Download or read book International Symposium on Functional Diversification of Semiconductor Electronics 3 More Than Moore 3 written by Y. Obeng and published by The Electrochemical Society. This book was released on with total page 130 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of International Conference on Frontiers in Computing and Systems written by Debotosh Bhattacharjee and published by Springer Nature. This book was released on 2020-11-23 with total page 895 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gathers outstanding research papers presented at the International Conference on Frontiers in Computing and Systems (COMSYS 2020), held on January 13–15, 2019 at Jalpaiguri Government Engineering College, West Bengal, India and jointly organized by the Department of Computer Science & Engineering and Department of Electronics & Communication Engineering. The book presents the latest research and results in various fields of machine learning, computational intelligence, VLSI, networks and systems, computational biology, and security, making it a rich source of reference material for academia and industry alike.

Download or read book Proceedings of the Second International Conference on Soft Computing for Problem Solving SocProS 2012 December 28 30 2012 written by B. V. Babu and published by Springer. This book was released on 2014-07-08 with total page 1529 pages. Available in PDF, EPUB and Kindle. Book excerpt: The present book is based on the research papers presented in the International Conference on Soft Computing for Problem Solving (SocProS 2012), held at JK Lakshmipat University, Jaipur, India. This book provides the latest developments in the area of soft computing and covers a variety of topics, including mathematical modeling, image processing, optimization, swarm intelligence, evolutionary algorithms, fuzzy logic, neural networks, forecasting, data mining, etc. The objective of the book is to familiarize the reader with the latest scientific developments that are taking place in various fields and the latest sophisticated problem solving tools that are being developed to deal with the complex and intricate problems that are otherwise difficult to solve by the usual and traditional methods. The book is directed to the researchers and scientists engaged in various fields of Science and Technology.

Download or read book Virtual Design of an Audio Lifelogging System written by Brian Mears and published by Springer Nature. This book was released on 2022-06-01 with total page 63 pages. Available in PDF, EPUB and Kindle. Book excerpt: The availability of inexpensive, custom, highly integrated circuits is enabling some very powerful systems that bring together sensors, smart phones, wearables, cloud computing, and other technologies. To design these types of complex systems we are advocating a top-down simulation methodology to identify problems early. This approach enables software development to start prior to expensive chip and hardware development. We call the overall approach virtual design. This book explains why simulation has become important for chip design and provides an introduction to some of the simulation methods used. The audio lifelogging research project demonstrates the virtual design process in practice. The goals of this book are to: explain how silicon design has become more closely involved with system design; show how virtual design enables top down design; explain the utility of simulation at different abstraction levels; show how open source simulation software was used in audio lifelogging. The target audience for this book are faculty, engineers, and students who are interested in developing digital devices for Internet of Things (IoT) types of products.

Download or read book Innovative Research and Applications in Next Generation High Performance Computing written by Hassan, Qusay F. and published by IGI Global. This book was released on 2016-07-05 with total page 543 pages. Available in PDF, EPUB and Kindle. Book excerpt: High-performance computing (HPC) describes the use of connected computing units to perform complex tasks. It relies on parallelization techniques and algorithms to synchronize these disparate units in order to perform faster than a single processor could, alone. Used in industries from medicine and research to military and higher education, this method of computing allows for users to complete complex data-intensive tasks. This field has undergone many changes over the past decade, and will continue to grow in popularity in the coming years. Innovative Research Applications in Next-Generation High Performance Computing aims to address the future challenges, advances, and applications of HPC and related technologies. As the need for such processors increases, so does the importance of developing new ways to optimize the performance of these supercomputers. This timely publication provides comprehensive information for researchers, students in ICT, program developers, military and government organizations, and business professionals.

Download or read book Third International Congress on Information and Communication Technology written by Xin-She Yang and published by Springer. This book was released on 2018-09-28 with total page 968 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book includes selected high-quality research papers presented at the Third International Congress on Information and Communication Technology held at Brunel University, London on February 27–28, 2018. It discusses emerging topics pertaining to information and communication technology (ICT) for managerial applications, e-governance, e-agriculture, e-education and computing technologies, the Internet of Things (IOT), and e-mining. Written by experts and researchers working on ICT, the book is suitable for new researchers involved in advanced studies.

Download or read book Labs on Chip written by Eugenio Iannone and published by CRC Press. This book was released on 2018-09-03 with total page 1351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.

Download or read book VLSI Design and Test written by Brajesh Kumar Kaushik and published by Springer. This book was released on 2017-12-21 with total page 820 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 21st International Symposium on VLSI Design and Test, VDAT 2017, held in Roorkee, India, in June/July 2017. The 48 full papers presented together with 27 short papers were carefully reviewed and selected from 246 submissions. The papers were organized in topical sections named: digital design; analog/mixed signal; VLSI testing; devices and technology; VLSI architectures; emerging technologies and memory; system design; low power design and test; RF circuits; architecture and CAD; and design verification.

Download or read book Neuromorphic Photonics written by Paul R. Prucnal and published by CRC Press. This book was released on 2017-05-08 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book sets out to build bridges between the domains of photonic device physics and neural networks, providing a comprehensive overview of the emerging field of "neuromorphic photonics." It includes a thorough discussion of evolution of neuromorphic photonics from the advent of fiber-optic neurons to today’s state-of-the-art integrated laser neurons, which are a current focus of international research. Neuromorphic Photonics explores candidate interconnection architectures and devices for integrated neuromorphic networks, along with key functionality such as learning. It is written at a level accessible to graduate students, while also intending to serve as a comprehensive reference for experts in the field.

Download or read book Nano Interconnect Materials and Models for Next Generation Integrated Circuit Design written by Sandip Bhattacharya and published by CRC Press. This book was released on 2023-12-22 with total page 223 pages. Available in PDF, EPUB and Kindle. Book excerpt: Focusses on materials and nanomaterials utilization in next generation interconnects based on carbon nanotubes (CNT) and graphene nanoribbons (GNR) Helps readers realize interconnects, interconnect models, and crosstalk noise analysis Describes hybrid CNT and GNR based interconnects Presents the details of power supply voltage drop analysis in CNT and GNR interconnects Overviews pertinent RF performance and stability analysis

Download or read book 3D Interconnect Architectures for Heterogeneous Technologies written by Lennart Bamberg and published by Springer Nature. This book was released on 2022-06-27 with total page 403 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.

Download or read book Long Term Reliability of Nanometer VLSI Systems written by Sheldon Tan and published by Springer Nature. This book was released on 2019-09-12 with total page 487 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a detailed reference regarding two of the most important long-term reliability and aging effects on nanometer integrated systems, electromigrations (EM) for interconnect and biased temperature instability (BTI) for CMOS devices. The authors discuss in detail recent developments in the modeling, analysis and optimization of the reliability effects from EM and BTI induced failures at the circuit, architecture and system levels of abstraction. Readers will benefit from a focus on topics such as recently developed, physics-based EM modeling, EM modeling for multi-segment wires, new EM-aware power grid analysis, and system level EM-induced reliability optimization and management techniques. Reviews classic Electromigration (EM) models, as well as existing EM failure models and discusses the limitations of those models; Introduces a dynamic EM model to address transient stress evolution, in which wires are stressed under time-varying current flows, and the EM recovery effects. Also includes new, parameterized equivalent DC current based EM models to address the recovery and transient effects; Presents a cross-layer approach to transistor aging modeling, analysis and mitigation, spanning multiple abstraction levels; Equips readers for EM-induced dynamic reliability management and energy or lifetime optimization techniques, for many-core dark silicon microprocessors, embedded systems, lower power many-core processors and datacenters.

Download or read book Advances in Intelligent Systems Reviews Vol 1 written by Sergey Yurish and published by Lulu.com. This book was released on 2018-01-03 with total page 294 pages. Available in PDF, EPUB and Kindle. Book excerpt: 'Advances in Intelligent Systems: Reviews' Vol. 1 Book Series is covering some design and architectural aspects related to intelligent systems and software. It ranges from the microarchitecture level via the system software level up to the application-specific architecture level. The book volume contains ten chapters written by 25 contributors from academia and industry from 8 countries: Colombia, Denmark, France, Germany, Italy, Japan, Romania and USA. The book will be a valuable tool for those who involved in research and development of various intelligent systems.

Download or read book Modeling Nanowire and Double Gate Junctionless Field Effect Transistors written by Farzan Jazaeri and published by Cambridge University Press. This book was released on 2018-03-01 with total page 255 pages. Available in PDF, EPUB and Kindle. Book excerpt: The first book on the topic, this is a comprehensive introduction to the modeling and design of junctionless field effect transistors (FETs). Beginning with a discussion of the advantages and limitations of the technology, the authors also provide a thorough overview of published analytical models for double-gate and nanowire configurations, before offering a general introduction to the EPFL charge-based model of junctionless FETs. Important features are introduced gradually, including nanowire versus double-gate equivalence, technological design space, junctionless FET performances, short channel effects, transcapacitances, asymmetric operation, thermal noise, interface traps, and the junction FET. Additional features compatible with biosensor applications are also discussed. This is a valuable resource for students and researchers looking to understand more about this new and fast developing field.

Download or read book Carbon Nanotube Based VLSI Interconnects written by Brajesh Kumar Kaushik and published by Springer. This book was released on 2014-11-01 with total page 94 pages. Available in PDF, EPUB and Kindle. Book excerpt: The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

Download or read book 3D Integration in VLSI Circuits written by Katsuyuki Sakuma and published by CRC Press. This book was released on 2018-04-17 with total page 217 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest challenges and issues in 3D integration. TSVs are not the only technology element needed for 3D integration. There are numerous other key enabling technologies required for 3D integration, and the speed of the development in this emerging field is very rapid. To provide readers with state-of-the-art information on 3D integration research and technology developments, each chapter has been contributed by some of the world’s leading scientists and experts from academia, research institutes, and industry from around the globe. Covers chip/wafer level 3D integration technology, memory stacking, reconfigurable 3D, and monolithic 3D IC. Discusses the use of silicon interposer and organic interposer. Presents architecture, design, and technology implementations for 3D FPGA integration. Describes oxide bonding, Cu/SiO2 hybrid bonding, adhesive bonding, and solder bonding. Addresses the issue of thermal dissipation in 3D integration.

Download or read book Post Silicon Validation and Debug written by Prabhat Mishra and published by Springer. This book was released on 2018-09-01 with total page 393 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides a comprehensive coverage of System-on-Chip (SoC) post-silicon validation and debug challenges and state-of-the-art solutions with contributions from SoC designers, academic researchers as well as SoC verification experts. The readers will get a clear understanding of the existing debug infrastructure and how they can be effectively utilized to verify and debug SoCs.