Download or read book 26th Electronic Components Conference written by and published by . This book was released on 1976 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 29th Electronic Components Conference Cherry Hill Hyatt House Cherry Hill N J May 14 16 1979 written by and published by . This book was released on 1979 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Microcircuit Reliability Bibliography written by and published by . This book was released on 1978 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 36th Electronic Components Conference written by and published by . This book was released on 1986 with total page 706 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
Download or read book 28th Electronic Components Conference Disneyland Hotel Anaheim CA April 24 26 1978 written by and published by . This book was released on 1978 with total page 460 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book 33rd Electronic Components Conference written by and published by . This book was released on 1983 with total page 646 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book NBS Special Publication written by and published by . This book was released on 1968 with total page 808 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Technology for Cardiac Pacemakers III written by and published by . This book was released on 1979 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Quality Conformance and Qualification of Microelectronic Packages and Interconnects written by Michael Pecht and published by John Wiley & Sons. This book was released on 1994-12-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
Download or read book Report of NRL Progress written by Naval Research Laboratory (U.S.) and published by . This book was released on 1979 with total page 628 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Polymer Thick Film written by Ken Gilleo and published by Springer Science & Business Media. This book was released on 1995-10-31 with total page 450 pages. Available in PDF, EPUB and Kindle. Book excerpt: Ken Gilleo's Polymer Thick Film provides you with all the essential concepts, process descriptions, performance data, and general information you will need to reach your own conclusions. The focus will be on polymer thick film's major subsets, which include conductive inks, printed resistors, dielectric films or pastes, and polymer assembly material.
Download or read book Nondestructive Tests Used to Insure the Integrity of Semiconductor Devices with Emphasis on Acoustic Emission Techniques written by George G. Harman and published by . This book was released on 1979 with total page 80 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Semiconductor Measurement Technology written by Harry A. Schafft and published by . This book was released on 1977 with total page 52 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability Technology for Cardiac Pacemakers II written by and published by . This book was released on 1977 with total page 52 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Large Scale Integrated Circuits Technology State of the Art and Prospects written by Leo Esaki and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 745 pages. Available in PDF, EPUB and Kindle. Book excerpt: A NATO Advanced Study Institute on "Large Scale Integrated Circuits Technology: State of the Art and Prospects" was held at Ettore Majorana Centre for Scientific Culture, Erice (Italy) on July 15-27, 1981, the first course of the International School of Solid-State Device Research. This volume contains the School Proceedings: fundamentals as well as up-to-date information on each subject presented by qualified authors. The material covered in this volume has been arranged in self-consistent chapters. Therefore, the Proceedings may be used as a suitable textbook or authoritative review for research workers and advanced students in the relevant field. The nascent information society is based on advanced technologies which will revolutionize human abilities to manipulate and communicate information. One of the most important underpinnings for developing such an information society lies in innovations in semiconductor microelectronics. Such innova tions, indeed, are dramatically reducing the cost of transmitting, storing, and processing information with improved performance, ushering in an era charac terized by large scale integration -the subject of this book.
Download or read book Advances in Polyimide written by Claudius Feger and published by CRC Press. This book was released on 1993-01-04 with total page 970 pages. Available in PDF, EPUB and Kindle. Book excerpt:
