMBA, AHB, and APB), used by Arm processors and a wide range of on-chip digital components such as memory interfaces, peripherals, and debug components. Software development and advanced design considerations are also covered. The journey concludes with 'Putting the system together', a designer's eye view of a simple microcontroller-like design based on the Cortex-M3 processor (DesignStart) that uses the components that you will have learned to create.
Download or read book Advanced FPGA Design written by Steve Kilts and published by John Wiley & Sons. This book was released on 2007-06-18 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides the advanced issues of FPGA design as the underlying theme of the work. In practice, an engineer typically needs to be mentored for several years before these principles are appropriately utilized. The topics that will be discussed in this book are essential to designing FPGA's beyond moderate complexity. The goal of the book is to present practical design techniques that are otherwise only available through mentorship and real-world experience.
Download or read book Advanced ASIC Chip Synthesis written by Himanshu Bhatnagar and published by Springer Science & Business Media. This book was released on 2012-11-11 with total page 304 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced ASIC Chip Synthesis: Using Synopsys® Design Compiler® and PrimeTime® describes the advanced concepts and techniques used for ASIC chip synthesis, formal verification and static timing analysis, using the Synopsys suite of tools. In addition, the entire ASIC design flow methodology targeted for VDSM (Very-Deep-Sub-Micron) technologies is covered in detail. The emphasis of this book is on real-time application of Synopsys tools used to combat various problems seen at VDSM geometries. Readers will be exposed to an effective design methodology for handling complex, sub-micron ASIC designs. Significance is placed on HDL coding styles, synthesis and optimization, dynamic simulation, formal verification, DFT scan insertion, links to layout, and static timing analysis. At each step, problems related to each phase of the design flow are identified, with solutions and work-arounds described in detail. In addition, crucial issues related to layout, which includes clock tree synthesis and back-end integration (links to layout) are also discussed at length. Furthermore, the book contains in-depth discussions on the basics of Synopsys technology libraries and HDL coding styles, targeted towards optimal synthesis solutions. Advanced ASIC Chip Synthesis: Using Synopsys® Design Compiler® and PrimeTime® is intended for anyone who is involved in the ASIC design methodology, starting from RTL synthesis to final tape-out. Target audiences for this book are practicing ASIC design engineers and graduate students undertaking advanced courses in ASIC chip design and DFT techniques. From the Foreword: `This book, written by Himanshu Bhatnagar, provides a comprehensive overview of the ASIC design flow targeted for VDSM technologies using the Synopsis suite of tools. It emphasizes the practical issues faced by the semiconductor design engineer in terms of synthesis and the integration of front-end and back-end tools. Traditional design methodologies are challenged and unique solutions are offered to help define the next generation of ASIC design flows. The author provides numerous practical examples derived from real-world situations that will prove valuable to practicing ASIC design engineers as well as to students of advanced VLSI courses in ASIC design'. Dr Dwight W. Decker, Chairman and CEO, Conexant Systems, Inc., (Formerly, Rockwell Semiconductor Systems), Newport Beach, CA, USA.
Download or read book Design of System on a Chip written by Ricardo Reis and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 258 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design of System on a Chip is the first of two volumes addressing the design challenges associated with new generations of the semiconductor technology. The various chapters are the compilations of tutorials presented at workshops in Brazil in the recent years by prominent authors from all over the world. In particular the first book deals with components and circuits. Device models have to satisfy the conditions to be computationally economical in addition to be accurate and to scale over various generations of technology. In addition the book addresses issues of the parasitic behavior of deep sub-micron components, such as parameter variations and sub-threshold effects. Furthermore various authors deal with items like mixed signal components and memories. We wind up with an exposition of the technology problems to be solved if our community wants to maintain the pace of the "International Technology Roadmap for Semiconductors" (ITRS).
Download or read book ESD Protection Device and Circuit Design for Advanced CMOS Technologies written by Oleg Semenov and published by Springer Science & Business Media. This book was released on 2008-04-26 with total page 237 pages. Available in PDF, EPUB and Kindle. Book excerpt: ESD Protection Device and Circuit Design for Advanced CMOS Technologies is intended for practicing engineers working in the areas of circuit design, VLSI reliability and testing domains. As the problems associated with ESD failures and yield losses become significant in the modern semiconductor industry, the demand for graduates with a basic knowledge of ESD is also increasing. Today, there is a significant demand to educate the circuits design and reliability teams on ESD issues. This book makes an attempt to address the ESD design and implementation in a systematic manner. A design procedure involving device simulators as well as circuit simulator is employed to optimize device and circuit parameters for optimal ESD as well as circuit performance. This methodology, described in ESD Protection Device and Circuit Design for Advanced CMOS Technologies has resulted in several successful ESD circuit design with excellent silicon results and demonstrates its strengths.
Download or read book Semiconductor Advanced Packaging written by John H. Lau and published by Springer Nature. This book was released on 2021-05-17 with total page 513 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.
Download or read book Extending Moore s Law through Advanced Semiconductor Design and Processing Techniques written by Wynand Lambrechts and published by CRC Press. This book was released on 2018-09-13 with total page 361 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research findings show that boundaries of Moore’s law primarily include physical restrictions of scaling electronic components to levels beyond that of ordinary manufacturing principles and approaching the bounds of physics. The research presented in this book provides essential background and knowledge to grasp the following principles: Traditional and modern photolithography, the primary limiting factor of Moore’s law Innovations in semiconductor manufacturing that makes current generation CMOS processing possible Multi-disciplinary technologies that could drive Moore's law forward significantly Design principles for microelectronic circuits and components that take advantage of technology miniaturization The semiconductor industry economic market trends and technical driving factors The complexity and cost associated with technology scaling have compelled researchers in the disciplines of engineering and physics to optimize previous generation nodes to improve system-on-chip performance. This is especially relevant to participate in the increased attractiveness of the Internet of Things (IoT). This book additionally provides scholarly and practical examples of principles in microelectronic circuit design and layout to mitigate technology limits of previous generation nodes. Readers are encouraged to intellectually apply the knowledge derived from this book to further research and innovation in prolonging Moore’s law and associated principles.
Download or read book SiP System in Package Design and Simulation written by Suny Li (Li Yang) and published by John Wiley & Sons. This book was released on 2017-07-24 with total page 508 pages. Available in PDF, EPUB and Kindle. Book excerpt: An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Download or read book Chiplet Design and Heterogeneous Integration Packaging written by John H. Lau and published by Springer Nature. This book was released on 2023-03-27 with total page 542 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.