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EBookClubs

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Book Thermal Management of Bright LEDs for Automotive Applications

Download or read book Thermal Management of Bright LEDs for Automotive Applications written by Yan Lai and published by . This book was released on 2006 with total page 84 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Thermal Management for LED Applications

Download or read book Thermal Management for LED Applications written by Clemens J.M. Lasance and published by Springer Science & Business Media. This book was released on 2013-09-17 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.

Book Integrated Automotive High Power LED Lighting Systems in 3D MID Technology

Download or read book Integrated Automotive High Power LED Lighting Systems in 3D MID Technology written by Werner Thomas and published by Cuvillier Verlag. This book was released on 2014-02-18 with total page 310 pages. Available in PDF, EPUB and Kindle. Book excerpt: The growing energy consumption of lighting as well as rising luminous efficacies and -fluxes of high-power Light Emitting Diodes (LEDs) have contributed to the widespread use of LEDs in modern lighting systems. One of the most prominent users of the LED-technology is automotive (exterior) lighting. It benefits from LEDs’ high efficiencies and long lifetimes, but furthermore uses their small size as key feature to obtain new degrees of freedom in placing light elements. Although automotive LED-lighting is at the leading edge regarding 3D LED-lighting systems, their current construction is not optimised towards complex design requirements. This thesis deals with decreasing the complexity and improving the degrees of freedom in the design of three-dimensional high-power LED-lighting systems with power electronic LED-driver by enhancing the level of function integration. Three main challenges are identified for the proposed concept and are investigated throughout the thesis. These are the integration of the power electronic LED-driver, of spatial - and electrical-functions as well as of thermal management functions into the three-dimensional multifunctional component.

Book Thermal Management for Opto electronics Packaging and Applications

Download or read book Thermal Management for Opto electronics Packaging and Applications written by Xiaobing Luo and published by John Wiley & Sons. This book was released on 2024-08-12 with total page 373 pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

Book LED Packaging Technologies

Download or read book LED Packaging Technologies written by Luruthudass Annaniah and published by John Wiley & Sons. This book was released on 2023-07-04 with total page 181 pages. Available in PDF, EPUB and Kindle. Book excerpt: LED Packaging Technologies Up-to-date practitioner’s guide on LED packaging technologies, with application examples from relevant industries, historical insight, and outlook LED Packaging Technologies provides expert insight into current and future trends in LED packaging technologies, discussing the fundamentals of LED packaging technologies, from electrical contact design, thermal management and optical emission, and extraction, to manufacturing technologies, including the JEDEC testing standards, followed by accounts on the main applications of these LED packages in the automotive, consumer electronics, and lighting industries. LED Packaging Technologies includes information on: History of primitive lighting in human civilization to the invention of modern LEDs based lighting, and historic evolution of LED packaging technology Basic light emission and extraction technology in LED packages, covering package design impacting light emission and extraction Medical industry applications of LEDs, especially in healthcare treatments, such as in skin rejuvenation and wound healing and closures Quantum confinement phenomena and size-dependent optical properties of quantum dots, and the advancement of future quantum dot LEDs Covering the fundamentals, design, and manufacturing of LED packaging technology and assisting in removing some of the barriers in the development of LED packaging and new applications, LED Packaging Technologies is an essential source of information for engineers in the LED and lighting industries, as well as researchers in academia.

Book EDN

Download or read book EDN written by and published by . This book was released on 2005 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Microelectronics  Circuits and Systems

Download or read book Microelectronics Circuits and Systems written by Abhijit Biswas and published by Springer Nature. This book was released on 2023-06-26 with total page 568 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the proceedings of the 8th International Conference on Microelectronics, Circuits, and Systems (Micro2021) having design and developments of devices, micro- and nanotechnologies, and electronic appliances. This book includes the latest developments and emerging research topics in material sciences, devices, microelectronics, circuits, nanotechnology, system design and testing, simulation, sensors, photovoltaics, optoelectronics, and its different applications. This book is of great attraction to researchers and professionals working in electronics, microelectronics, electrical, and computer engineering.

Book Intelligent Manufacturing and Energy Sustainability

Download or read book Intelligent Manufacturing and Energy Sustainability written by P. H. V. Sesha Talpa Sai and published by Springer Nature. This book was released on 2023-12-29 with total page 598 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book includes best selected, high-quality research papers presented at the International Conference on Intelligent Manufacturing and Energy Sustainability (ICIMES 2023) held at the Department of Mechanical Engineering, Malla Reddy College of Engineering & Technology (MRCET), Hyderabad, India, during June 23–24, 2023. It covers topics in the areas of automation, manufacturing technology, and energy sustainability and also includes original works in the intelligent systems, manufacturing, mechanical, electrical, aeronautical, materials, automobile, bioenergy, and energy sustainability.

Book Managing Electric Vehicle Power

Download or read book Managing Electric Vehicle Power written by Sam Davis and published by SAE International. This book was released on 2020-08-31 with total page 180 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power management involves all the power consumed in an electric vehicle (EV), so it impacts the vehicle's performance, safety, and driving range. To provide these vehicle characteristics, power management: Ensures that the proper power, voltage, and current are applied to each electronic circuit. Ensures that there is isolation between low-voltage and highvoltage (HV) circuits. Offers power circuit protection against electrical disturbances that can affect internal or external circuits. Managing Electric Vehicle Power provides complete coverage for understanding how best to utilize the primary power source across all the EV's Electric Control Units. Readers will also be introduced to the qualification standards of the Automotive Electronics Council (AEC). AEC standards are a 'one-time' qualification that typically takes place at the end of the development cycle.

Book The Fundamentals and Applications of Light Emitting Diodes

Download or read book The Fundamentals and Applications of Light Emitting Diodes written by Govind B. Nair and published by Woodhead Publishing. This book was released on 2020-07-09 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Fundamentals and Applications of Light-Emitting Diodes: The Revolution in the Lighting Industry examines the evolution of LEDs, including a review of the luminescence process and background on solid state lighting. The book emphasizes phosphor-converted LEDs that are based on inorganic phosphors but explores different types of LEDs based on inorganic, organic, quantum dots, perovskite-structured materials, and biomaterials. A detailed description is included about the diverse applications of LEDs in fields such as lighting, displays, horticulture, biomedicine, and digital communication, as well as challenges that must be solved before using LEDs in commercial applications. Traditional light sources are fast being replaced by light-emitting diodes (LEDs). The fourth generation of lighting is completely dominated by LED luminaires. Apart from lighting, LEDs have extended their hold on other fields, such as digital communications, horticulture, medicine, space research, art and culture, display devices, and entertainment. The technological promises offered by LEDs have elevated them as front-runners in the lighting industry. Presents a concise overview of different types of light-emitting diodes (LEDs) based on inorganic phosphors, organic materials, quantum dots, perovskite-structured materials, and biomaterials Includes a discussion of current and emerging applications in lighting, communications, horticulture, and medical fields Addresses fundamentals, luminescence mechanisms, and key optical materials, including synthesis methods

Book SPECIFICATION FOR TESTING AUTOMOTIVE LED MODULES

Download or read book SPECIFICATION FOR TESTING AUTOMOTIVE LED MODULES written by USCAR. and published by . This book was released on 2013 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This specification is a general level subsystem light source specification that establishes test requirements of Light Emitting Diode (LED) components and modules for use in automotive lighting systems.The completed test data to this test specification is intended to be provided to the OEM by the Tier I lamp set maker as part of the lamp assembly PPAP. Re-testing shall be required if any portion of the approved LED modules experiences a design, manufacturing or component change.This document shall be applied to systems that meet the requirements for design, performance and validation established by government standards.The LED module is defined as the LED devices and any electronics required to properly energize the LEDs using vehicle electrical power system along with any associated electrical wiring, connectors and thermal management system. Samples shall be tested as a subsystem and considered one test sample for the entire test sequence. A failure of any component in the test sample shall constitute a failure of the entire sample. If other manufactures components are intended to be approved for use in the LED modules, then those possible combinations of components shall be considered a new LED module and shall also be tested.Additional testing may be required by individual OEM's to meet specific EMC, quality, reliability and durability objectives.The following tests are to be performed under the following conditions: New sample Design or process change made to an existing module Completion of one calendar year as noted in the "ANNUAL TESTS" Table shown in the Appendix. (Note: Production process control data, collected at a shorter interval per an approved control plan, may be substituted if approved by customer's responsible engineer and purchasing representative.).

Book Modeling and Simulation for Microelectronic Packaging Assembly

Download or read book Modeling and Simulation for Microelectronic Packaging Assembly written by Shen Liu and published by John Wiley & Sons. This book was released on 2011-08-24 with total page 586 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Book Light emitting Diodes

Download or read book Light emitting Diodes written by and published by . This book was released on 2002 with total page 140 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Oxide and Nitride Semiconductors

Download or read book Oxide and Nitride Semiconductors written by Takafumi Yao and published by Springer Science & Business Media. This book was released on 2009-03-20 with total page 525 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is a unique book devoted to the important class of both oxide and nitride semiconductors. It covers processing, properties and applications of ZnO and GaN. The aim of this book is to provide the fundamental and technological issues for both ZnO and GaN.

Book Advanced Packaging

    Book Details:
  • Author :
  • Publisher :
  • Release : 2008-01
  • ISBN :
  • Pages : 40 pages

Download or read book Advanced Packaging written by and published by . This book was released on 2008-01 with total page 40 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Packaging serves the semiconductor packaging, assembly and test industry. Strategically focused on emerging and leading-edge methods for manufacturing and use of advanced packages.

Book A Textbook of Automobile Engineering

Download or read book A Textbook of Automobile Engineering written by SK Gupta and published by S. Chand Publishing. This book was released on with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: A Textbook of Automobile Engineering is a comprehensive treatise which provides clear explanation of vehicle components and basic working principles of systems with simple, unique and easy-to-understand illustrations. The textbook also describes the latest and upcoming technologies and developments in automobiles. This edition has been completely updated covering the complete syllabi of most Indian Universities with the aim to be useful for both the students and faculty members. The textbook will also be a valuable source of information and reference for vocational courses, competitive exams, interviews and working professionals.

Book Analog Circuit Design Volume Three

Download or read book Analog Circuit Design Volume Three written by Bob Dobkin and published by Newnes. This book was released on 2014-11-29 with total page 1145 pages. Available in PDF, EPUB and Kindle. Book excerpt: Design Note Collection, the third book in the Analog Circuit Design series, is a comprehensive volume of applied circuit design solutions, providing elegant and practical design techniques. Design Notes in this volume are focused circuit explanations, easily applied in your own designs. This book includes an extensive power management section, covering switching regulator design, linear regulator design, microprocessor power design, battery management, powering LED lighting, automotive and industrial power design. Other sections span a range of analog design topics, including data conversion, data acquisition, communications interface design, operational amplifier design techniques, filter design, and wireless, RF, communications and network design. Whatever your application -industrial, medical, security, embedded systems, instrumentation, automotive, communications infrastructure, satellite and radar, computers or networking; this book will provide practical design techniques, developed by experts for tackling the challenges of power management, data conversion, signal conditioning and wireless/RF analog circuit design. A rich collection of applied analog circuit design solutions for use in your own designs. Each Design Note is presented in a concise, two-page format, making it easy to read and assimilate. Contributions from the leading lights in analog design, including Bob Dobkin, Jim Williams, George Erdi and Carl Nelson, among others. Extensive sections covering power management, data conversion, signal conditioning, and wireless/RF.