Download or read book Heat Transfer written by Younes Shabany and published by CRC Press. This book was released on 2009-12-17 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use

Download or read book Thermal Management of Gallium Nitride Electronics written by Marko Tadjer and published by Woodhead Publishing. This book was released on 2022-07-13 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management of Gallium Nitride Electronics outlines the technical approaches undertaken by leaders in the community, the challenges they have faced, and the resulting advances in the field. This book serves as a one-stop reference for compound semiconductor device researchers tasked with solving this engineering challenge for future material systems based on ultra-wide bandgap semiconductors. A number of perspectives are included, such as the growth methods of nanocrystalline diamond, the materials integration of polycrystalline diamond through wafer bonding, and the new physics of thermal transport across heterogeneous interfaces. Over the past 10 years, the book's authors have performed pioneering experiments in the integration of nanocrystalline diamond capping layers into the fabrication process of compound semiconductor devices. Significant research efforts of integrating diamond and GaN have been reported by a number of groups since then, thus resulting in active thermal management options that do not necessarily lead to performance derating to avoid self-heating during radio frequency or power switching operation of these devices. Self-heating refers to the increased channel temperature caused by increased energy transfer from electrons to the lattice at high power. This book chronicles those breakthroughs. - Includes the fundamentals of thermal management of wide-bandgap semiconductors, with historical context, a review of common heating issues, thermal transport physics, and characterization methods - Reviews the latest strategies to overcome heating issues through materials modeling, growth and device design strategies - Touches on emerging, real-world applications for thermal management strategies in power electronics

Download or read book Heat Pipes written by David Reay and published by Butterworth-Heinemann. This book was released on 2013-10-01 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat Pipes, Sixth Edition, takes a highly practical approach to the design and selection of heat pipes, making it an essential guide for practicing engineers and an ideal text for postgraduate students.This new edition has been revised to include new information on the underlying theory of heat pipes and heat transfer, and features fully updated applications, new data sections, and updated chapters on design and electronics cooling. The book is a useful reference for those with experience and an accessible introduction for those approaching the topic for the first time. - Contains all information required to design and manufacture a heat pipe - Suitable for use as a professional reference and graduate text - Revised with greater coverage of key electronic cooling applications

Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Download or read book Science of Fullerenes and Carbon Nanotubes written by M. S. Dresselhaus and published by Elsevier. This book was released on 1996-03-20 with total page 985 pages. Available in PDF, EPUB and Kindle. Book excerpt: The discovery of fullerenes (also known as buckyballs) has generated tremendous excitement and opened up a new field of carbon chemistry. As the first book available on this topic, this volume will be a landmark reference in the field. Because buckyballs are essentially closed hollow cages made up of carbon atoms, they can be manipulated in a variety of ways to yield never-before-seen materials. The balls can, for instance, be doped with atoms or pulled out into tubules and filled with lead to provide properties of high-temperature superconductivity. Researchers can now create their own buckyballs in a process that is almost as simple as making soot, making this research as inexpensive as it is exotic (which has doubtless contributed to its popularity). Researchers anticipate that fullerenes will offer boundless opportunities in the development of new products, drugs and materials.Science of Fullerenes and Carbon Nanotubes introduces materials scientists, chemists, and solid state physicists to the field of fullerenes, and discusses the unique properties and applications. both current and future, of all classes of fullerenes.Key Features* First comprehensive resource on fullerenes and their applications* Provides an introduction to the topic* Presents an extensive discussion of current and future applications of Fullerenes* Covers all classes of fullerenes

Download or read book CRC Handbook of Thermal Engineering written by Raj P. Chhabra and published by CRC Press. This book was released on 2017-11-08 with total page 1649 pages. Available in PDF, EPUB and Kindle. Book excerpt: The CRC Handbook of Thermal Engineering, Second Edition, is a fully updated version of this respected reference work, with chapters written by leading experts. Its first part covers basic concepts, equations and principles of thermodynamics, heat transfer, and fluid dynamics. Following that is detailed coverage of major application areas, such as bioengineering, energy-efficient building systems, traditional and renewable energy sources, food processing, and aerospace heat transfer topics. The latest numerical and computational tools, microscale and nanoscale engineering, and new complex-structured materials are also presented. Designed for easy reference, this new edition is a must-have volume for engineers and researchers around the globe.

Download or read book Qpedia Thermal Management Electronics Cooling Book Volume 3 written by Advanced Thermal Solutions and published by Advanced Thermal Solutions. This book was released on 2009 with total page 204 pages. Available in PDF, EPUB and Kindle. Book excerpt: The complete editorial contents of Qpedia Thermal eMagazine, Volume 3, Issues 1 - 12 features in-depth, technical articles covering the most critical areas of electronics cooling.

Download or read book Qpedia Thermal Management Electronics Cooling Book Volume 2 written by Advanced Thermal Solutions and published by Advanced Thermal Solutions. This book was released on 2008 with total page 206 pages. Available in PDF, EPUB and Kindle. Book excerpt: The complete editorial contents of Qpedia Thermal eMagazine, Volume 2, Issues 1 - 12 features in-depth, technical articles on the most critical topics in the thermal management of electronics.

Download or read book Thermal Management for Opto electronics Packaging and Applications written by Xiaobing Luo and published by John Wiley & Sons. This book was released on 2024-08-12 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

Download or read book Thermal Management of Microelectronic Equipment written by Lian-Tuu Yeh and published by American Society of Mechanical Engineers. This book was released on 2002 with total page 454 pages. Available in PDF, EPUB and Kindle. Book excerpt: With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.

Download or read book Thermal Management Materials for Electronic Packaging written by Xingyou Tian and published by John Wiley & Sons. This book was released on 2023-12-12 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management Materials for Electronic Packaging Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance. The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area. Sample topics covered in Thermal Management Materials for Electronic Packaging include: Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solids Definition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materials Synthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structure Assembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluation Thermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.

Download or read book Thermal Energy written by Yatish T. Shah and published by CRC Press. This book was released on 2018-01-12 with total page 854 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book details sources of thermal energy, methods of capture, and applications. It describes the basics of thermal energy, including measuring thermal energy, laws of thermodynamics that govern its use and transformation, modes of thermal energy, conventional processes, devices and materials, and the methods by which it is transferred. It covers 8 sources of thermal energy: combustion, fusion (solar) fission (nuclear), geothermal, microwave, plasma, waste heat, and thermal energy storage. In each case, the methods of production and capture and its uses are described in detail. It also discusses novel processes and devices used to improve transfer and transformation processes.

Download or read book Advances in Heat Transfer written by and published by Academic Press. This book was released on 2015-10-27 with total page 462 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Heat Transfer fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts. The articles, which serve as a broad review for experts in the field are also of great interest to non-specialists who need to keep up-to-date with the results of the latest research. This serial is essential reading for all mechanical, chemical, and industrial engineers working in the field of heat transfer, or in graduate schools or industry. - Compiles the expert opinions of leaders in the industry - Fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts - Essential reading for all mechanical, chemical, and industrial engineers working in the field of heat transfer, or in graduate schools or industry

Download or read book Handbook for Sound Engineers written by Glen Ballou and published by CRC Press. This book was released on 2015-03-05 with total page 1784 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook for Sound Engineers is the most comprehensive reference available for audio engineers, and is a must read for all who work in audio. With contributions from many of the top professionals in the field, including Glen Ballou on interpretation systems, intercoms, assistive listening, and fundamentals and units of measurement, David Miles Huber on MIDI, Bill Whitlock on audio transformers and preamplifiers, Steve Dove on consoles, DAWs, and computers, Pat Brown on fundamentals, gain structures, and test and measurement, Ray Rayburn on virtual systems, digital interfacing, and preamplifiers, Ken Pohlmann on compact discs, and Dr. Wolfgang Ahnert on computer-aided sound system design and room-acoustical fundamentals for auditoriums and concert halls, the Handbook for Sound Engineers is a must for serious audio and acoustic engineers. The fifth edition has been updated to reflect changes in the industry, including added emphasis on increasingly prevalent technologies such as software-based recording systems, digital recording using MP3, WAV files, and mobile devices. New chapters, such as Ken Pohlmann’s Subjective Methods for Evaluating Sound Quality, S. Benjamin Kanters’s Hearing Physiology—Disorders—Conservation, Steve Barbar’s Surround Sound for Cinema, Doug Jones’s Worship Styles in the Christian Church, sit aside completely revamped staples like Ron Baker and Jack Wrightson’s Stadiums and Outdoor Venues, Pat Brown’s Sound System Design, Bob Cordell’s Amplifier Design, Hardy Martin’s Voice Evacuation/Mass Notification Systems, and Tom Danley and Doug Jones’s Loudspeakers. This edition has been honed to bring you the most up-to-date information in the many aspects of audio engineering.

Download or read book Thermal Management of Electronic Systems II written by E. Beyne and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.

Download or read book Modeling and Characterization of RF and Microwave Power FETs written by Peter Aaen and published by Cambridge University Press. This book was released on 2007-06-25 with total page 375 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a comprehensive exposition of FET modeling, and is a must-have resource for seasoned professionals and new graduates in the RF and microwave power amplifier design and modeling community. In it, you will find descriptions of characterization and measurement techniques, analysis methods, and the simulator implementation, model verification and validation procedures that are needed to produce a transistor model that can be used with confidence by the circuit designer. Written by semiconductor industry professionals with many years' device modeling experience in LDMOS and III-V technologies, this was the first book to address the modeling requirements specific to high-power RF transistors. A technology-independent approach is described, addressing thermal effects, scaling issues, nonlinear modeling, and in-package matching networks. These are illustrated using the current market-leading high-power RF technology, LDMOS, as well as with III-V power devices.

Download or read book Reliability Technology written by Norman Pascoe and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 420 pages. Available in PDF, EPUB and Kindle. Book excerpt: A unique book that describes the practical processes necessary to achieve failure free equipment performance, for quality and reliability engineers, design, manufacturing process and environmental test engineers. This book studies the essential requirements for successful product life cycle management. It identifies key contributors to failure in product life cycle management and particular emphasis is placed upon the importance of thorough Manufacturing Process Capability reviews for both in-house and outsourced manufacturing strategies. The readers? attention is also drawn to the many hazards to which a new product is exposed from the commencement of manufacture through to end of life disposal. Revolutionary in focus, as it describes how to achieve failure free performance rather than how to predict an acceptable performance failure rate (reliability technology rather than reliability engineering) Author has over 40 years experience in the field, and the text is based on classroom tested notes from the reliability technology course he taught at Massachusetts Institute of Technology (MIT), USA Contains graphical interpretations of mathematical models together with diagrams, tables of physical constants, case studies and unique worked examples