Download or read book Wafer Bonding for Fabrication of Three dimensional Photonic Band Gap Crystals written by Shi-Di Cheng and published by . This book was released on 1998 with total page 146 pages. Available in PDF, EPUB and Kindle. Book excerpt: By reducing the anneal times and In content in (Ga, In)As alloys, the overall transmission intensities have been improved over the entire spectrum, particularly at higher frequencies. Using wafer fusion bonding techniques, we have successfully constructed multi-layer structures with PBG dimensions at micron length scales. With improved stacking interfaces, wafer bonding and micromachining techniques provide a promising way to realize photonic crystals with stop bands around 10 [Mu]m.
Download or read book Wafer Bonding written by Marin Alexe and published by Springer Science & Business Media. This book was released on 2013-03-09 with total page 510 pages. Available in PDF, EPUB and Kindle. Book excerpt: The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
Download or read book Photonic Crystals Theory Applications and Fabrication written by Dennis W Prather and published by John Wiley & Sons. This book was released on 2009-05-26 with total page 417 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Only Source You Need for Understanding the Design and Applications of Photonic Crystal-Based Devices This book presents in detail the fundamental theoretical background necessary to understand the unique optical phenomena arising from the crystalline nature of photonic-crystal structures and their application across a range of disciplines. Organized to take readers from basic concepts to more advanced topics, the book covers: Preliminary concepts of electromagnetic waves and periodic media Numerical methods for analyzing photonic-crystal structures Devices and applications based on photonic bandgaps Engineering photonic-crystal dispersion properties Fabrication of two- and three-dimensional photonic crystals The authors assume an elementary knowledge of electromagnetism, vector calculus, Fourier analysis, and complex number analysis. Therefore, the book is appropriate for advanced undergraduate students in physics, applied physics, optics, electronics, and chemical and electrical engineering, as well as graduate students and researchers in these fields.
Download or read book Handbook of Wafer Bonding written by Peter Ramm and published by John Wiley & Sons. This book was released on 2012-02-13 with total page 435 pages. Available in PDF, EPUB and Kindle. Book excerpt: The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
Download or read book Fabrication and charcterization of defect cavities in three dimensional photonic band gap materials written by Isabelle Staude and published by . This book was released on 2007 with total page 112 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Technology and Application of Aligned Wafer Bonding for Three Dimensional Microstructures and Microdevices written by Ismail Mohd. Salleh and published by . This book was released on 1993 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2004 with total page 820 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Fabrication of 3 D Photonic Band Gap Structures written by Xiaofeng Tang and published by . This book was released on 1996 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Japanese Journal of Applied Physics written by and published by . This book was released on 2001 with total page 410 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book JJAP written by and published by . This book was released on 2000 with total page 574 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Photonic Crystals written by Kurt Busch and published by John Wiley & Sons. This book was released on 2006-05-12 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt: The majority of the contributions in this topically edited book stems from the priority program SPP 1113 "Photonische Kristalle" run by the Deutsche Forschungsgemeinschaft (DFG), resulting in a survey of the current state of photonic crystal research in Germany. The first part of the book describes methods for the theoretical analysis of their optical properties as well as the results. The main part is dedicated to the fabrication, characterization and modeling of two- and three-dimensional photonic crystals, while the final section presents a wide spectrum of applications: gas sensors, micro-lasers, and photonic crystal fibers. Illustrated in full color, this book is not only of interest to advanced students and researchers in physics, electrical engineering, and material science, but also to company R&D departments involved in photonic crystal-related technological developments.
Download or read book Photonic Band Gap Materials written by C.M. Soukoulis and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 725 pages. Available in PDF, EPUB and Kindle. Book excerpt: Photonic band gap crystals offer unique ways to tailor light and the propagation of electromagnetic waves. In analogy to electrons in a crystal, EM waves propagating in a structure with a periodically-modulated dielectric constant are organized into photonic bands separated by gaps in which propagating states are forbidden. Proposed applications of such photonic band gap crystals, operating at frequencies from microwave to optical, include zero- threshold lasers, low-loss resonators and cavities, and efficient microwave antennas. Spontaneous emission is suppressed for photons in the photonic band gap, offering novel approaches to manipulating the EM field and creating high-efficiency light-emitting structures. Photonic Band Gap Materials identifies three most promising areas of research. The first is materials fabrication, involving the creation of high quality, low loss, periodic dielectric structures. The smallest photonic crystals yet fabricated have been made by machining Si wafers along (110), and some have lattice constants as small as 500 microns. The second area is in applications. Possible applications presented are microwave mirrors, directional antennas, resonators (especially in the 2 GHz region), filters, waveguides, Y splitters, and resonant microcavities. The third area covers fundamentally new physical phenomena in condensed matter physics and quantum optics. An excellent review of recent development, covering theoretical, experimental and applied aspects. Interesting and stimulating reading for active researchers, as well as a useful reference for non-specialists.
Download or read book Systematic Low Temperature Bonding and Its Application to the Hydrogen Ion Cut Process and Three dimensional Structures written by Yang Li and published by . This book was released on 1999 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Copper Wafer Bonding in Three dimensional Integration written by Kuan-Neng Chen and published by . This book was released on 2005 with total page 176 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration, in which multiple layers of devices are stacked with high density of interconnects between the layers, offers solutions for problems when the critical dimensions in integrated circuits keep shrinking. Copper wafer bonding has been considered as a strong candidate for fabrication of three-dimensional integrated circuits (3-D IC). This thesis work involves fundamental studies of copper wafer bonding and bonding performance of bonded interconnects. Copper bonded wafers exhibit good bonding qualities and present no original bonding interfaces when the bonding process occurs at 400°C/4000 mbar for 30 min, followed by nitrogen anneal at 400°C for 30 min. Oxide distribution in the bonded layer is uniform and sparse. Evolution of microstructure morphologies and grain orientations of copper bonded wafers during bonding and annealing were studied. The bonded layer reaches steady state after post-bonding anneal. The microstructure morphologies and bond strengths of copper bonded wafers under different bonding conditions were investigated. A map summarizing these results provides a useful reference on process conditions suitable for three-dimensional integration based on copper wafer bonding. Similar microstructure morphology of copper bonded interconnects was observed to that of copper bonded wafers. Specific contact resistances of bonded interconnects of approximately 10−8 [ohms]-cm2 were measured by using a novel test structure which can eliminate the errors from misalignment during bonding. The bonding qualities of different interconnect sizes and densities have been investigated. In addition to increasing the bonding temperature and duration, options such as larger interconnect sizes, total bonding area, or use of dummy pads for bonding in the unused area improve the quality of bonded interconnects. Process development of silicon layer stacking based on Cu wafer bonding was successfully applied to demonstrate a strong four-layer-stack structure. Bonded Cu layers in this structure become homogeneous layers and do not show original bonding interfaces. This process can be reliably applied in three-dimensional integration applications.
Download or read book American Doctoral Dissertations written by and published by . This book was released on 1998 with total page 784 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Wafer Bonding for Three Dimensional 3D Integration written by Yongchai Kwon and published by . This book was released on 2003 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Summaries of Papers Presented at the Conference on Lasers and Electro optics written by and published by . This book was released on 2000 with total page 752 pages. Available in PDF, EPUB and Kindle. Book excerpt:
