Download or read book 3D Stacked Memory written by and published by LexInnova Technologies, LLC. This book was released on 2015-04-01 with total page 24 pages. Available in PDF, EPUB and Kindle. Book excerpt: Our report on 3D stacked memory technology covers the Intellectual Property (Patent) landscape of this rapidly evolving technology and monitors its various sub-domains for licensing activity. We have analyzed the IP portfolios of SanDisk, Micron, Samsung, IBM and other major players to find the focus areas of their patenting efforts. Using our proprietary patent analytics tool, LexScore™, we identify the front runners in this technology domain with strong patent portfolio quality as well as a heavy patent filing activity. Using our proprietary Licensing Heat-map framework, we also predict licensing activity trend in various technology sub domains.
Download or read book Handbook of 3D Integration Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 582 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.
Download or read book Vertical 3D Memory Technologies written by Betty Prince and published by John Wiley & Sons. This book was released on 2014-10-06 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later. Key features: Presents a review of the status and trends in 3-dimensional vertical memory chip technologies. Extensively reviews advanced vertical memory chip technology and development Explores technology process routes and 3D chip integration in a single reference
Download or read book High Performance Hybrid Memory Systems with 3D stacked DRAM written by Evangelos Vasilakis and published by . This book was released on 2020 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 3D Stacked Chips written by Ibrahim (Abe) M. Elfadel and published by Springer. This book was released on 2016-05-11 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
Download or read book Design for Test and Test Optimization Techniques for TSV based 3D Stacked ICs written by Brandon Noia and published by Springer Science & Business Media. This book was released on 2013-11-19 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain. Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
Download or read book 3D Stacked Memories for Digital Signal Processors written by and published by . This book was released on 2013 with total page 97 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recently, three-dimensional (3D) integration technology has enabled researchers to explore novel architectures. Due to the growing memory requirements of modern signal processing applications, it was thought that digital signal processors (DSPs) could benefit from 3D memory integration technology where high-density memories are placed below processing cores. Until recently, it was believed that this integration could lower memory latencies by 45% to 60%, which would improve performance. 3D memory integration technology also allowed a large increase in the main memory bus width by using small through silicon vias (TSVs) instead of off-chip metal wires. This increase in the bus width meant each main memory request could bring more data into the last-level on-chip memory and improve the performance of streaming applications whose memory access behavior exhibits a large amount of spatial locality. My dissertation provides a more accurate 3D main memory model that demonstrates that the latency reduction of going from conventional DDR2 DRAM to 3D memory technology is roughly 4% instead of the often quoted 45% to 60%. With this model, I re-evaluate the performance impact of 3D main memory on DSPs and find the benefits from the latency savings are small. I next analyze current 3D main memory with Wide I/O, which can lower main memory latencies by 15.9% and greatly increase the main memory bus width. I demonstrate that using 3D main memory with Wide I/O and increasing the main memory bus width from 64 bits to 4,096 bits can improve the average performance of signal processing applications by 9.7%, but also increases average energy consumption by 2.6%. For energy-constraint DSPs that are often found in mobile devices, this increase may be unacceptable. To mitigate this energy increase, I propose novel techniques to dynamically scale the main memory bus width of a DSP based on the program phases of an application. These bandwidth scaling algorithms increase the main memory bus width during memory intense phases to improve performance and lower the bus width during compute intensive phases to improve energy efficiency. These algorithms can improve average DSP performance by 6.6% while increasing average energy consumption by only 0.5%.
Download or read book Die stacking Architecture written by Yuan Xie and published by Springer Nature. This book was released on 2022-05-31 with total page 113 pages. Available in PDF, EPUB and Kindle. Book excerpt: The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
Download or read book Vertical 3D Memory Technologies written by Betty Prince and published by John Wiley & Sons. This book was released on 2014-08-13 with total page 466 pages. Available in PDF, EPUB and Kindle. Book excerpt: The large scale integration and planar scaling of individual system chips is reaching an expensive limit. If individual chips now, and later terrabyte memory blocks, memory macros, and processing cores, can be tightly linked in optimally designed and processed small footprint vertical stacks, then performance can be increased, power reduced and cost contained. This book reviews for the electronics industry engineer, professional and student the critical areas of development for 3D vertical memory chips including: gate-all-around and junction-less nanowire memories, stacked thin film and double gate memories, terrabit vertical channel and vertical gate stacked NAND flash, large scale stacking of Resistance RAM cross-point arrays, and 2.5D/3D stacking of memory and processor chips with through-silicon-via connections now and remote links later. Key features: Presents a review of the status and trends in 3-dimensional vertical memory chip technologies. Extensively reviews advanced vertical memory chip technology and development Explores technology process routes and 3D chip integration in a single reference
Download or read book Modeling and Memory Management Unit of 3D Stacked DRAM for 3D High Definition HD Video written by and published by . This book was released on 2013 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 3D Flash Memories written by Rino Micheloni and published by Springer. This book was released on 2016-05-26 with total page 391 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book walks the reader through the next step in the evolution of NAND flash memory technology, namely the development of 3D flash memories, in which multiple layers of memory cells are grown within the same piece of silicon. It describes their working principles, device architectures, fabrication techniques and practical implementations, and highlights why 3D flash is a brand new technology. After reviewing market trends for both NAND and solid state drives (SSDs), the book digs into the details of the flash memory cell itself, covering both floating gate and emerging charge trap technologies. There is a plethora of different materials and vertical integration schemes out there. New memory cells, new materials, new architectures (3D Stacked, BiCS and P-BiCS, 3D FG, 3D VG, 3D advanced architectures); basically, each NAND manufacturer has its own solution. Chapter 3 to chapter 7 offer a broad overview of how 3D can materialize. The 3D wave is impacting emerging memories as well and chapter 8 covers 3D RRAM (resistive RAM) crosspoint arrays. Visualizing 3D structures can be a challenge for the human brain: this is way all these chapters contain a lot of bird’s-eye views and cross sections along the 3 axes. The second part of the book is devoted to other important aspects, such as advanced packaging technology (i.e. TSV in chapter 9) and error correction codes, which have been leveraged to improve flash reliability for decades. Chapter 10 describes the evolution from legacy BCH to the most recent LDPC codes, while chapter 11 deals with some of the most recent advancements in the ECC field. Last but not least, chapter 12 looks at 3D flash memories from a system perspective. Is 14nm the last step for planar cells? Can 100 layers be integrated within the same piece of silicon? Is 4 bit/cell possible with 3D? Will 3D be reliable enough for enterprise and datacenter applications? These are some of the questions that this book helps answering by providing insights into 3D flash memory design, process technology and applications.
Download or read book Design Automation of Cyber Physical Systems written by Mohammad Abdullah Al Faruque and published by Springer. This book was released on 2019-05-09 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the state-of-the-art and breakthrough innovations in design automation for cyber-physical systems.The authors discuss various aspects of cyber-physical systems design, including modeling, co-design, optimization, tools, formal methods, validation, verification, and case studies. Coverage includes a survey of the various existing cyber-physical systems functional design methodologies and related tools will provide the reader unique insights into the conceptual design of cyber-physical systems.
Download or read book Design for High Performance Low Power and Reliable 3D Integrated Circuits written by Sung Kyu Lim and published by Springer Science & Business Media. This book was released on 2012-11-27 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.
Download or read book Improving Performance of In memory Key value Stores Using a 3d stacked Architecture written by Ivan Stalev and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Web services and cloud computing are rapidly growing as more users get online around the world and utilize the internet for a growing number of purposes. This puts more demand on in-memory key-value stores as web servers must handle a massive influx of user requests. Data centers will thus find it more challenging to meet their SLAs (Service Level Agreements), as the latency of the 90th percentile of requests may become quite unpredictable. To alleviate this growing concern, we utilize a stacked DRAM architecture as a LLC (last-level cache) that is modified to exploit some common power-law access patterns in user requests. More specifically, we observe that the majority of the memory traffic generated by a key-value store is due to requests for large values, even though large values account for a very small portion (typically around 5%) of overall requests. Thus, we choose to prioritize the cachelines that belong to large values in the stacked DRAM cache by allowing priority cachelines to only be evicted by other priority cachelines. Using this priority scheme, we are able to improve the 90th percentile request latency by as much as 42.4% over a standard stacked DRAM cache architecture.
Download or read book Semiconductor Silicon 2002 written by Howard R. Huff and published by The Electrochemical Society. This book was released on 2002 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 3D IC and RF SiPs Advanced Stacking and Planar Solutions for 5G Mobility written by Lih-Tyng Hwang and published by John Wiley & Sons. This book was released on 2018-03-29 with total page 602 pages. Available in PDF, EPUB and Kindle. Book excerpt: An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail Provides chapter-wise review questions and powerpoint slides as teaching tools
Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.
