Download or read book Thin Films Volume 875 written by Thomas E. Buchheit and published by Cambridge University Press. This book was released on 2005 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book has a long tradition of representing current topics in thin-film properties and how they are related to the performance and reliability of thin-film structures. Several emerging and well-developed technologies rely on understanding the behavior of these structures. This book provides a forum for an exchange of ideas among researchers who are interested in the mechanical behavior of thin films, broadly applied to their materials choice or methodology. The book focuses on stress-related phenomena in thin films for a wide range of materials. Of particular interest are studies that explore the frontiers of thin-film materials science with regard to materials selection or size scale. Topics include: elasticity in thin films; characterizing thin films by nanoindentation; mechanical behavior of nanostructured films; mechanical properties of thin; thin-film plasticity; thin-film plasticity; thin-film plasticity; novel testing techniques; in situ characterization techniques; adhesion and fracture of thin films; fatigue and stress in interconnect and metallization; deformation, growth and microstructure in thin films and thin-film processing.
Download or read book Thin Films stresses and Mechanical Properties XI written by Materials Research Society. Meeting and published by . This book was released on 2005 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thin Films Stresses and Mechanical Properties written by and published by . This book was released on 1997 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Metallic Films for Electronic Optical and Magnetic Applications written by Katayun Barmak and published by Woodhead Publishing. This book was released on 2014-02-13 with total page 671 pages. Available in PDF, EPUB and Kindle. Book excerpt: Metallic films play an important role in modern technologies such as integrated circuits, information storage, displays, sensors, and coatings. Metallic Films for Electronic, Optical and Magnetic Applications reviews the structure, processing and properties of metallic films. Part one explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy. This part also encompasses the processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations. Chapters in part two focus on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties. Metallic Films for Electronic, Optical and Magnetic Applications is a technical resource for electronics components manufacturers, scientists, and engineers working in the semiconductor industry, product developers of sensors, displays, and other optoelectronic devices, and academics working in the field. Explores the structure of metallic films using characterization methods such as x-ray diffraction and transmission electron microscopy Discusses processing of metallic films, including structure formation during deposition and post-deposition reactions and phase transformations Focuses on the properties of metallic films, including mechanical, electrical, magnetic, optical, and thermal properties
Download or read book Mechanical Properties of Structural Films written by Christopher L. Muhlstein and published by ASTM International. This book was released on 2001 with total page 333 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recent advances in the mechanical properties of structural films are described in these papers from a November 2000 symposium held in Orlando, Florida. Papers are organized in sections on fracture and fatigue of structural films, elastic behavior and residual stress in thin films, tensile testing of
Download or read book Thin Films Stresses and Mechanical Properties IX Volume 695 written by Materials Research Society. Meeting and published by . This book was released on 2002-04 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Download or read book Thin Films Stresses and Mechanical Properties X written by Sean G. Corcoran and published by Cambridge University Press. This book was released on 2014-06-05 with total page 606 pages. Available in PDF, EPUB and Kindle. Book excerpt: Understanding the mechanical behavior of thin films is crucial for a wide variety of technologies. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. However, the performance of these devices is often limited by the mechanical properties of both the films and the structures to which they are attached. The concepts, models and techniques developed for bulk materials often do not apply to small dimensions, and the mechanisms controlling behavior are not well defined. This book, first published in 2004, brings together an international group of researchers and students from industry, academia and national laboratories to address the mechanical behavior of thin films. Of particular interest are those studies that cut across length scales such as atomistic-to-nanometer or nanometer-to-submicron scale. Topics include: stress evolution; modeling stresses and film instability; deformation and adhesion; film fracture and fatigue; processing and structure; indentation testing; mechanical properties; properties and performance; and multilayers and nanolaminates.
Download or read book Thin Films Stresses and Mechanical Properties VIII written by Richard Vinci and published by Cambridge University Press. This book was released on 2014-06-05 with total page 566 pages. Available in PDF, EPUB and Kindle. Book excerpt: An understanding of mechanical behavior is crucial for a wide variety of thin-film technologies such as semiconductor devices and packaging (including advanced interconnects, dielectrics and silicides), information storage media, hard coatings, microelectromechanical systems (MEMS), and biomedical devices. The influence of mechanical behavior is seen in thin-film performance and reliability, as well as morphology development during processing and service. The increased need for understanding of these properties has challenged modern materials science because concepts, models and techniques developed for bulk materials often do not apply in small dimensions. This book addresses key issues in the still growing field of thin-film mechanical behavior. Topics include: multilayer thin films; metallic thin films; epitaxy, deposition parameters, microstructure and stresses; thin films for applications in MEMS; polymer thin films; mechanical properties of amorphous and crystalline carbon; adhesion and fracture; reliability in microelectronics; and nanoindentation and advanced testing techniques.
Download or read book Thin Films Stresses and Mechanical Properties IX written by Cengiz S. Ozkan and published by Cambridge University Press. This book was released on 2014-06-05 with total page 532 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book, the ninth in a popular series from the Materials Research Society, is strengthened by invited and contributed papers covering a wide range of subjects, from processing-microstructure-mechanical property relationships, strain effects and self-organization in thin films, nanoscale defects and thermomechanical behavior of materials, to novel nanscale materials testing. While the collection continues the series theme of materials science related modeling and characterization of mechanical properties of materials, special focus is given to: strain relaxation and strengthening mechanisms; defects formation; mechanical properties and nanoscale testing; adhesion and fracture; thin-film applications in MEMS; computational modeling and experiments; and film deposition, microstructure, evolution and intrinsic stress.
Download or read book Thin Films Stresses and Mechanical Properties VII Volume 505 written by Robert C. Cammarata and published by Cambridge University Press. This book was released on 1998-08-11 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: Mechanical behavior in thin films continues to be a growing field of interest in the materials research community. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. Examples of affected areas include semiconductor and magnetic recording technology, as well as protective and hard-coating technology. As a result, it is important to study fundamental issues involved in film-substrate adhesion, the development of intrinsic stresses and the mechanisms of plastic deformation, strain relaxation, and fracture in thin films. This book addresses issues towards improving existing, as well as developing new, mechanical property characterization techniques such as more sensitive ultrasonic methods for elastic behavior determination and low-load indentation methods to investigate yield, creep, and fracture behavior. Experimental, theoretical and modelling work is presented. Topics include: novel testing methods; low-load indentation; metallization and reliability; structural and mechanical stability; surface and tribological properties; adhesion; deformation mechanisms; stresses in thin films - generation mechanisms and measurement techniques; multilayered and superlattice thin films and structure/property/processing relationships.
Download or read book Preparation and Properties of Thin Films written by K. N. Tu and published by Elsevier. This book was released on 2013-10-22 with total page 351 pages. Available in PDF, EPUB and Kindle. Book excerpt: Treatise on Materials Science and Technology, Volume 24: Preparation and Properties of Thin Films covers the progress made in the preparation of thin films and the corresponding study of their properties. The book discusses the preparation and property correlations in thin film; the variation of microstructure of thin films; and the molecular beam epitaxy of superlattices in thin film. The text also describes the epitaxial growth of silicon structures (thermal-, laser-, and electron-beam-induced); the characterization of grain boundaries in bicrystalline thin films; and the mechanical properties of thin films on substrates. The ion beam modification of thin film; the use of thin alloy films for metallization in microelectronic devices; and the fabrication and physical properties of ultrasmall structures are also encompassed. Materials scientists and materials engineers will find the book invaluable.
Download or read book Modeling the Mechanical Properties of Thin Films Copper Under Induced Stresses written by Chingho Richard Lee and published by . This book was released on 1994 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The influence of surface films on mechanical properties written by Heinz G. F. Wilsdorf and published by . This book was released on 1975 with total page 58 pages. Available in PDF, EPUB and Kindle. Book excerpt: The variables that influence the mechanical behavior of metals covered with thin films have been enumerated. In particular, factors affecting dislocation glide in the surface region have been characterized in terms of image stresses taking into account both the free surface and the accommodation dislocation network at the substrate-film interface. A reduction of yield stress of 50% or more was measured on copper crystals electro-plated with 600 A films of nickel, gold or alpha-brass, all of which are epitaxial overgrowths. The complexity of the microstructure in the substrate-thin film composite has been described and the consequences on dislocation glide explored. An example of a system which exhibits an increase of the critical resolved yield stress, tau sub y, is given. Here, diffusion layers less than 1 micrometer thick caused tau sub y to increase by a factor of two, a consequence of the hindering of glide dislocations by accommodation dislocation networks.
Download or read book Thin Films Stresses and Mechanical Properties written by and published by . This book was released on 1993 with total page 808 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Encyclopedia of Thermal Stresses written by Richard B. Hetnarski and published by Springer. This book was released on 2013-12-04 with total page 6643 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Encyclopedia of Thermal Stresses is an important interdisciplinary reference work. In addition to topics on thermal stresses, it contains entries on related topics, such as the theory of elasticity, heat conduction, thermodynamics, appropriate topics on applied mathematics, and topics on numerical methods. The Encyclopedia is aimed at undergraduate and graduate students, researchers and engineers. It brings together well established knowledge and recently received results. All entries were prepared by leading experts from all over the world, and are presented in an easily accessible format. The work is lavishly illustrated, examples and applications are given where appropriate, ideas for further development abound, and the work will challenge many students and researchers to pursue new results of their own. This work can also serve as a one-stop resource for all who need succinct, concise, reliable and up to date information in short encyclopedic entries, while the extensive references will be of interest to those who need further information. For the coming decade, this is likely to remain the most extensive and authoritative work on Thermal Stresses.
Download or read book Microfabrication and Mechanical Properties of Free Standing Thin Films written by James E. Steinwall and published by . This book was released on 1992 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2017-12-19 with total page 1720 pages. Available in PDF, EPUB and Kindle. Book excerpt: Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
