Download or read book Zinc Oxide and Related Materials Volume 957 written by Jürgen H. Christen and published by . This book was released on 2007-04-05 with total page 470 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. The topics covered in this volume, first published in 2007, include devices, defects, spintronics and magnetism, growth, optical properties and nanostructures, and doping and processing TFTs.
Download or read book Handbook of Zinc Oxide and Related Materials written by Zhe Chuan Feng and published by Taylor & Francis. This book was released on 2012-09-26 with total page 563 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through their application in energy-efficient and environmentally friendly devices, zinc oxide (ZnO) and related classes of wide gap semiconductors, including GaN and SiC, are revolutionizing numerous areas, from lighting, energy conversion, photovoltaics, and communications to biotechnology, imaging, and medicine. With an emphasis on engineering a
Download or read book Materials Research at High Pressure Volume 987 written by Materials Research Society. Meeting and published by . This book was released on 2007-04-03 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: High-pressure materials research has been revolutionized in the past few years due to technological breakthroughs in the diamond anvil cell (DAC), shock wave compression, and first-principles molecular dynamic simulation (MD) methods. Pressure-induced chemistry and high-pressure synthesis of superhard materials were topics of the successful Symposium DD, High-Pressure Materials Research, held at the 1997 MRS Fall Meeting in Boston. Since then, a plethora of discoveries have been made, including new materials synthesized under high pressure, geophysical-geochemical material conversion and ionization prior to polymerization of molecular solids. Additionally, new experimental and computational techniques, such as in situ studies of materials properties and transformations using laser heating are increasingly providing a deeper insight and a few surprises for the behavior and properties of matter at elevated pressure conditions. This book provides a timely report on progress in the field. Topics include: synthesis and characterization; disordered systems; dense molecular materials; and properties under extreme conditions.
Download or read book Nanorods written by Dr. Orhan Yalçın and published by BoD – Books on Demand. This book was released on 2012-03-09 with total page 254 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book "Nanorods" is an overview of the fundamentals and applications of nanosciences and nanotechnologies. The methods described in this book are very powerful and have practical applications in the subjects of nanorods. The potential applications of nanorods are very attractive for bio-sensor, magneto-electronic, plasmonic state, nano-transistor, data storage media, etc. This book is of interest to both fundamental research such as the one conducted in Physics, Chemistry, Biology, Material Science, Medicine etc., and also to practicing scientists, students, researchers in applied material sciences and engineers.
Download or read book Heterogeneous Integration of Materials for Passive Components and Smart Systems Volume 969 written by Juan C. Nino and published by . This book was released on 2007-05-30 with total page 184 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2007, discusses advances, the current status, and future challenges in the broad area of materials integration for passive components and smart systems.
Download or read book Advanced Electronic Packaging Volume 968 written by Vasudeva P. Atluri and published by . This book was released on 2007-04-09 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging architecture evolutions are being driven by silicon technology advancements and new form factors, used models and emerging technologies. High-performance mobile computer and communication systems will require higher I/O counts, greater density, lower cost, lighter weight and improved performance in the electronic package. The book focuses on silicon technology dimension scaling and performance improvement, Pb-free or 'green' assembly, and system-in-package (SIP) technologies. It explores the key thermomechanical failure modes and mitigating solutions associated with integration of silicon with weak interlayer dielectrics during the assembly process, under bump metallurgy integrity with lead-free assembly, and the impact of stress on die-cracking and transistor performance in 3D thin-die stacking. The interaction of these failures with silicon and assembly materials, processes and design features is covered and includes: system in package; advanced packaging/nanotechnology in packaging; physical behavior and mechanical behavior in packaging; electromigration and thermal behavior in packaging and thin films and adhesives in packaging.
Download or read book Solid State Ionics 2006 Volume 972 written by E. Traversa and published by Mrs Proceedings. This book was released on 2007-04-02 with total page 448 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Metal and Metal Oxides for Energy and Electronics written by Saravanan Rajendran and published by Springer Nature. This book was released on 2020-10-05 with total page 413 pages. Available in PDF, EPUB and Kindle. Book excerpt: Energy is a key world issue in the context of climate change and increasing population, 'calling for alternative fuels, better energy storage, and energy-saving devices. This books reviews the principles and applications of metals and metal oxides for energy, with focus on batteries, electrodes, nanomaterials, electronics, supercapacitors, biofuels and sensors.
Download or read book Group IV Semiconductor Nanostructures 2006 Volume 958 written by Leonid Tsybeskov and published by . This book was released on 2007-03-28 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on advances in materials science and device applications of nanostructures composed of Si, Ge, diamond, SiGe and SiCGe. Continuous progress in the development of reproducibly grown quantum dots, wires and wells has produced a new class of functional materials and devices with characteristic dimensions less than 50nm. The broad spectrum of these devices ranges from commercially offered high-mobility transistors using strained Si to exploratory SiGe nanostructures for integrated optical interconnects and THz lasers. This book brings together researchers from chemistry, physics, biology, materials science and engineering to share and discuss both the challenges and progress towards a new generation of Si(SiGe, SiCGe)-based novel functional structures and devices. Topics include: light emission and photonic devices; Ge, SiGe and diamond nanostructures; strains, Si/Ge films and layers and Si nanocrystals.
Download or read book Enabling Technologies for 3 D Integration Volume 970 written by Christopher A. Bower and published by . This book was released on 2007-03-30 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt: An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. The 3-D concept of replacing long 2-D interconnects with shorter vertical (3-D) interconnects has the potential to alleviate the well-known interconnect (RC) delay problem facing the semiconductor industry. Additional benefits of the 3-D concept for the IC maker include reduced die size and the ability to use distinct technologies (analog, logic, RF, etc...) on separate vertically interconnected layers. The 3-D concept, therefore, allows the integration of otherwise incompatible technologies, and offers significant advantages in performance, functionality, and form factor. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; applications of 3-D integration; through wafer interconnects for 3-D packaging and interposer applications; bonding technology for 3-D integration; and enabling processes for 3-D integration.
Download or read book Actinides 2006 basic Science Applications and Technology written by Materials Research Society. Meeting and published by . This book was released on 2007 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Diamond Electronics fundamentals to Applications written by Philippe Bergonzo and published by . This book was released on 2007 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Intermetallic based Alloys written by Jörg Wiezorek and published by . This book was released on 2007 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Scientific Basis for Nuclear Waste Management XXX written by Darrel E. Dunn and published by . This book was released on 2007 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Solid State Ionics written by and published by . This book was released on 2006 with total page 448 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Scientific Basis for Nuclear Waste Management written by and published by . This book was released on 2007 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Zinc Oxide Materials and Devices IV written by and published by . This book was released on 2008 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
