Download or read book Thermal Mechanical and Multi physics Simulation and Experiments in Micro electronics and Micro systems EuroSimE 2011 12th International Conference on Thermal Mechanical and Multi Physics Simulation and Experiments in Micro Electronics and Micro Systems EuroSimE was Held in Linz Austria on 18 20th of April 2011 7 Papers written by and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of 5th Electronics Packaging Technology Conference EPTC 2003 written by and published by . This book was released on 2004 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thermal Stress and Strain in Microelectronics Packaging written by John Lau and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 904 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is required. Mechanical and thermal phenomena are among the least understood and most complex of the many phenomena encountered in microelectronics packaging systems and are found on the critical path of neatly every design and process in the electronics industry. The last decade has witnessed an explosive growth in the research and development efforts devoted to determining the mechanical and thermal behaviors of microelectronics packaging. With the advance of very large scale integration technologies, thousands to tens of thousands of devices can be fabricated on a silicon chip. At the same time, demands to further reduce packaging signal delay and increase packaging density between communicat ing circuits have led to the use of very high power dissipation single-chip modules and multi-chip modules. The result of these developments has been a rapid growth in module level heat flux within the personal, workstation, midrange, mainframe, and super computers. Thus, thermal (temperature, stress, and strain) management is vital for microelectronics packaging designs and analyses. How to determine the temperature distribution in the elec tronics components and systems is outside the scope of this book, which focuses on the determination of stress and strain distributions in the electronics packaging.
Download or read book Solid State Lighting Reliability Part 2 written by Willem Dirk van Driel and published by Springer. This book was released on 2017-07-11 with total page 603 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.
Download or read book More than Moore written by Guo Qi Zhang and published by Springer Science & Business Media. This book was released on 2010-01-23 with total page 338 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past decades, the mainstream of microelectronics progression was mainly powered by Moore's law focusing on IC miniaturization down to nano scale. However, there is a fast increasing need for "More than Moore" (MtM) products and technology that are based upon or derived from silicon technologies, but do not simply scale with Moore’s law. This book provides new vision, strategy and guidance for the future technology and business development of micro/nanoelectronics.
Download or read book Smart Sensors for Industrial Applications written by Krzysztof Iniewski and published by CRC Press. This book was released on 2017-12-19 with total page 601 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sensor technologies are a rapidly growing area of interest in science and product design, embracing developments in electronics, photonics, mechanics, chemistry, and biology. Their presence is widespread in everyday life, where they are used to sense sound, movement, and optical or magnetic signals. The demand for portable and lightweight sensors is relentless in several industries, from consumer electronics to biomedical engineering to the military. Smart Sensors for Industrial Applications brings together the latest research in smart sensors technology and exposes the reader to myriad applications that this technology has enabled. Organized into five parts, the book explores: Photonics and optoelectronics sensors, including developments in optical fibers, Brillouin detection, and Doppler effect analysis. Chapters also look at key applications such as oxygen detection, directional discrimination, and optical sensing. Infrared and thermal sensors, such as Bragg gratings, thin films, and microbolometers. Contributors also cover temperature measurements in industrial conditions, including sensing inside explosions. Magnetic and inductive sensors, including magnetometers, inductive coupling, and ferro-fluidics. The book also discusses magnetic field and inductive current measurements in various industrial conditions, such as on airplanes. Sound and ultrasound sensors, including underwater acoustic modem, vibrational spectroscopy, and photoacoustics. Piezoresistive, wireless, and electrical sensors, with applications in health monitoring, agrofood, and other industries. Featuring contributions by experts from around the world, this book offers a comprehensive review of the groundbreaking technologies and the latest applications and trends in the field of smart sensors.
Download or read book Analysis Modeling and Simulation of Multiscale Problems written by Alexander Mielke and published by Springer Science & Business Media. This book was released on 2006-10-14 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book reports recent mathematical developments in the Programme "Analysis, Modeling and Simulation of Multiscale Problems", which started as a German research initiative in 2006. Multiscale problems occur in many fields of science, such as microstructures in materials, sharp-interface models, many-particle systems and motions on different spatial and temporal scales in quantum mechanics or in molecular dynamics. The book presents current mathematical foundations of modeling, and proposes efficient numerical treatment.
Download or read book Artificial Intelligence Techniques for Networked Manufacturing Enterprises Management written by Lyes Benyoucef and published by Springer Science & Business Media. This book was released on 2010-05-10 with total page 516 pages. Available in PDF, EPUB and Kindle. Book excerpt: Artificial Intelligence Techniques for Networked Manufacturing Enterprises Management addresses prominent concepts and applications of AI technologies in the management of networked manufacturing enterprises. The aim of this book is to align latest practices, innovation and case studies with academic frameworks and theories, where AI techniques are used efficiently for networked manufacturing enterprises. More specifically, it includes the latest research results and projects at different levels addressing quick-response system, theoretical performance analysis, performance and capability demonstration. The role of emerging AI technologies in the modelling, evaluation and optimisation of networked enterprises’ activities at different decision levels is also covered. Artificial Intelligence Techniques for Networked Manufacturing Enterprises Management is a valuable guide for postgraduates and researchers in industrial engineering, computer science, automation and operations research.
Download or read book Microelectronics and Microsystems written by Luigi Fortuna and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 216 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book presents the best contributions, extracted from the theses written by the students who have attended the second edition of the Master in Microelectronics and Systems that has been organized by the Universita degli Studi di Catania and that has been held at the STMicroelectronics Company (Catania Site) from May 2000 to January 2001. In particular, the mentioned Master has been organized among the various ac tivities of the "Istituto Superiore di Catania per la Formazione di Eccellenza". The Institute is one of the Italian network of universities selected by MURST (Ministry University Research Scientific Technology). The first aim of tl;te Master in Microelectronics and Systems is to increase the skills of the students with the Laurea Degree in Physics or Electrical Engineering in the more advanced areas as VLSI system design, high-speed low-voltage low-power circuitS and RF systems. The second aim has been to involve in the educational program companies like STMicroelectronics, ACCENT and ITEL, interested in emergent microelectronics topics, to cooperate with the University in developing high-level research projects. Besides the tutorial activity during the teaching hours, provided by national and international researchers, a significant part of the School has been dedicated to the presentation of specific CAD tools and experiments in order to prepare the students to solve specific problems during the stage period and in the thesis work.
Download or read book Engineering Mechanics written by Open University. T235 Course Team and published by . This book was released on 1989 with total page 116 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Moisture Sensitivity of Plastic Packages of IC Devices written by X.J. Fan and published by Springer Science & Business Media. This book was released on 2010-07-23 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.
Download or read book Multifield Problems in Solid and Fluid Mechanics written by Rainer Helmig and published by Springer Science & Business Media. This book was released on 2006-11-28 with total page 569 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book gives an overview of the research projects within the SFB 404 "Mehrfeldprobleme in der Kontinuumsmechanik". The book is for researchers and graduate students in applied mechanics and civil engineering.
Download or read book Design and Reliability of Solders and Solder Interconnections written by Rao K. Mahidhara and published by Minerals, Metals, & Materials Society. This book was released on 1997 with total page 468 pages. Available in PDF, EPUB and Kindle. Book excerpt: The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliability such as microstructural stability in service, creep, fatigue, creep/fatigue interactions, and thermomechanical fatigue of bulk solders and solder joints.
Download or read book Fluid And Solid Mechanics written by Frank Smith and published by World Scientific. This book was released on 2016-03-22 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book leads readers from a basic foundation to an advanced-level understanding of fluid and solid mechanics. Perfect for graduate or PhD mathematical-science students looking for help in understanding the fundamentals of the topic, it also explores more specific areas such as multi-deck theory, time-mean turbulent shear flows, non-linear free surface flows, and internal fluid dynamics.Fluid and Solid Mechanics is the second volume of the LTCC Advanced Mathematics Series. This series is the first to provide advanced introductions to mathematical science topics to advanced students of mathematics. Edited by the three joint heads of the London Taught Course Centre for PhD Students in the Mathematical Sciences (LTCC), each book supports readers in broadening their mathematical knowledge outside of their immediate research disciplines while also covering specialized key areas.
Download or read book Mechanics of Microelectronics written by G.Q. Zhang and published by Springer Science & Business Media. This book was released on 2006-08-25 with total page 580 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.
Download or read book Facets of Emirati Women written by Peter John Hassel and published by . This book was released on 2009 with total page 172 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Enabling Technology for MEMS and Nanodevices written by Henry Baltes and published by John Wiley & Sons. This book was released on 2013-03-27 with total page 441 pages. Available in PDF, EPUB and Kindle. Book excerpt: Mikro- und Nanotechnik haben Wissenschaft und Forschung revolutioniert. In Zukunft werden sie auch den Alltag verändern. Nun liegt der erste Band einer neuen Buchreihe vor: Advanced Micro and Nano Systems 1. Henry Baltes und seine Co-Autoren knüpfen mit AMN an die Sensors Update-Reihe an. Das Autorenteam wurde um weitere Experten erweitert. AMN wird zwei Mal pro Jahr mit einem neuen Band die aktuellen Entwicklungen in der Mikro- und Nano-Welt begleiten. Die Erforschung und der Einsatz von Mikro- und Nanosystemen sind eines der brandaktuellen Themen im Wissenschaftsbereich. Die Forschungsergebnisse werden mehr und mehr auch konkret umgesetzt. Damit werden Mikro- und Nanotechnologie zu Wirtschaftsfaktoren. Aktuelle Entwicklungen, neue Technologien, Nano-Bauelemente und Systeme im Mikromaßstab - Advanced Micro and Nano Systems, die neue Buchreihe, wird Spiegel der spannenden und faszinierenden Mikro- und Nano-Welt sein. Zweimal pro Jahr wird es einen neuen AMN-Band geben. Die Autoren sind ausgewiesene Spezialisten. Zu den Herausgebern zählt Henry Baltes, Professor an der ETH Zürich. Er zeichnete bereits für die Bände der Sensors Update-Reihe verantwortlich. Die Artikel ermöglichen Neueinsteigern einen ersten Zugriff auf die Materie. Fachleute erhalten einen umfassenden Überblick. Anspruch der Herausgeber ist es, nicht nur die theoretischen Grundlagen von Mikro- und Nanosystemen zu reflektieren, sondern immer auch praktische Möglichkeiten und die Grenzen der Anwendung im Blick zu haben. Die AMN-Bände sind Handbücher und Nachschlagewerke in einem. Die Reihe richtet sich an Vertreter unterschiedlicher Fachrichtungen: Biologie, Chemie, Mathematik, Sensorindustrie und Materialwissenschaften.
