Download or read book Thermal Stress and Strain in Microelectronics Packaging written by John Lau and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.

Download or read book Structural Analysis of Printed Circuit Board Systems written by Peter A. Engel and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 307 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the building blocks of electronic circuits - the microchips, transistors, resistors, condensers, and so forth, and the boards that support them - from the point of view of mechanics: What are the stresses that result from thermal expansion and contraction? What are the elastic parameters that determine whether a component will survive a certain acceleration? After an introduction to the elements of structural analysis and finite-element analysis, the author turns to components, data and testing. A discussion of leadless chip carriers leads to a detailed thermal analysis of pin grid arrays. For compliant leaded systems, both mechanical (bending and twisting) and thermal stresses are discussed in detail. The book concludes with discussions of the dynamic response of circuit cards, plated holes in cards and boards, and the final assembly of cards and boards.

Download or read book Journal of Electronic Packaging written by and published by . This book was released on 1994 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book 27th International Symposium on Microelectronics written by and published by . This book was released on 1994 with total page 676 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Paper written by and published by . This book was released on 1993 with total page 444 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book IBM Journal of Research and Development written by and published by . This book was released on 1993 with total page 764 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of the International Symposium on Microelectronics written by and published by . This book was released on 1994 with total page 672 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Printed Circuit Assembly Design written by Leonard Marks and published by McGraw Hill Professional. This book was released on 2000-07-27 with total page 442 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nuts-and-bolts guide to designing printed circuit assemblies Want to build circuit boards for today's smaller, faster electronics applications? This how-to tutorial puts a PCA design roadmap at your fingertips--valuable whether you're neophyte just starting out or an experienced designer, engineer or a manager associated with the electronics industry, as printed circuit assemblies are key building blocks in almost every commodity made today with any electronics content. In this unique one-stop design guide you'll find complete coverage of electrical and mechanical design considerations as you explore: design process flow; the latest design methods and tools; circuit board layout; documentation; more.

Download or read book Proceedings written by and published by . This book was released on 1997 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Science Abstracts written by and published by . This book was released on 1993 with total page 2316 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book High Performance Printed Circuit Boards written by Charles A. Harper and published by McGraw Hill Professional. This book was released on 2000 with total page 578 pages. Available in PDF, EPUB and Kindle. Book excerpt: Printed circuit boards (PCBs) and ceramic substrates are the baseline on which almost all modern microelectronics are mounted. The increase in complexity of high performance microelectronics has put great stress on PCB technologies - this volume provides data and design information for the new generation fast, dense boards and substrates. It covers microvias, built-up multilayers, and high density boards; advanced ceramic substrates; and environmentally-safe materials.

Download or read book Mechanics and Materials for Electronic Packaging Design and process issues in electronic packaging written by American Society of Mechanical Engineers. Applied Mechanics Division and published by . This book was released on 1994 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Winter Annual Meeting written by American Society of Mechanical Engineers and published by . This book was released on 1995 with total page 248 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Applications of Experimental Mechanics to Electronic Packaging written by Jeffrey C. Suhling and published by . This book was released on 1995 with total page 132 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Applications of Experimental Mechanics to Electronic Packaging written by and published by . This book was released on 1995 with total page 132 pages. Available in PDF, EPUB and Kindle. Book excerpt: Papers presented at the ASME International Mechanical Engineering Congress and Exposition.

Download or read book Application of Fracture Mechanics in Electronic Packaging and Materials written by Tien Y. Wu and published by . This book was released on 1995 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thirty-one technical papers representing a balance between university research and industrial practice, the results of which advance the quality and reliability of electronic products through fracture mechanics. Among the range of topics discussed at the symposium were: analytical and numerical anal

Download or read book Applied mechanics reviews written by and published by . This book was released on 1948 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: