Download or read book Twenty Third IEEE CPMT International Electronics Manufacturing Technology Symposium written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1998-01-01 with total page 491 pages. Available in PDF, EPUB and Kindle. Book excerpt: The IEMT is an international forum for presenting research, development and applications of manufacturing technology and systems for use in the manufacture of electronic components, assemblies, and systems.

Download or read book 1998 IEEE CPMT 22nd International Electronics Manufacturing Technology Symposium written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1998 with total page 165 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text on electronics manufacturing technology covers such topics as: new materials, including substrates, metallization, encapsulants and fatigue-resistant solder; test and reliability; thermal management; mechantronics; MCMs; sensors; and flip chip in automotive use.

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Download or read book Twenty Seventh Annual IEEE CPMT SEMI International Electronics Manufacturing Technology Symposium proceedings July 17 18 2002 the Fairmont Hotel San Jose CA USA written by IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium and published by . This book was released on 2002 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

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Download or read book Twenty Fourth IEEE CPMT International Electronics Manufacturing Technology Symposium written by and published by . This book was released on 1999 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Twenty First IEEE CPMT International Electronics Manufacturing Technology Symposium October 13 15 1997 Austin TX USA written by Don Millard and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1997 with total page 504 pages. Available in PDF, EPUB and Kindle. Book excerpt: The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.

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Download or read book IEEE CPMT International Electronics Manufacturing Technology Symposium written by and published by . This book was released on 2004 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt:

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Download or read book Handbook of Wafer Bonding written by Peter Ramm and published by John Wiley & Sons. This book was released on 2012-02-13 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

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