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Download or read book WESCON Conference Proceedings written by and published by . This book was released on 1998 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Wescon 95 written by and published by Institute of Electrical & Electronics Engineers(IEEE). This book was released on 1995 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt:

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Download or read book Proceedings of the Technical Conference written by and published by . This book was released on 1991 with total page 664 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Dynamics of Meteor Outbursts and Satellite Mitigation Strategies written by Glenn E. Peterson and published by AIAA. This book was released on 1999 with total page 622 pages. Available in PDF, EPUB and Kindle. Book excerpt: The potential threat posed by Leonid meteroids to orbiting spacecraft over the next several years calls for new dynamic mitigation strategies to assist the satellite community in reducing the danger to its vehicles. This book offers deliberate dynamic mitigation strategies to complement the traditional shielding strategies, providing mission operators additional ways to decrease the danger. Five different attitude control and orbit maneuvering options are examined in detail. The information is presented in algorithmic form to allow technically competent, but meteoroid inexperienced, operators to easily understand the phenomena, assess the danger, and implement procedures. Although general in scope, the book emphasizes the Leonid meteor events of the 1998-2002 timeframe.

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Download or read book Conference Record written by Shu-Park Chan and published by . This book was released on 1980 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

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