Download or read book Topics in VLSI Device and Yield Modeling written by S. W. Director and published by . This book was released on 1984 with total page 15 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Recent Topics on Modeling of Semiconductor Processes Devices and Circuits written by Rasit Onur Topaloglu and published by Bentham Science Publishers. This book was released on 2011-09-09 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt: "The last couple of years have been very busy for the semiconductor industry and researchers. The rapid speed of production channel length reduction has brought lithographic challenges to semiconductor modeling. These include stress optimization, transisto"

Download or read book Analog Design Issues in Digital VLSI Circuits and Systems written by Juan J. Becerra and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 153 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analog Design Issues in Digital VLSI Circuits and Systems brings together in one place important contributions and up-to-date research results in this fast moving area. Analog Design Issues in Digital VLSI Circuits and Systems serves as an excellent reference, providing insight into some of the most challenging research issues in the field.

Download or read book VLSI Design for Manufacturing Yield Enhancement written by Stephen W. Director and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 299 pages. Available in PDF, EPUB and Kindle. Book excerpt: One of the keys to success in the IC industry is getting a new product to market in a timely fashion and being able to produce that product with sufficient yield to be profitable. There are two ways to increase yield: by improving the control of the manufacturing process and by designing the process and the circuits in such a way as to minimize the effect of the inherent variations of the process on performance. The latter is typically referred to as "design for manufacture" or "statistical design". As device sizes continue to shrink, the effects of the inherent fluctuations in the IC fabrication process will have an even more obvious effect on circuit performance. And design for manufacture will increase in importance. We have been working in the area of statistically based computer aided design for more than 13 years. During the last decade we have been working with each other, and individually with our students, to develop methods and CAD tools that can be used to improve yield during the design and manufacturing phases of IC realization. This effort has resulted in a large number of publications that have appeared in a variety of journals and conference proceedings. Thus our motivation in writing this book is to put, in one place, a description of our approach to IC yield enhancement. While the work that is contained in this book has appeared in the open literature, we have attempted to use a consistent notation throughout this book.

Download or read book Statistical Approach to VLSI written by Stephen W. Director and published by North Holland. This book was released on 1994 with total page 412 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume is the first complete overview of VLSI design methods that use statistical techniques for dealing with the random phenomena that are inherent in all VLSI manufacturing processes. VLSI design today cannot be performed without taking into account economic-related issues such as yield, cost and performance oriented tradeoffs. The book includes practical methods relevant to real life applications. It contains edited papers by top industrial and academic specialists in the field. These papers describe all three categories of CAD tools employed for statistical design: IC performance optimization tools, process simulation tools and tools for characterization of process fluctuations. In each category both practical approaches and more theoretical approaches are presented.

Download or read book VLSI Design written by K. Lal Kishore and published by I. K. International Pvt Ltd. This book was released on 2013-12-30 with total page 415 pages. Available in PDF, EPUB and Kindle. Book excerpt: Aimed primarily for undergraduate students pursuing courses in VLSI design, the book emphasizes the physical understanding of underlying principles of the subject. It not only focuses on circuit design process obeying VLSI rules but also on technological aspects of Fabrication. VHDL modeling is discussed as the design engineer is expected to have good knowledge of it. Various Modeling issues of VLSI devices are focused which includes necessary device physics to the required level. With such an in-depth coverage and practical approach practising engineers can also use this as ready reference. Key features: Numerous practical examples. Questions with solutions that reflect the common doubts a beginner encounters. Device Fabrication Technology. Testing of CMOS device BiCMOS Technological issues. Industry trends. Emphasis on VHDL.

Download or read book Yield Modelling and Defect Tolerance in VLSI Papers Presented at the INT Workshop on Designing for Yield 1 3 July 1987 Oxford written by Will Moore and published by CRC Press. This book was released on 1988 with total page 306 pages. Available in PDF, EPUB and Kindle. Book excerpt: Papers of the International Workshop on Designing for Yield, Oxford, July 1987. Objectives include discussion of topics in VLSI and designing integrated circuits to yield targets. On yield loss mechanisms and defect tolerance, alternative prospects, catastrophic yield loss models, parametric yield l

Download or read book VLSI Design written by and published by . This book was released on 1985 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Hierarchical Modeling for VLSI Circuit Testing written by Debashis Bhattacharya and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 168 pages. Available in PDF, EPUB and Kindle. Book excerpt: Test generation is one of the most difficult tasks facing the designer of complex VLSI-based digital systems. Much of this difficulty is attributable to the almost universal use in testing of low, gate-level circuit and fault models that predate integrated circuit technology. It is long been recognized that the testing prob lem can be alleviated by the use of higher-level methods in which multigate modules or cells are the primitive components in test generation; however, the development of such methods has proceeded very slowly. To be acceptable, high-level approaches should be applicable to most types of digital circuits, and should provide fault coverage comparable to that of traditional, low-level methods. The fault coverage problem has, perhaps, been the most intractable, due to continued reliance in the testing industry on the single stuck-line (SSL) fault model, which is tightly bound to the gate level of abstraction. This monograph presents a novel approach to solving the foregoing problem. It is based on the systematic use of multibit vectors rather than single bits to represent logic signals, including fault signals. A circuit is viewed as a collection of high-level components such as adders, multiplexers, and registers, interconnected by n-bit buses. To match this high-level circuit model, we introduce a high-level bus fault that, in effect, replaces a large number of SSL faults and allows them to be tested in parallel. However, by reducing the bus size from n to one, we can obtain the traditional gate-level circuit and models.

Download or read book The Predictive Technology Model in the Late Silicon Era and Beyond written by Yu Cao and published by Now Publishers Inc. This book was released on 2010 with total page 111 pages. Available in PDF, EPUB and Kindle. Book excerpt: The aggressive scaling of CMOS technology has inevitably led to vastly increased power dissipation, process variability and reliability degradation, posing tremendous challenges to robust circuit design. To continue the success of integrated circuits, advanced design research must start in parallel with or even ahead of technology development. This new paradigm requires the Predictive Technology Model (PTM) for future technology generations, including nanoscale CMOS and post-silicon devices. This paper presents a comprehensive set of predictive modeling developments. Starting from the PTM of traditional CMOS devices, it extends to CMOS alternatives at the end of the silicon roadmap, such as strained Si, high-k/metal gate, and FinFET devices. The impact of process variation and the aging effect is further captured by modeling the device parameters under the influence. Beyond the silicon roadmap, the PTM outreaches to revolutionary devices, especially carbon-based transistor and interconnect, in order to support explorative design research. Overall, these predictive device models enable early stage design exploration with increasing technology diversity, helping shed light on the opportunities and challenges in the nanoelectronics era.

Download or read book Principles of VLSI System Planning written by Allen M. Dewey and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes a new type of computer aided VLSI design tool, called a VLSI System Planning, that is meant to aid designers dur ing the early, or conceptual, state of design. During this stage of design, the objective is to define a general design plan, or approach, that is likely to result in an efficient implementation satisfying the initial specifications, or to determine that the initial specifications are not realizable. A design plan is a collection of high level design decisions. As an example, the conceptual design of digital filters involves choosing the type of algorithm to implement (e. g. , finite impulse response or infinite impulse response), the type of polyno mial approximation (e. g. , Equiripple or Chebyshev), the fabrication technology (e. g. , CMOS or BiCMOS), and so on. Once a particu lar design plan is chosen, the detailed design phase can begin. It is during this phase that various synthesis, simulation, layout, and test activities occur to refine the conceptual design, gradually filling more detail until the design is finally realized. The principal advantage of VLSI System Planning is that the increasingly expensive resources of the detailed design process are more efficiently managed. Costly redesigns are minimized because the detailed design process is guided by a more credible, consistent, and correct design plan.

Download or read book Defect and Fault Tolerance in VLSI Systems written by C.H. Stapper and published by Springer Science & Business Media. This book was released on 2013-06-29 with total page 313 pages. Available in PDF, EPUB and Kindle. Book excerpt: Higher circuit densities, increasingly more complex application ohjectives, and advanced packaging technologies have suhstantially increased the need to incorporate defect-tolerance and fault-tolerance in the design of VLSI and WSI systems. The goals of defect-tolerance and fault-tolerance are yield enhancement and improved reliahility. The emphasis on this area has resulted in a new field of interdisciplinary scientific research. I n fact, advanced methods of defect/fault control and tolerance are resulting in enhanced manufacturahility and productivity of integrated circuit chips, VI.SI systems, and wafer scale integrated circuits. In 1987, Dr. W. Moore organized an "International Workshop on Designing for Yield" at Oxford University. Edited papers of that workshop were published in reference [II. The participants in that workshop agreed that meetings of this type should he con tinued. preferahly on a yearly hasis. It was Dr. I. Koren who organized the "IEEE Inter national Workshop on Defect and Fault Tolerance in VLSI Systems" in Springfield Massachusetts the next year. Selected papers from that workshop were puhlished as the first volume of this series [21.

Download or read book Introduction to VLSI Systems written by Ming-Bo Lin and published by CRC Press. This book was released on 2011-11-28 with total page 890 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the advance of semiconductors and ubiquitous computing, the use of system-on-a-chip (SoC) has become an essential technique to reduce product cost. With this progress and continuous reduction of feature sizes, and the development of very large-scale integration (VLSI) circuits, addressing the harder problems requires fundamental understanding

Download or read book Wafer Level Integrated Systems written by Stuart K. Tewksbury and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 456 pages. Available in PDF, EPUB and Kindle. Book excerpt: From the perspective of complex systems, conventional Ie's can be regarded as "discrete" devices interconnected according to system design objectives imposed at the circuit board level and higher levels in the system implementation hierarchy. However, silicon monolithic circuits have progressed to such complex functions that a transition from a philosophy of integrated circuits (Ie's) to one of integrated sys tems is necessary. Wafer-scale integration has played an important role over the past few years in highlighting the system level issues which will most significantly impact the implementation of complex monolithic systems and system components. Rather than being a revolutionary approach, wafer-scale integration will evolve naturally from VLSI as defect avoidance, fault tolerance and testing are introduced into VLSI circuits. Successful introduction of defect avoidance, for example, relaxes limits imposed by yield and cost on Ie dimensions, allowing the monolithic circuit's area to be chosen according to the natural partitioning of a system into individual functions rather than imposing area limits due to defect densities. The term "wafer level" is perhaps more appropriate than "wafer-scale". A "wafer-level" monolithic system component may have dimensions ranging from conventional yield-limited Ie dimensions to full wafer dimensions. In this sense, "wafer-scale" merely represents the obvious upper practical limit imposed by wafer sizes on the area of monolithic circuits. The transition to monolithic, wafer-level integrated systems will require a mapping of the full range of system design issues onto the design of monolithic circuit.

Download or read book Simulation of Semiconductor Devices and Processes written by Siegfried Selberherr and published by Springer. This book was released on 1993 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings of AF SD Industry NASA Conference and Workshops on Mission Assurance written by and published by . This book was released on 1984 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Electronic Materials Handbook written by and published by ASM International. This book was released on 1989-11-01 with total page 1234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.