Download or read book Transport in Thin body MOSFETs Fabricated in Strained Si and Strained Si SiGe Heterostructures on Insulator written by Ingvar Åberg and published by . This book was released on 2006 with total page 183 pages. Available in PDF, EPUB and Kindle. Book excerpt: (Cont.) Comparisons between SSDOI of two strain levels indicate benefits of strain engineering down to 3 nm thickness. The hole mobility in HOI is improved compared to that in SSDOI, due to the high hole mobility in the Si1-zGez channel. The mobility enhancement is similar at low and high hole densities even at moderate strain levels. The hole mobility in HOI with SiGe channel thickness below 10 nm is observed to follow a similar dependence on channel thickness as hole mobility in SSDOI. Simulations of electrostatics in HOI and SSDOI with ultra-thin channel thicknesses indicate similarities in the confinement of the inversion charge in ultra-thin body HOI and SSDOI. This suggests that the similar reduction of hole mobility in HOI and SSDOI with 4-10 nm-thick channels is associated with an increase in phonon scattering from the reduced effective channel thickness.
Download or read book Hole Transport in Strained SiGe channel MOSFETs written by Leonardo Gomez (Ph. D.) and published by . This book was released on 2010 with total page 167 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since the 90 nm CMOS technology node, geometric scaling of CMOS has been supplemented with strain to boost transistor drive current. Future CMOS technology nodes (i.e. beyond the 32 nm node) will require more significant changes to continue improvements in transistor performance. Novel CMOS channel materials and device architectures are one option for enhancing carrier transport and increasing device performance. In this work strained SiGe and Ge are examined as a means of increasing the drive current in deeply scaled CMOS. As part of this work a novel high mobility strained-Ge on-insulator substrate has been developed, and the hole transport characteristics of short channel and asymmetrically strained-SiGe channel p-MOSFETs have been explored. A thin-body biaxial compressive strained-Si/strained-Ge heterostructure on-insulator (HOI) substrate has been developed, which combines the electrostatic benefits of the thin-body architecture with the transport benefits of biaxial compressive strain. A novel Germanium on Silicon growth method and a low temperature bond and etch-back process have been developed to enable Ge HOI fabrication. P-MOSFETs were also fabricated using these substrates and the hole mobility characteristics were studied. The hole mobility and velocity characteristics of short channel biaxial compressive strained-Si 45 Geo. 55 p-MOSFETs on-insulator have also been examined. Devices with gate lengths down to 65 nm were fabricated. The short channel mobility characteristics were extracted and a 2.4x hole mobility enhancement relative to relaxed-Si was observed. The measured hole velocity enhancement is more modest at about 1.2x. Band structure and ballistic velocity simulations suggest that a more substantial velocity improvement can be expected with the incorporation of added longitudinal uniaxial compressive strain in the SiGe channel. The hole mobility characteristics of biaxial strained SiGe and Ge p-MOSFETs with applied uniaxial strain are also studied. The hole mobility in biaxial compressive strained SiGe is already enhanced relative to relaxed Si. It is observed that this mobility enhancement increases further with the application of 110 longitudinal uniaxial compressive strain. Since hole mobility and velocity are correlated through their dependence on the hole effective mass, a mass driven increase in mobility with applied uniaxial strain should result in an increase in velocity. Simulations have also been performed to estimate the hole effective mass change in asymmetric strained SiGe. Finally the piezo resistance coefficients of strained SiGe are extracted and found to be larger than in Si.
Download or read book SiGe and Ge written by David Louis Harame and published by The Electrochemical Society. This book was released on 2006 with total page 1280 pages. Available in PDF, EPUB and Kindle. Book excerpt: The second International SiGe & Ge: Materials, Processing, and Devices Symposium was part of the 2006 ECS conference held in Cancun, Mexico from October 29-Nov 3, 2006. This meeting provided a forum for reviewing and discussing all materials and device related aspects of SiGe & Ge. The hardcover edition includes a bonus CD-ROM containing the PDF of the entire issue.
Download or read book Nanoscaled Semiconductor on Insulator Structures and Devices written by S. Hall and published by Springer Science & Business Media. This book was released on 2007-07-09 with total page 377 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book offers combined views on silicon-on-insulator (SOI) nanoscaled electronics from experts in the fields of materials science, device physics, electrical characterization and computer simulation. Coverage analyzes prospects of SOI nanoelectronics beyond Moore’s law and explains fundamental limits for CMOS, SOICMOS and single electron technologies.
Download or read book Strained Si Heterostructure Field Effect Devices written by C.K Maiti and published by CRC Press. This book was released on 2007-01-11 with total page 438 pages. Available in PDF, EPUB and Kindle. Book excerpt: A combination of the materials science, manufacturing processes, and pioneering research and developments of SiGe and strained-Si have offered an unprecedented high level of performance enhancement at low manufacturing costs. Encompassing all of these areas, Strained-Si Heterostructure Field Effect Devices addresses the research needs associated wi
Download or read book Silicon Germanium Strained Layers and Heterostructures written by M. Willander and published by Elsevier. This book was released on 2003-10-02 with total page 325 pages. Available in PDF, EPUB and Kindle. Book excerpt: The study of Silicone Germanium strained layers has broad implications for material scientists and engineers, in particular those working on the design and modelling of semi-conductor devices. Since the publication of the original volume in 1994, there has been a steady flow of new ideas, new understanding, new Silicon-Germanium (SiGe) structures and new devices with enhanced performance. Written for both students and senior researchers, the 2nd edition of Silicon-Germanium Strained Layers and Heterostructures provides an essential up-date of this important topic, describing in particular the recent developments in technology and modelling. * Fully-revised and updated 2nd edition incorporating important recent breakthroughs and a complete literature review* The extensive bibliography of over 400 papers provides a comprehensive and coherent overview of the subject* Appropriate for students and senior researchers
Download or read book Electron Transport in UTB Fully Depleted N MOSFETS Fabricated on SSDOI with Body Thickness Ranging from 22nm to 25 Nm written by Leonardo Gomez (Ph. D.) and published by . This book was released on 2006 with total page 106 pages. Available in PDF, EPUB and Kindle. Book excerpt: The electron effective mobility in ultrathin-body (UTB) n-MOSFETs fabricated on Ge-free 30% strained-Si directly on insulator (SSDOI) is mapped as the body thickness is scaled. Effective mobility and device body thickness were extracted using current-voltage and gate-to-channel capacitance-voltage measurements as well as cross section transmission electron microscopy. Devices with body thicknesses ranging from 2 nm to 25 nm are studied. Significant electron mobility enhancements ([approx] 1.8x) are observed in SSDOI compared to unstrained SOI for body thicknesses above 3.5 nm. The mobility exhibits a sharp drop as the body thickness is scaled below 3.5 nm.
Download or read book IBM Journal of Research and Development written by and published by . This book was released on 2006 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Strain Engineered MOSFETs written by C.K. Maiti and published by CRC Press. This book was released on 2018-10-03 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt: Currently strain engineering is the main technique used to enhance the performance of advanced silicon-based metal-oxide-semiconductor field-effect transistors (MOSFETs). Written from an engineering application standpoint, Strain-Engineered MOSFETs introduces promising strain techniques to fabricate strain-engineered MOSFETs and to methods to assess the applications of these techniques. The book provides the background and physical insight needed to understand new and future developments in the modeling and design of n- and p-MOSFETs at nanoscale. This book focuses on recent developments in strain-engineered MOSFETS implemented in high-mobility substrates such as, Ge, SiGe, strained-Si, ultrathin germanium-on-insulator platforms, combined with high-k insulators and metal-gate. It covers the materials aspects, principles, and design of advanced devices, fabrication, and applications. It also presents a full technology computer aided design (TCAD) methodology for strain-engineering in Si-CMOS technology involving data flow from process simulation to process variability simulation via device simulation and generation of SPICE process compact models for manufacturing for yield optimization. Microelectronics fabrication is facing serious challenges due to the introduction of new materials in manufacturing and fundamental limitations of nanoscale devices that result in increasing unpredictability in the characteristics of the devices. The down scaling of CMOS technologies has brought about the increased variability of key parameters affecting the performance of integrated circuits. This book provides a single text that combines coverage of the strain-engineered MOSFETS and their modeling using TCAD, making it a tool for process technology development and the design of strain-engineered MOSFETs.
Download or read book High Mobility Strained Si SiGe Heterostructure MOSFETs written by Christopher W. Leitz and published by . This book was released on 2002 with total page 178 pages. Available in PDF, EPUB and Kindle. Book excerpt: (Cont.) Record mobility strained Si p-MOSFETs have been fabricated on relaxed 40% Ge virtual substrates. Hole mobility enhancements saturate at virtual substrate compositions of 40% Ge and above, with mobility enhancements over twice that of co-processed bulk Si devices. In contrast, hole mobility in strained Si p-MOSFETs displays no strong dependence on strained layer thickness. These results indicate that strain is the primary variable in determining hole mobility in strained Si p-MOSFETs and that symmetric electron and hole mobility enhancements in strained Si MOSFETs can be obtained for virtual substrate compositions beyond 35% Ge. The effect of alloy scattering on carrier mobility in tensile strained SiGe surface channel MOSFETs is measured directly for the first time. Electron mobility is degraded much more severely than hole mobility in these heterostructures, in agreement with theoretical predictions. Dual channel heterostructures, which consist of the combination of buried compressively strained SiilyGey buried channels and tensile strained Si surface channels, grown on relaxed SilxGex virtual substrates, are explored in detail for the first time. Hole mobilities exceeding 700 cm2/V-s have been achieved by combining tensile strained Si surface channels and compressively strained 80% Ge buried channels grown on relaxed 50% Ge virtual substrates. This layer sequence exhibits nearly symmetric electron and hole mobilities, both enhanced relative to bulk Si ...
Download or read book Silicon on insulator Technology and Devices XI written by Electrochemical Society. Meeting and published by The Electrochemical Society. This book was released on 2003 with total page 538 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Fundamentals of Nanoscaled Field Effect Transistors written by Amit Chaudhry and published by Springer Science & Business Media. This book was released on 2013-04-23 with total page 211 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fundamentals of Nanoscaled Field Effect Transistors gives comprehensive coverage of the fundamental physical principles and theory behind nanoscale transistors. The specific issues that arise for nanoscale MOSFETs, such as quantum mechanical tunneling and inversion layer quantization, are fully explored. The solutions to these issues, such as high-κ technology, strained-Si technology, alternate devices structures and graphene technology are also given. Some case studies regarding the above issues and solution are also given in the book.
Download or read book Dissertation Abstracts International written by and published by . This book was released on 2007 with total page 924 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Investigation of the Electron Transport and Electrostatics of Nanoscale Strained Si Si Ge Heterostructure MOSFETs written by Hasan Munir Nayfeh and published by . This book was released on 2003 with total page 179 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis presents work aimed at investigating the possible benefit of strained-Si/SiGe heterostructure MOSFETs designed for nanoscale (sub-50-nm) gate lengths with the aid of device fabrication and electrical measurements combined with computer simulation. MOSFET devices fabricated on bulk-Si material are scaled in order to achieve gains in performance and integration. However, as device dimensions continue to scale, physical constraints are being reached that may limit continued scaling and/or the gains in performance from scaling. In order to continue the benefits of scaling, a possible solution is to change to a strained-Si/SiGe material system where enhanced electron mobility of 1.7-2X has been demonstrated for long-channel n-type devices. The electron mobility enhancement observed for long channel length devices may not be the same for devices with nanoscale gate length. In particular, increased channel doping, which is required to control short-channel effects can result in degraded transport characteristics. In this work, the impact of high channel doping on mobility enhancements in strained-Si n-MOSFETs is investigated experimentally. Increased channel doping will increase Coulomb scattering interactions increasing its influence on the overall mobility. Electron transport models were calibrated using experimental data for both strained and un-strained Si devices for various channel doping concentrations. The transport models were then used to investigate, by computer simulation, the performance enhancement of nanoscale strained Si devices for equivalent off-current.
Download or read book Strain Induced Effects in Advanced MOSFETs written by Viktor Sverdlov and published by Springer Science & Business Media. This book was released on 2011-01-06 with total page 260 pages. Available in PDF, EPUB and Kindle. Book excerpt: Strain is used to boost performance of MOSFETs. Modeling of strain effects on transport is an important task of modern simulation tools required for device design. The book covers all relevant modeling approaches used to describe strain in silicon. The subband structure in stressed semiconductor films is investigated in devices using analytical k.p and numerical pseudopotential methods. A rigorous overview of transport modeling in strained devices is given.
Download or read book Annual Review of Materials Research written by and published by . This book was released on 2009 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book FinFETs and Other Multi Gate Transistors written by J.-P. Colinge and published by Springer Science & Business Media. This book was released on 2008 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book explains the physics and properties of multi-gate field-effect transistors (MuGFETs), how they are made and how circuit designers can use them to improve the performances of integrated circuits. It covers the emergence of quantum effects due to the reduced size of the devices and describes the evolution of the MOS transistor from classical structures to SOI (silicon-on-insulator) and then to MuGFETs.
