Download or read book Yield reliability Modeling for Integrated Circuits written by Thomas S. Barnett and published by . This book was released on 2002 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability yield Allocation for Semiconductor Integrated Circuits written by Chunghun Ha and published by . This book was released on 2005 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This research develops yield and reliability models for fault-tolerant semiconductor integrated circuits and develops optimization algorithms that can be directly applied to these models. Since defects cause failures in microelectronics systems, accurate yield and reliability models considering these defects as well as optimization techniques determining efficient defect-tolerant schemes are essential in semiconductor manufacturing and nanomanufacturing to ensure manufacturability and productivity. The defect-based yield model considers various types of failures, fault-tolerant schemes such as hierarchical redundancy and error correcting code, and burn-in effects, simultaneously. The reliability model counts on carry-over single-cell failures accompanied by the failure rate of the semiconductor integrated circuits under the assumption of an error correcting code policy. The redundancy allocation problem, which seeks to find an optimal allocation of redundancy that maximizes system reliability, is one of the representative problems in reliability optimization. The problem is typically formulated as a nonconvex integer nonlinear programming problem that is nonseparable and coherent. Two iterative heuristics, tree and scanning heuristics, and variants are studied to obtain local optima and a branch-and-bound algorithm is proposed to find the global optimum for redundancy allocation problems. The proposed algorithms engage a multiple-search paths strategy to accelerate efficiency. Experimental results of these algorithms indicate that they are superior to the existing algorithms in terms of computation time and solution quality. An example of memory semiconductor integrated circuits is presented to show the applicability of both the yield and reliability models and the optimization algorithms to fault-tolerant semiconductor integrated circuits.
Download or read book Reliability Yield and Stress Burn In written by Way Kuo and published by Springer Science & Business Media. This book was released on 2013-11-27 with total page 407 pages. Available in PDF, EPUB and Kindle. Book excerpt: The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.
Download or read book Guidebook for Managing Silicon Chip Reliability written by Michael Pecht and published by CRC Press. This book was released on 2017-11-22 with total page 228 pages. Available in PDF, EPUB and Kindle. Book excerpt: Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future? Chapters discuss: failure sites, operational loads, and failure mechanism intrinsic device sensitivities electromigration hot carrier aging time dependent dielectric breakdown mechanical stress induced migration alpha particle sensitivity electrostatic discharge (ESD) and electrical overstress latch-up qualification screening guidelines for designing reliability Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.
Download or read book Yield Simulation for Integrated Circuits written by D.M. Walker and published by Springer Science & Business Media. This book was released on 2013-04-17 with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the summer of 1981 I was asked to consider the possibility of manufacturing a 600,000 transistor microprocessor in 1985. It was clear that the technology would only be capable of manufacturing 100,000-200,000 transistor chips with acceptable yields. The control store ROM occupied approximately half of the chip area, so I considered adding spare rows and columns to increase ROM yield. Laser-programmed polysilicon fuses would be used to switch between good and bad circuits. Since only half the chip area would have redundancy, I was concerned that the increase in yield would not outweigh the increased costs of testing and redundancy programming. The fabrication technology did not yet exist, so I was unable to experimentally verify the benefits of redundancy. When the technology did become available, it would be too late in the development schedule to spend time running test chips. The yield analysis had to be done analytically or by simulation. Analytic yield analysis techniques did not offer sufficient accuracy for dealing with complex structures. The simulation techniques then available were very labor-intensive and seemed more suitable for redundant memories and other very regular structures [Stapper 80J. I wanted a simulator that would allow me to evaluate the yield of arbitrary redundant layouts, hence I termed such a simulator a layout or yield simulator. Since I was unable to convince anyone to build such a simulator for me, I embarked on the research myself.
Download or read book Lifetime Reliability aware Design of Integrated Circuits written by Mohsen Raji and published by Springer Nature. This book was released on 2022-11-16 with total page 113 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the state-of-the-art research in design of modern electronic systems used in safety-critical applications such as medical devices, aircraft flight control, and automotive systems. The authors discuss lifetime reliability of digital systems, as well as an overview of the latest research in the field of reliability-aware design of integrated circuits. They address modeling approaches and techniques for evaluation and improvement of lifetime reliability for nano-scale CMOS digital circuits, as well as design algorithms that are the cornerstone of Computer Aided Design (CAD) of reliable VLSI circuits. In addition to developing lifetime reliability analysis and techniques for clocked storage elements (such as flip-flops), the authors also describe analysis and improvement strategies targeting commercial digital circuits.
Download or read book Springer Handbook of Engineering Statistics written by Hoang Pham and published by Springer Science & Business Media. This book was released on 2006 with total page 1135 pages. Available in PDF, EPUB and Kindle. Book excerpt: In today’s global and highly competitive environment, continuous improvement in the processes and products of any field of engineering is essential for survival. This book gathers together the full range of statistical techniques required by engineers from all fields. It will assist them to gain sensible statistical feedback on how their processes or products are functioning and to give them realistic predictions of how these could be improved. The handbook will be essential reading for all engineers and engineering-connected managers who are serious about keeping their methods and products at the cutting edge of quality and competitiveness.
Download or read book Modeling of Integrated Circuit Interconnect Dielectric Reliability Based on the Physical Design Characteristics written by Changsoo Hong and published by . This book was released on 2006 with total page 128 pages. Available in PDF, EPUB and Kindle. Book excerpt: These characteristics include such factors as layout geometry, pattern density, pattern orientation, and via placement. The physical breakdown mechanism for porous back-end dielectric films is also to be investigated using Monte Carlo simulation. It is shown that the electric field is enhanced by porosity in ultra-low-k dielectric films. The electric field enhancement caused by the porosity is shown to accelerate the charge transport.
Download or read book Materials and Reliability Handbook for Semiconductor Optical and Electron Devices written by Osamu Ueda and published by Springer Science & Business Media. This book was released on 2012-09-22 with total page 618 pages. Available in PDF, EPUB and Kindle. Book excerpt: Materials and Reliability Handbook for Semiconductor Optical and Electron Devices provides comprehensive coverage of reliability procedures and approaches for electron and photonic devices. These include lasers and high speed electronics used in cell phones, satellites, data transmission systems and displays. Lifetime predictions for compound semiconductor devices are notoriously inaccurate due to the absence of standard protocols. Manufacturers have relied on extrapolation back to room temperature of accelerated testing at elevated temperature. This technique fails for scaled, high current density devices. Device failure is driven by electric field or current mechanisms or low activation energy processes that are masked by other mechanisms at high temperature. The Handbook addresses reliability engineering for III-V devices, including materials and electrical characterization, reliability testing, and electronic characterization. These are used to develop new simulation technologies for device operation and reliability, which allow accurate prediction of reliability as well as the design specifically for improved reliability. The Handbook emphasizes physical mechanisms rather than an electrical definition of reliability. Accelerated aging is useful only if the failure mechanism is known. The Handbook also focuses on voltage and current acceleration stress mechanisms.
Download or read book In line Characterization Yield Reliability and Failure Analysis in Microelectronics Manufacturing written by and published by . This book was released on 1999 with total page 360 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Computer Engineering Handbook written by Vojin G. Oklobdzija and published by CRC Press. This book was released on 2001-12-26 with total page 1409 pages. Available in PDF, EPUB and Kindle. Book excerpt: There is arguably no field in greater need of a comprehensive handbook than computer engineering. The unparalleled rate of technological advancement, the explosion of computer applications, and the now-in-progress migration to a wireless world have made it difficult for engineers to keep up with all the developments in specialties outside their own
Download or read book A Systematic Approach to Modeling Yield for Integrated Circuits written by Aparna Srinivasan and published by . This book was released on 1995 with total page 179 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Reliability 91 written by R.H. Matthews and published by CRC Press. This book was released on 2018-05-04 with total page 880 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a collection of papers presented at the International Conference on Reliability Techniques and their Application.Reliability 91, 10-12 June 1991 was held at the Royal Lancaster Hotel, London, UK, organised by SRD (the Safety and Reliability Consultants of AEA Technology) and the institution of Quality Assurance (IQA), and supported by the European Safety and Reliability Association (ESRA).
Download or read book System on Chip written by Bashir M. Al-Hashimi and published by IET. This book was released on 2006-01-31 with total page 940 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights both the key achievements of electronic systems design targeting SoC implementation style, and the future challenges presented by the continuing scaling of CMOS technology.
Download or read book Defect and Fault Tolerance in VLSI Systems written by C.H. Stapper and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an "International Workshop on Designing for Yield" at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the "IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems" in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.
Download or read book Introduction to VLSI Design Flow written by Sneh Saurabh and published by Cambridge University Press. This book was released on 2023-06-09 with total page 983 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer Science & Business Media. This book was released on 2006-06-01 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
