Download or read book Friction and the Hot Rolling of Steel written by Vladimir Panjkovic and published by CRC Press. This book was released on 2014-02-25 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt: This text offers a systematic presentation of the evolution of concepts of friction, and its fundamental causes. It introduces key factors influencing friction in engineering systems. Applying these concepts, experimental observations and phenomena in various processes, readers understand the key frictional phenomena in the large-scale, commercial process of hot steel rolling. The usefulness of the book is not limited to hot rolling. It also provides an understanding of frictional phenomena in other important industrial sectors, such as automotive industry, railway transport, metal cutting and forming.
Download or read book Kona written by and published by . This book was released on 2008 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2008 with total page 946 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Metals Abstracts written by and published by . This book was released on 1992 with total page 1516 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Chemical Mechanical Planarization of Microelectronic Materials written by Joseph M. Steigerwald and published by John Wiley & Sons. This book was released on 2008-09-26 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.
Download or read book Advances in Chemical Mechanical Planarization CMP written by Babu Suryadevara and published by Woodhead Publishing. This book was released on 2021-09-10 with total page 650 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
Download or read book Chemical Mechanical Planarization of Semiconductor Materials written by M.R. Oliver and published by Springer Science & Business Media. This book was released on 2004-01-26 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.
Download or read book Advances in Tribology written by Pranav H. Darji and published by Intechopen. This book was released on 2016-10-26 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the major field of design and manufacturing of mechanical, production, automobile, and industrial engineering, typical and advance methodologies and processes are implemented for the best performance of product or machinery. Thus, the concept of tribology has come into practice for even better performance. Nowadays, it is very important that the tribological knowledge be implemented at each stage of design and manufacturing to minimize the frictional and wear losses, and ultimately these will serve as best preference for the economical growth of the nation. Currently, tribologists are playing vital role in the same direction. This book contains original and innovative research studies on recent applications of tribology, contributed by the group of selected researchers describing the best of their work. Through its 11 chapters, the reader will have access to work in 3 major areas of tribology. These are surface engineering and coating, friction and wear mechanism, and lubrication technology. The first part of the book from Chapters 1 to 4 deals with the surface treatment and coating through which component life can be improved by reducing wear rate. The second part of the book from Chapters 5 to 7 deals with tribo-testing and tribo-system monitoring for friction and wear mechanism presented with real-life case studies. The third part from Chapters 8 to 11 discusses the advances in lubrication, which also includes the role of nanolubricants and lubrication additives. This book may be of interest to research scholars, academicians, industrialists, professional engineers, and specialists in these related areas and would also be of immense help to various practicing engineers, technologists, managers, and supervisors engaged in the maintenance, operation, and upkeep of different machines, equipments, systems, and plants of various industries.
Download or read book History of Tribology written by D. Dowson and published by . This book was released on 1978 with total page 712 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in CMP Polishing Technologies written by Toshiro Doi and published by William Andrew. This book was released on 2011-12-06 with total page 330 pages. Available in PDF, EPUB and Kindle. Book excerpt: CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan
Download or read book Advanced Techniques for Surface Engineering written by W. Gissler and published by Springer Science & Business Media. This book was released on 1992-10-31 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: The hardest requirements on a material are in general imposed at the surface: it has to be wear resistant for tools and bearings; corrosion resistant for turbine blades; antireflecting for solar cells; and it must combine several of these properties in other applications. `Surface engineering' is the general term that incorporates all the techniques by which a surface modification can be accomplished. These techniques include both the more traditional methods, such as nitriding, boriding and carburizing, and the newer ones, such as ion implantation, laser beam melting and, in particular, coating. This book comprises and compares in a unique way all these techniques of surface engineering. It is a compilation of lectures which were held by renowned scientists and engineers in the frame of the well known `EuroCourses' of the Joint Research Centre of the Commission of the European Communities. The book is principally addressed to material and surface scientists, physicists and chemists, engineers and technicians of industries and institutes where surface engineering problems arise.
Download or read book Tribology In Chemical Mechanical Planarization written by Hong Liang and published by CRC Press. This book was released on 2005-03-01 with total page 199 pages. Available in PDF, EPUB and Kindle. Book excerpt: Illustrating their intersecting role in manufacturing and technological development, this book examines tribological principles and their applications in CMP, including integrated circuits, basic concepts in surfaces of contacts, and common defects as well as friction, lubrication fundamentals, and the basics of wear. The book concludes its focus with mechanical aspects of CMP, pad materials, elastic modulus, and cell buckling. As the first source to integrate CMP and tribology, Tribology in Chemical-Mechanical Planarization provides applied scientists and engineers in the fields of semiconductors and microelectronics with clear foresight to the future of this technology.
Download or read book Tribochemistry written by Gerqard Heinicke and published by Oxford University Press, USA. This book was released on 1988-05-12 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a comprehensive introduction to the scientific and technical aspects of tribochemistry, a field concerned with the chemical reactions initiated by mechanical energy. The relevant theoretical background, recent innovations and results, and the possibilities of expanding industrial applications are covered.
Download or read book Materials and Processes written by Barrie D. Dunn and published by Springer. This book was released on 2015-12-29 with total page 677 pages. Available in PDF, EPUB and Kindle. Book excerpt: The objective of this book is to assist scientists and engineers select the ideal material or manufacturing process for particular applications; these could cover a wide range of fields, from light-weight structures to electronic hardware. The book will help in problem solving as it also presents more than 100 case studies and failure investigations from the space sector that can, by analogy, be applied to other industries. Difficult-to-find material data is included for reference. The sciences of metallic (primarily) and organic materials presented throughout the book demonstrate how they can be applied as an integral part of spacecraft product assurance schemes, which involve quality, material and processes evaluations, and the selection of mechanical and component parts. In this successor edition, which has been revised and updated, engineering problems associated with critical spacecraft hardware and the space environment are highlighted by over 500 illustrations including micrographs and fractographs. Space hardware captured by astronauts and returned to Earth from long durations in space are examined. Information detailed in the Handbook is applicable to general terrestrial applications including consumer electronics as well as high reliability systems associated with aeronautics, medical equipment and ground transportation. This Handbook is also directed to those involved in maximizing the relia bility of new materials and processes for space technology and space engineering. It will be invaluable to engineers concerned with the construction of advanced structures or mechanical and electronic sub-systems.
Download or read book International Aerospace Abstracts written by and published by . This book was released on 1999 with total page 934 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Liquid Crystals in Biotribology written by Sergey Ermakov and published by Springer. This book was released on 2015-07-11 with total page 219 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book summarizes the theoretical and experimental studies confirming the concept of the liquid-crystalline nature of boundary lubrication in synovial joints. It is shown that cholesteric liquid crystals in the synovial liquid play a significant role in the mechanism of intra-articular friction reduction. The results of structural, rheological and tribological research of the creation of artificial synovial liquids containing cholesteric liquid crystals in natural synovial liquids are described. These liquid crystals reproduce the lubrication properties of natural synovia and provide a high chondroprotective efficiency. They were tested in osteoarthritis models and in clinical practice.
Download or read book The Foundations of Vacuum Coating Technology written by Donald M. Mattox and published by William Andrew. This book was released on 2018-08-21 with total page 383 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Foundations of Vacuum Coating Technology, Second Edition, is a revised and expanded version of the first edition, which was published in 2003. The book reviews the histories of the various vacuum coating technologies and expands on the history of the enabling technologies of vacuum technology, plasma technology, power supplies, and low-pressure plasma-enhanced chemical vapor deposition. The melding of these technologies has resulted in new processes and products that have greatly expanded the application of vacuum coatings for use in our everyday lives. The book is unique in that it makes extensive reference to the patent literature (mostly US) and how it relates to the history of vacuum coating. The book includes a Historical Timeline of Vacuum Coating Technology and a Historical Timeline of Vacuum/Plasma Technology, as well as a Glossary of Terms used in the vacuum coating and surface engineering industries. - History and detailed descriptions of Vacuum Deposition Technologies - Review of Enabling Technologies and their importance to current applications - Extensively referenced text - Patents are referenced as part of the history - Historical Timelines for Vacuum Coating Technology and Vacuum/Plasma Technology - Glossary of Terms for vacuum coating
