Download or read book Tin and Solder Plating in the Semiconductor Industry written by A.C. Tan and published by Springer Science & Business Media. This book was released on 1992-11-30 with total page 358 pages. Available in PDF, EPUB and Kindle. Book excerpt: The object of this book is to provide balanced coverage of the theory and practice of plating semiconductor devices. The principal concepts of plating are introduced and best practice discussed. The book is designed to help electroplaters achieve `zero-defect' plating by providing an understanding of the plating chemistry and the handling of the plated parts.
Download or read book Tin and Solder Plating in the Semiconductor Industry written by A. C. Tan and published by . This book was released on 1993 with total page 326 pages. Available in PDF, EPUB and Kindle. Book excerpt: Resume på engelsk.
Download or read book Electroplating of Nanostructures written by Mahmood Aliofkhazraei and published by BoD – Books on Demand. This book was released on 2015-12-02 with total page 320 pages. Available in PDF, EPUB and Kindle. Book excerpt: The electroplating was widely used to electrodeposit the nanostructures because of its relatively low deposition temperature, low cost and controlling the thickness of the coatings. With advances in electronics and microprocessor, the amount and form of the electrodeposition current applied can be controlled. The pulse electrodeposition has the interesting advantages such as higher current density application, higher efficiency and more variable parameters compared to direct current density. This book collects new developments about electroplating and its use in nanotechnology.
Download or read book Modern Electroplating written by Mordechay Schlesinger and published by John Wiley & Sons. This book was released on 2014-12-22 with total page 755 pages. Available in PDF, EPUB and Kindle. Book excerpt: The definitive resource for electroplating, now completely up to date With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject. It includes: Easily accessible, self-contained contributions by over thirty experts Five completely new chapters and hundreds of additional pages A cutting-edge look at applications in nanoelectronics Coverage of the formation of nanoclusters and quantum dots using scanning tunneling microscopy (STM) An important discussion of the physical properties of metal thin films Chapters devoted to methods, tools, control, and environmental issues And much more A must-have for anyone in electroplating, including technicians, platers, plating researchers, and metal finishers, Modern Electroplating, Fifth Edition is also an excellent reference for electrical engineers and researchers in the automotive, data storage, and medical industries.
Download or read book Electric Power Conversion written by Marian Gaiceanu and published by BoD – Books on Demand. This book was released on 2019-05-15 with total page 230 pages. Available in PDF, EPUB and Kindle. Book excerpt: The introductory chapter to this book is like traveling in a time machine into past, present, and future of electric power conversion. Archeological discoveries are being transformed into the discoveries of the future. The book is an incursion to electric power conversion through electromechanical power conversion, static power conversion, and applications in the field. Each of the above-mentioned sections analyzes the knowledge gained using the experimental results of valuable research projects. Novice readers will learn how energy is converted adequately and adapted to different consumers. Advanced readers will discover different kinds of modern solutions and tendencies in the field of electric power conversion.
Download or read book Lead free Electronics written by Sanka Ganesan and published by John Wiley & Sons. This book was released on 2006-02-17 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt: Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
Download or read book Silicon Sensors and Actuators written by Benedetto Vigna and published by Springer Nature. This book was released on 2022-04-12 with total page 988 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Readers will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the authors take inspiration from Richard Feynman’s visionary talk “There is Plenty of Room at the Bottom” to propose that the time has come to see silicon sensors as part of a “Feynman Roadmap” instead of the “More-than-Moore” technology roadmap. The sharing of the author’s industrially proven track record of development, design, and manufacturing, along with their visionary approach to the technology, will allow readers to jump ahead in their understanding of the core of the topic in a very effective way. Students, researchers, engineers, and technologists involved in silicon-based sensor and actuator research and development will find a wealth of useful and groundbreaking information in this book.
Download or read book Soldering Handbook For Printed Circuits and Surface Mounting written by Howard H. Manko and published by Springer Science & Business Media. This book was released on 1995-10-31 with total page 548 pages. Available in PDF, EPUB and Kindle. Book excerpt: Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.
Download or read book Pollution Prevention and Control Technologies for Plating Operations written by and published by George Cushnie. This book was released on with total page 436 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials Transactions written by and published by . This book was released on 2006 with total page 1320 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Plating and Surface Finishing written by and published by . This book was released on 2008 with total page 516 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ISTFA 2012 written by ASM International and published by ASM International. This book was released on 2012 with total page 643 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Series on Emission Scenario Documents Chemicals Used in the Electronics Industry written by OECD and published by OECD Publishing. This book was released on 2014-09-03 with total page 224 pages. Available in PDF, EPUB and Kindle. Book excerpt: This emission scenario document (ESD) for chemicals used in the electronics industry provides information on the sources and release pathways of chemicals during various processing techniques in this varied industry sector, to help estimate releases of chemicals into the environment.
Download or read book Lead Finishing in Semiconductor Devices written by A. C. Tan and published by World Scientific. This book was released on 1989 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: This monograph provides an insight review on semiconductor device lead soldering process where various process and material controls are discussed with the aim of achieving zero defect soldering. Quality problems like solderability and visual mechanical problems are discussed and ways to overcome are suggested. Related topics like the corrosion in the microelectronic devices (chip corrosion and lead tarnishing), various techniques like ion chromatography and surface techniques are presented in terms of their applications in the areas of semiconductor device assembly.
Download or read book 5th Electronics Packaging Technology Conference written by Mahadevan K. Iyer and published by IEEE Computer Society Press. This book was released on 2003 with total page 854 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The International Conference on Health Informatics written by Yuan-Ting Zhang and published by Springer Science & Business Media. This book was released on 2013-11-20 with total page 368 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume presents the proceedings of the International Conference on Health Informatics (ICHI). The conference was a new special topic conference initiative by the International Federation of Medical and Biological Engineering (IFMBE), held in Vilamoura, Portugal on 7-9 November, 2013. The main theme of the ICHI2013 was “Integrating Information and Communication Technologies with Biomedicine for Global Health”. The proceedings offer a unique forum to examine enabling technologies of sensors, devices and systems that optimize the acquisition, transmission, processing, storage, retrieval of biomedical and health information as well as to report novel clinical applications of health information systems and the deployment of m-Health, e-Health, u-Health, p-Health and Telemedicine.
Download or read book Semiconductor Packaging written by Andrea Chen and published by CRC Press. This book was released on 2016-04-19 with total page 218 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.
