Download or read book Electrical Design of Through Silicon Via written by Manho Lee and published by Springer. This book was released on 2014-05-11 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.

Download or read book Power Integrity for Electrical and Computer Engineers written by J. Ted Dibene, II and published by John Wiley & Sons. This book was released on 2019-09-05 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: A professional guide to the fundamentals of power integrity analysis with an emphasis on silicon level power integrity Power Integrity for Electrical and Computer Engineers embraces the most recent changes in the field, offers a comprehensive introduction to the discipline of power integrity, and provides an overview of the fundamental principles. Written by noted experts on the topic, the book goes beyond most other resources to focus on the detailed aspects of silicon and optimization techniques in order to broaden the field of study. This important book offers coverage of a wide range of topics including signal analysis, EM concepts for PI, frequency domain analysis for PI, numerical methods (overview) for PI, and silicon device PI modeling. Power Integrity for Electrical and Computer Engineers examine platform technologies, system considerations, power conversion, system level modeling, and optimization methodologies. To reinforce the material presented, the authors include example problems. This important book: • Includes coverage on convergence, accuracy, and error analysis and explains how these can be used to analyze power integrity problems • Contains information for modeling the power converter from the PDN to the load in a full system level model • Explores areas of device level modeling of silicon as related to power integrity • Contains example word problems that are related to an individual chapter’s subject Written for electrical and computer engineers and academics, Power Integrity for Electrical and Computer Engineers is an authoritative guide to the fundamentals of power integrity and explores the topics of power integrity analysis, power integrity analytics, silicon level power integrity, and optimization techniques.

Download or read book Noise Coupling in System on Chip written by Thomas Noulis and published by CRC Press. This book was released on 2018-01-09 with total page 519 pages. Available in PDF, EPUB and Kindle. Book excerpt: Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.

Download or read book Modeling and Design of Electromagnetic Compatibility for High Speed Printed Circuit Boards and Packaging written by Xing-Chang Wei and published by CRC Press. This book was released on 2017-09-19 with total page 341 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Download or read book Electrical Modeling and Design for 3D System Integration written by Er-Ping Li and published by John Wiley & Sons. This book was released on 2012-04-10 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and printed circuit boards. Readers will discover the state of the technology in electronic package integration and printed circuit board simulation and modeling. In addition to popular full-wave electromagnetic computational methods, the book presents new, more sophisticated modeling methods, offering readers the most advanced tools for analyzing and designing large complex electronic structures. Electrical Modeling and Design for 3D System Integration begins with a comprehensive review of current modeling and simulation methods for signal integrity, power integrity, and electromagnetic compatibility. Next, the book guides readers through: The macromodeling technique used in the electrical and electromagnetic modeling and simulation of complex interconnects in three-dimensional integrated systems The semi-analytical scattering matrix method based on the N-body scattering theory for modeling of three-dimensional electronic package and multilayered printed circuit boards with multiple vias Two- and three-dimensional integral equation methods for the analysis of power distribution networks in three-dimensional package integrations The physics-based algorithm for extracting the equivalent circuit of a complex power distribution network in three-dimensional integrated systems and printed circuit boards An equivalent circuit model of through-silicon vias Metal-oxide-semiconductor capacitance effects of through-silicon vias Engineers, researchers, and students can turn to this book for the latest techniques and methods for the electrical modeling and design of electronic packaging, three-dimensional electronic integration, integrated circuits, and printed circuit boards.

Download or read book Designing TSVs for 3D Integrated Circuits written by Nauman Khan and published by Springer Science & Business Media. This book was released on 2012-09-22 with total page 82 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks. Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.

Download or read book Arbitrary Modeling of TSVs for 3D Integrated Circuits written by Khaled Salah and published by Springer. This book was released on 2014-08-21 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

Download or read book Energy Science and Applied Technology written by Zhigang Fang and published by CRC Press. This book was released on 2015-11-17 with total page 570 pages. Available in PDF, EPUB and Kindle. Book excerpt: Energy Science and Applied Technology includes contributions on a wide range of topics:- Technologies in geology, mining, oil and gas exploration and exploitation of deposits- Energy transfer and conversion, materials and chemical technologies- Environmental engineering and sustainable development- Electrical and electronic technology, power system

Download or read book Physical Design for 3D Integrated Circuits written by Aida Todri-Sanial and published by CRC Press. This book was released on 2017-12-19 with total page 397 pages. Available in PDF, EPUB and Kindle. Book excerpt: Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Download or read book The Turn of Moore s Law from Space to Time written by Liming Xiu and published by Springer Nature. This book was released on 2022-05-24 with total page 339 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book states that a space-induced crisis is recognized as the cause of trouble that Moore’s Law is currently facing. The contemporary practice of this empirical law can be considered as happening within a space-dominant paradigm. An alternative of exploiting potential in the dimension of time is identified as an emerging paradigm in microelectronics. The new practice is termed a time-oriented paradigm. It is justified as the turn of Moore’s Law from space to time. The resultant Time-Moore strategy is envisioned as the next-generation enabler for continuing Moore’s Law’s pursuit of everhigher information processing power and efficiency. It also serves as the perpetuation of the spirit that Moore’s law is nothing but a collective storied history of innovations. In the first part of this book, by following Thomas Kuhn’s seminal work around the concepts of paradigm and scientific revolution, the argument for the Time-Moore strategy (Time-Moore: to use time more) and the paradigm shift from space to time is carried out heavily through philosophical persuasion rather than technical proof due to the difficult challenge of change-of-mindset. The second part of the book provides solid technical materials for supporting this transition from the old paradigm to the new one. In short, the goal of this book is to reevaluate the contemporary practice of microelectronics, identify the cause of the current crisis, advocate a change-of-mindset to circumvent the crisis, and ultimately point out a new route for advancing. After achieving so many unprecedented accomplishments through several decades of relentless endeavor, it’s time for the big ship of Moore’s Law (i.e., the art of microelectronic system design) to make a turn.

Download or read book From Frequency to Time Average Frequency written by Liming Xiu and published by John Wiley & Sons. This book was released on 2015-05-18 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written in a simple, easy to understand style, this book will teach PLL users how to use new clock technology in their work in order to create innovative applications. Investigates the clock frequency concept from a different perspective--at an application level Teaches engineers to use this new clocking technology to create innovations in chip/system level, through real examples extracted from commercial products

Download or read book Electronic Design Automation for IC Implementation Circuit Design and Process Technology written by Luciano Lavagno and published by CRC Press. This book was released on 2017-02-03 with total page 893 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.

Download or read book Resilient Power Electronic Systems written by Shahriyar Kaboli and published by John Wiley & Sons. This book was released on 2022-08-08 with total page 388 pages. Available in PDF, EPUB and Kindle. Book excerpt: Resilient Power Electronic Systems Discover an advanced reference offering a powerful novel approach to the design and use of reliable and fault-tolerant power electronic systems In Resilient Power Electronic Systems, a team of accomplished researchers deliver an insightful treatment of the challenges faced by practitioners and researchers working with power electronic converters and attempting to analyze internal and external failure mechanisms. The authors expertly present advanced techniques for reducing noise effects on fault detection and prognosis. Comprised of thirteen chapters, the authors discuss the concepts of resilience and effective operative life in the context of power electronics. The differences between reliable and efficient systems are discussed, as well as the nature of these differences in complex systems. Finally, the book explores various methods to improve the resilience of power converters. Resilient Power Electronic Systems is packed with features, including illustrations, practice problems, and PowerPoint presentations. The book also includes: A thorough introduction to the application of power electronics in various industries, as well as the concept of resilience in a power converter Comprehensive explorations of resilience against fault tolerance, including fault-tolerant power converters and resilient power converters Practical discussions of the state-of-the-art in resilient power converters, including examinations of mission-critical applications In-depth examinations of internal and external fault in power converters with mission-critical applications Resilient Power Electronic Systems is an indispensable resource for researchers, professionals, and postgraduate students studying power electronics. It’s also an ideal reference for research and development engineers working with the design and development of power electronic converters.

Download or read book Microwave and Millimeter Wave Electronic Packaging written by Rick Sturdivant and published by Artech House. This book was released on 2013-12-01 with total page 281 pages. Available in PDF, EPUB and Kindle. Book excerpt: Packaging of electronic components at microwave and millimeter-wave frequencies requires the same level of engineering effort for lower frequency electronics plus a set of additional activities which are unique due to the higher frequency of operation. This resource presents you with the electronic packaging issues unique to microwave and millimeter-wave frequencies and reviews lower frequency packaging techniques so they can be adapted to higher frequency designs. You are provided with 30 practical examples throughout the book, as well as three free downloadable software analysis programs.

Download or read book Grounds for Grounding written by Elya B. Joffe and published by John Wiley & Sons. This book was released on 2023-01-25 with total page 1220 pages. Available in PDF, EPUB and Kindle. Book excerpt: GROUNDS FOR GROUNDING Gain a comprehensive understanding of all aspects of grounding theory and application in this new, expanded edition Grounding design and installation are crucial to ensure the safety and performance of any electrical or electronic system irrespective of size. Successful grounding design requires a thorough familiarity with theory combined with practical experience with real-world systems. Rarely taught in schools due to its complexity, identifying and implementing the appropriate solution to grounding problems is nevertheless a vital skill in the industrial world for any electrical engineer. In Grounds for Grounding, readers will discover a complete and thorough approach to the topic that blends theory and practice to demonstrate that a few rules apply to many applications. The book provides basic concepts of Electromagnetic Compatibility (EMC) that act as the foundation for understanding grounding theory and its applications. Each avenue of grounding is covered in its own chapter, topics from safety aspects in facilities, lightning, and NEMP to printed circuit board, cable shields, and enclosure grounding, and more. Grounds for Grounding readers will also find: Revised and updated information presented in every chapter New chapters on grounding for generators, uninterruptible power sources (UPSs) New appendices including a grounding design checklist, grounding documentation content, and grounding verification procedures Grounds for Grounding is a useful reference for engineers in circuit design, equipment, and systems, as well as power engineers, platform, and facility designers.

Download or read book Approximation Theory and Analytic Inequalities written by Themistocles M. Rassias and published by Springer Nature. This book was released on 2021-07-21 with total page 546 pages. Available in PDF, EPUB and Kindle. Book excerpt: This contributed volume focuses on various important areas of mathematics in which approximation methods play an essential role. It features cutting-edge research on a wide spectrum of analytic inequalities with emphasis on differential and integral inequalities in the spirit of functional analysis, operator theory, nonlinear analysis, variational calculus, featuring a plethora of applications, making this work a valuable resource. The reader will be exposed to convexity theory, polynomial inequalities, extremal problems, prediction theory, fixed point theory for operators, PDEs, fractional integral inequalities, multidimensional numerical integration, Gauss–Jacobi and Hermite–Hadamard type inequalities, Hilbert-type inequalities, and Ulam’s stability of functional equations. Contributions have been written by eminent researchers, providing up-to-date information and several results which may be useful to a wide readership including graduate students and researchers working in mathematics, physics, economics, operational research, and their interconnections.

Download or read book Coupled Multiscale Simulation and Optimization in Nanoelectronics written by Michael Günther and published by Springer. This book was released on 2015-06-15 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt: Designing complex integrated circuits relies heavily on mathematical methods and calls for suitable simulation and optimization tools. The current design approach involves simulations and optimizations in different physical domains (device, circuit, thermal, electromagnetic) and in a range of electrical engineering disciplines (logic, timing, power, crosstalk, signal integrity, system functionality). COMSON was a Marie Curie Research Training Network created to meet these new scientific and training challenges by (a) developing new descriptive models that take these mutual dependencies into account, (b) combining these models with existing circuit descriptions in new simulation strategies and (c) developing new optimization techniques that will accommodate new designs. The book presents the main project results in the fields of PDAE modeling and simulation, model order reduction techniques and optimization, based on merging the know-how of three major European semiconductor companies with the combined expertise of university groups specialized in developing suitable mathematical models, numerical schemes and e-learning facilities. In addition, a common Demonstrator Platform for testing mathematical methods and approaches was created to assess whether they are capable of addressing the industry’s problems, and to educate young researchers by providing hands-on experience with state-of-the-art problems.