Download or read book IEEE SEMI Advanced Semiconductor Manufacturing Conference and Workshop written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1992 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Semiconductor Manufacturing Handbook written by Hwaiyu Geng and published by McGraw Hill Professional. This book was released on 2005-05-18 with total page 915 pages. Available in PDF, EPUB and Kindle. Book excerpt: WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged with optimizing the design and performance of manufacturing processes will find all the information necessary to produce the highest quality chips at the lowest price in the shortest time possible. The Semiconductor Manufacturing Handbook provides leading-edge information on semiconductor wafer processes, MEMS, nanotechnology, and FPD, plus the latest manufacturing and automation technologies, including: Yield Management Automated Material Handling System Fab and Cleanroom Design and Operation Gas Abatement and Waste Treatment Management And much more Written by 60 international experts, and peer reviewed by a seasoned advisory board, this handbook covers the fundamentals of relevant technology and its real-life application and operational considerations for planning, implementing, and controlling manufacturing processes. It includes hundreds of detailed illustrations and a list of relevant books, technical papers, and websites for further research. This inclusive, wide-ranging coverage makes the Semiconductor Manufacturing Handbook the most comprehensive single-volume reference ever published in the field. STATE-OF-THE-ART SEMICONDUCTOR TECHNOLOGIES AND MANUFACTURING PROCESSES: SEMICONDUCTOR FUNDAMENTALS How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask WAFER PROCESSING TECHNOLOGIES Microlithography * Ion Implantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning FINAL MANUFACTURING Packaging * Grinding, Stress Relief, Dicing * Inspection, Measurement, and Testing NANOTECHNOLOGY, MEMS, AND FPD GAS AND CHEMICALS Specialty Gas System and DCA * Gas Abatement Systems * Chemical and Slurries Delivery System * Ultra Pure Water FAB YIELD, OPERATIONS, AND FACILITIES Yield Management * Automated Materials Handling System * Metrology * Six Sigma * Advanced Process Control * EHS * Fab Design and Construction * Cleanroom * Vibration and Acoustic Control * ESD * Airborne Molecular Control * Particle Monitoring * Wastewater Neutralization Systems

Download or read book Advanced Interconnects for ULSI Technology written by Mikhail Baklanov and published by John Wiley & Sons. This book was released on 2012-02-17 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Download or read book Semiconductor Manufacturing Meeting the Challenges of the Global Marketplace written by Institute of Electrical and Electronics Engineers and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1998 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Industry 4 1 written by Fan-Tien Cheng and published by John Wiley & Sons. This book was released on 2021-10-26 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: Industry 4.1 Intelligent Manufacturing with Zero Defects Discover the future of manufacturing with this comprehensive introduction to Industry 4.0 technologies from a celebrated expert in the field Industry 4.1: Intelligent Manufacturing with Zero Defects delivers an in-depth exploration of the functions of intelligent manufacturing and its applications and implementations through the Intelligent Factory Automation (iFA) System Platform. The book’s distinguished editor offers readers a broad range of resources that educate and enlighten on topics as diverse as the Internet of Things, edge computing, cloud computing, and cyber-physical systems. You’ll learn about three different advanced prediction technologies: Automatic Virtual Metrology (AVM), Intelligent Yield Management (IYM), and Intelligent Predictive Maintenance (IPM). Different use cases in a variety of manufacturing industries are covered, including both high-tech and traditional areas. In addition to providing a broad view of intelligent manufacturing and covering fundamental technologies like sensors, communication standards, and container technologies, the book offers access to experimental data through the IEEE DataPort. Finally, it shows readers how to build an intelligent manufacturing platform called an Advanced Manufacturing Cloud of Things (AMCoT). Readers will also learn from: An introduction to the evolution of automation and development strategy of intelligent manufacturing A comprehensive discussion of foundational concepts in sensors, communication standards, and container technologies An exploration of the applications of the Internet of Things, edge computing, and cloud computing The Intelligent Factory Automation (iFA) System Platform and its applications and implementations A variety of use cases of intelligent manufacturing, from industries like flat-panel, semiconductor, solar cell, automotive, aerospace, chemical, and blow molding machine Perfect for researchers, engineers, scientists, professionals, and students who are interested in the ongoing evolution of Industry 4.0 and beyond, Industry 4.1: Intelligent Manufacturing with Zero Defects will also win a place in the library of laypersons interested in intelligent manufacturing applications and concepts. Completely unique, this book shows readers how Industry 4.0 technologies can be applied to achieve the goal of Zero Defects for all product

Download or read book Istfa 2001 written by ASM International and published by ASM International. This book was released on 2001-01-01 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 2001 International Workshop on System Level Interconnect Prediction written by and published by . This book was released on 2001 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: "The SLIP workshop is a forum for the exchange of ideas at the interface between interconnect technology and physical design ... This year, in recognition of the highly diverse backgrounds and motivations of the attendees, SLIP 2001 has been organized around three mini-tutorials: a review of wire distribution models, a look under the hood of a variety of system level interconnect modeling programs, and back end of line yield modeling. These tutorials set the scene for the paper sessions that follow."--Forward.

Download or read book Integrated Modeling of Chemical Mechanical Planarization for Sub Micron IC Fabrication written by Jianfeng Luo and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 327 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.

Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Download or read book Fabless Semiconductor Manufacturing written by Chinmay K. Maiti and published by CRC Press. This book was released on 2022-11-17 with total page 314 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book deals with 3D nanodevices such as nanowire and nanosheet transistors at 7 nm and smaller technology nodes. It discusses technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices, including III-nitride and RF FDSOI CMOS, for flexible and stretchable electronics. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including fabless intelligent manufacturing. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. In order to extend the role of TCAD in the More-than-Moore era, the design issues related to strain engineering for flexible and stretchable electronics have been introduced for the first time.

Download or read book Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I written by Electrochemical Society. Dielectric Science and Technology Division and published by . This book was released on 1999 with total page 290 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Optical Fiber Telecommunications VA written by Tingye Li and published by Elsevier. This book was released on 2010-07-28 with total page 945 pages. Available in PDF, EPUB and Kindle. Book excerpt: Optical Fiber Telecommunications V (A&B) is the fifth in a series that has chronicled the progress in the research and development of lightwave communications since the early 1970s. Written by active authorities from academia and industry, this edition not only brings a fresh look to many essential topics but also focuses on network management and services. Using high bandwidth in a cost-effective manner for the development of customer applications is a central theme. This book is ideal for R&D engineers and managers, optical systems implementers, university researchers and students, network operators, and the investment community. Volume (A) is devoted to components and subsystems, including: semiconductor lasers, modulators, photodetectors, integrated photonic circuits, photonic crystals, specialty fibers, polarization-mode dispersion, electronic signal processing, MEMS, nonlinear optical signal processing, and quantum information technologies. Volume (B) is devoted to systems and networks, including: advanced modulation formats, coherent systems, time-multiplexed systems, performance monitoring, reconfigurable add-drop multiplexers, Ethernet technologies, broadband access and services, metro networks, long-haul transmission, optical switching, microwave photonics, computer interconnections, and simulation tools. Biographical Sketches Ivan Kaminow retired from Bell Labs in 1996 after a 42-year career. He conducted seminal studies on electrooptic modulators and materials, Raman scattering in ferroelectrics, integrated optics, semiconductor lasers (DBR , ridge-waveguide InGaAsP and multi-frequency), birefringent optical fibers, and WDM networks. Later, he led research on WDM components (EDFAs, AWGs and fiber Fabry-Perot Filters), and on WDM local and wide area networks. He is a member of the National Academy of Engineering and a recipient of the IEEE/OSA John Tyndall, OSA Charles Townes and IEEE/LEOS Quantum Electronics Awards. Since 2004, he has been Adjunct Professor of Electrical Engineering at the University of California, Berkeley. Tingye Li retired from AT&T in 1998 after a 41-year career at Bell Labs and AT&T Labs. His seminal work on laser resonator modes is considered a classic. Since the late 1960s, He and his groups have conducted pioneering studies on lightwave technologies and systems. He led the work on amplified WDM transmission systems and championed their deployment for upgrading network capacity. He is a member of the National Academy of Engineering and a foreign member of the Chinese Academy of Engineering. He is a recipient of the IEEE David Sarnoff Award, IEEE/OSA John Tyndall Award, OSA Ives Medal/Quinn Endowment, AT&T Science and Technology Medal, and IEEE Photonics Award. Alan Willner has worked at AT&T Bell Labs and Bellcore, and he is Professor of Electrical Engineering at the University of Southern California. He received the NSF Presidential Faculty Fellows Award from the White House, Packard Foundation Fellowship, NSF National Young Investigator Award, Fulbright Foundation Senior Scholar, IEEE LEOS Distinguished Lecturer, and USC University-Wide Award for Excellence in Teaching. He is a Fellow of IEEE and OSA, and he has been President of the IEEE LEOS, Editor-in-Chief of the IEEE/OSA J. of Lightwave Technology, Editor-in-Chief of Optics Letters, Co-Chair of the OSA Science & Engineering Council, and General Co-Chair of the Conference on Lasers and Electro-Optics.

Download or read book Micro Manufacturing Technologies and Their Applications written by Irene Fassi and published by Springer. This book was released on 2017-01-31 with total page 301 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides in-depth theoretical and practical information on recent advances in micro-manufacturing technologies and processes, covering such topics as micro-injection moulding, micro-cutting, micro-EDM, micro-assembly, micro-additive manufacturing, moulded interconnected devices, and microscale metrology. It is designed to provide complementary material for the related e-learning platform on micro-manufacturing developed within the framework of the Leonardo da Vinci project 2013-3748/542424: MIMAN-T: Micro-Manufacturing Training System for SMEs. The book is mainly addressed to technicians and prospective professionals in the sector and will serve as an easily usable tool to facilitate the translation of micro-manufacturing technologies into tangible industrial benefits. Numerous examples are included to assist readers in learning and implementing the described technologies. In addition, an individual chapter is devoted to technological foresight, addressing market analysis and business models for micro-manufacturers.

Download or read book Multiscale Materials Modelling written by Z. X. Guo and published by Elsevier. This book was released on 2007-05-31 with total page 307 pages. Available in PDF, EPUB and Kindle. Book excerpt: Multiscale materials modelling offers an integrated approach to modelling material behaviour across a range of scales from the electronic, atomic and microstructural up to the component level. As a result, it provides valuable new insights into complex structures and their properties, opening the way to develop new, multi-functional materials together with improved process and product designs. Multiscale materials modelling summarises some of the key techniques and their applications.The various chapters cover the spectrum of scales in modelling methodologies, including electronic structure calculations, mesoscale and continuum modelling. The book covers such themes as dislocation behaviour and plasticity as well as the modelling of structural materials such as metals, polymers and ceramics. With its distinguished editor and international team of contributors, Multiscale materials modelling is a valuable reference for both the modelling community and those in industry wanting to know more about how multiscale materials modelling can help optimise product and process design. - Reviews the principles and applications of mult-scale materials modelling - Covers themes such as dislocation behaviour and plasticity and the modelling of structural materials - Examines the spectrum of scales in modelling methodologies, including electronic structure calculations, mesoscale and continuum modelling

Download or read book Touch Based Human Machine Interaction written by Shuo Gao and published by Springer Nature. This book was released on 2021-03-25 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt: This textbook presents a comprehensive treatment of touch technologies, explaining current mainstream and new contact/non-contact based human-machine interactivity (HMI) techniques, which are ubiquitous in modern electronic devices and allow machines to exchange information with users in an efficient and reliable manner. The book provides a detailed study of HMI working principles and practical product examples. Haptic, which has become essential for users to gain immersive experience, is also discussed. The book concludes with an overview of novel applications enabled by emerging technologies, such as advanced materials, virtual reality and machine learning, providing a roadmap for possible development trends for touch interactivities. The book can be used as a graduate text for students in display and touch interface technology courses in electrical and computer engineering, and a professional reference for researchers, practicing engineers, and product designers working in broad areas of engineering. Helps students understand the working principles of current touch technologies; Offers design considerations for prototypes and products; Provides seamless connectivity between broad subject areas involved in HMI, including material science, microelectronic circuits, mechanical engineering, and digital signal processing.

Download or read book Modeling Uncertainty written by Moshe Dror and published by Springer. This book was released on 2019-11-05 with total page 782 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modeling Uncertainty: An Examination of Stochastic Theory, Methods, and Applications, is a volume undertaken by the friends and colleagues of Sid Yakowitz in his honor. Fifty internationally known scholars have collectively contributed 30 papers on modeling uncertainty to this volume. Each of these papers was carefully reviewed and in the majority of cases the original submission was revised before being accepted for publication in the book. The papers cover a great variety of topics in probability, statistics, economics, stochastic optimization, control theory, regression analysis, simulation, stochastic programming, Markov decision process, application in the HIV context, and others. There are papers with a theoretical emphasis and others that focus on applications. A number of papers survey the work in a particular area and in a few papers the authors present their personal view of a topic. It is a book with a considerable number of expository articles, which are accessible to a nonexpert - a graduate student in mathematics, statistics, engineering, and economics departments, or just anyone with some mathematical background who is interested in a preliminary exposition of a particular topic. Many of the papers present the state of the art of a specific area or represent original contributions which advance the present state of knowledge. In sum, it is a book of considerable interest to a broad range of academic researchers and students of stochastic systems.

Download or read book Tribology for Scientists and Engineers written by Pradeep L. Menezes and published by Springer Science & Business Media. This book was released on 2013-12-04 with total page 940 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes available tribology technologies and introdces a comprehensive overview of tribology. General, up-to-date knowledge on how tribology is approached in various related areas of research, both experimental and computational is provided.