Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer Science & Business Media. This book was released on 2006-06-01 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.

Download or read book Heat Management in Integrated Circuits written by Seda Ogrenci-Memik and published by IET. This book was released on 2015-12 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heat Management in Integrated Circuits focuses on devices and materials that are intimately integrated on-chip (as opposed to in package or on-board) for the purposes of thermal monitoring and thermal management, i.e., cooling. The devices and circuits cover various designs used for the purpose of converting temperature to a digital measurement, heat to electricity, and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. The book includes fundamental operating principles that touch upon physics of materials that are used to construct sensing, harvesting, and cooling devices, which will be followed by circuit and system design aspects that enable successful functioning of these devices as an on-chip system. Finally, the author discusses the use of these devices and systems for thermal management and the role they play in enabling energy-efficient and sustainable high performance computing systems.

Download or read book Three Dimensional Integrated Circuit Design written by Vasilis F. Pavlidis and published by Newnes. This book was released on 2017-07-04 with total page 770 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

Download or read book Power Management Integrated Circuits written by Amit Patra and published by CRC Press. This book was released on 2024-09-09 with total page 400 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book intends to be a comprehensive text on the topic of integrated circuits for power management, putting together both theoretical foundations and practical details, leading to successful design practices in research and industry. It covers all the three main categories of power management circuits, viz., linear regulators, inductor-based switchers and switched-capacitor circuits, and presents detailed discussion of their common topologies, operation and modeling. Features Includes underlying theory and design/implementation practical ingredients for power management integrated circuits (PMICs). Provides in-depth analysis of topologies and circuits related to linear regulators, switched-capacitor converters and inductor-based converters. Covers all the relevant topics at the intersection between power electronics and integrated circuit design areas. Provides guidelines for design of circuits and solutions for all the pertinent topologies. Indicates all important issues and the related trade-offs in the design of PMICs. The book will be a valuable resource for senior- and graduate-level students as well as industry professionals who have done university-level courses on analog circuit design, control systems and power electronics.

Download or read book Design of Power Management Integrated Circuits written by Bernhard Wicht and published by John Wiley & Sons. This book was released on 2024-07-22 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: Comprehensive resource on power management ICs affording new levels of functionality and applications with cost reduction in various fields Design of Power Management Integrated Circuits is a comprehensive reference for power management IC design, covering the circuit design of main power management circuits like linear and switched-mode voltage regulators, along with sub-circuits such as power switches, gate drivers and their supply, level shifters, the error amplifier, current sensing, and control loop design. Circuits for protection and diagnostics, as well as aspects of the physical design like lateral and vertical power delivery, pin-out, floor planning, grounding/supply guidelines, and packaging, are also addressed. A full chapter is dedicated to the design of integrated passives. The text illustrates the application of power management integrated circuits (PMIC) to growth areas like computing, the internet of Things, mobility, and renewable energy. Includes numerous real-world examples, case studies, and exercises illustrating key design concepts and techniques. Offering a unique insight into this rapidly evolving technology through the author's experience developing PMICs in both the industrial and academic environment, Design of Power Management Integrated Circuits includes information on: Capacitive, inductive and hybrid DC-DC converters and their essential circuit blocks, covering error amplifiers, comparators, and ramp generators Sensing, protection, and diagnostics, covering thermal protection, inductive loads and clamping structures, under-voltage, reference and power-on reset generation Integrated MOS, MOM and MIM capacitors, integrated inductors Control loop design and PWM generation ensuring stability and fast transient response; subharmonic oscillations in current mode control (analysis and circuit design for slope compensation) DC behavior and DC-related circuit design, covering power efficiency, line and load regulation, error amplifier, dropout, and power transistor sizing Commonly used level shifters (including sizing rules) and cascaded (tapered) driver sizing and optimization guidelines Optimizing the physical design considering packaging, floor planning, EMI, pinout, PCB design and thermal design Design of Power Management Integrated Circuits is an essential resource on the subject for circuit designers/IC designers, system engineers, and application engineers, along with advanced undergraduate students and graduate students in related programs of study.

Download or read book Design of 3D Integrated Circuits and Systems written by Rohit Sharma and published by CRC Press. This book was released on 2018-09-03 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.

Download or read book Power Management Integrated Circuits written by Mona M. Hella and published by CRC Press. This book was released on 2017-12-19 with total page 329 pages. Available in PDF, EPUB and Kindle. Book excerpt: Power Management Integrated Circuits and Technologies delivers a modern treatise on mixed-signal integrated circuit design for power management. Comprised of chapters authored by leading researchers from industry and academia, this definitive text: Describes circuit- and architectural-level innovations that meet advanced power and speed capabilities Explores hybrid inductive-capacitive converters for wide-range dynamic voltage scaling Presents innovative control techniques for single inductor dual output (SIDO) and single inductor multiple output (SIMO) converters Discusses cutting-edge design techniques including switching converters for analog/RF loads Compares the use of GaAs pHEMTs to CMOS devices for efficient high-frequency switching converters Thus, Power Management Integrated Circuits and Technologies provides comprehensive, state-of-the-art coverage of this exciting and emerging field of engineering.

Download or read book Handbook of 3D Integration Volume 4 written by Paul D. Franzon and published by John Wiley & Sons. This book was released on 2019-01-25 with total page 655 pages. Available in PDF, EPUB and Kindle. Book excerpt: This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration.

Download or read book Advances In 3d Integrated Circuits And Systems written by Hao Yu and published by World Scientific. This book was released on 2015-08-28 with total page 392 pages. Available in PDF, EPUB and Kindle. Book excerpt: 3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

Download or read book Power Management Techniques for Integrated Circuit Design written by Ke-Horng Chen and published by John Wiley & Sons. This book was released on 2016-09-26 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book begins with the premise that energy demands are directing scientists towards ever-greener methods of power management, so highly integrated power control ICs (integrated chip/circuit) are increasingly in demand for further reducing power consumption. A timely and comprehensive reference guide for IC designers dealing with the increasingly widespread demand for integrated low power management Includes new topics such as LED lighting, fast transient response, DVS-tracking and design with advanced technology nodes Leading author (Chen) is an active and renowned contributor to the power management IC design field, and has extensive industry experience Accompanying website includes presentation files with book illustrations, lecture notes, simulation circuits, solution manuals, instructors’ manuals, and program downloads

Download or read book Power Management in Mobile Devices written by Findlay Shearer and published by Elsevier. This book was released on 2011-04-01 with total page 337 pages. Available in PDF, EPUB and Kindle. Book excerpt: Sealed Lead Acid...Nickel Cadmium...Lithium Ion...How do you balance battery life with performance and cost?This book shows you how!Now that "mobile" has become the standard, the consumer not only expects mobility but demands power longevity in wireless devices. As more and more features, computing power, and memory are packed into mobile devices such as iPods, cell phones, and cameras, there is a large and growing gap between what devices can do and the amount of energy engineers can deliver. In fact, the main limiting factor in many portable designs is not hardware or software, but instead how much power can be delivered to the device. This book describes various design approaches to reduce the amount of power a circuit consumes and techniques to effectively manage the available power.Power Management Advice On:•Low Power Packaging Techniques•Power and Clock Gating•Energy Efficient Compilers•Various Display Technologies•Linear vs. Switched Regulators•Software Techniques and Intelligent Algorithms* Addresses power versus performance that each newly developed mobile device faces* Robust case studies drawn from the author's 30 plus years of extensive real world experience are included* Both hardware and software are discussed concerning their roles in power

Download or read book Integrated Circuit and System Design Power and Timing Modeling Optimization and Simulation written by Jose L. Ayala and published by Springer. This book was released on 2011-09-25 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book constitutes the refereed proceedings of the 21st International Conference on Integrated Circuit and System Design, PATMOS 2011, held in Madrid, Spain, in September 2011. The 34 revised full papers presented were carefully reviewed and selected from numerous submissions. The paper feature emerging challenges in methodologies and tools for the design of upcoming generations of integrated circuits and systems and focus especially on timing, performance and power consumption as well as architectural aspects with particular emphasis on modeling, design, characterization, analysis and optimization.

Download or read book Power Management for Wearable Electronic Devices written by Dima Kilani and published by Springer Nature. This book was released on 2020-01-17 with total page 118 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book describes power management integrated circuits (PMIC), for power converters and voltage regulators necessary for energy efficient and small form factor systems. The authors discuss state-of-the-art PMICs not only for battery powered wearable devices, but also energy harvesting-based devices. The circuits presented support voltage scaling to reduce the overall average power consumption of a wearable device, resulting in longer device operating time. The discussion includes many designs, control techniques and approaches to distribute efficiently the power among different blocks in the device. • Demonstrates for readers how to innovate in designing power management integrated circuits (PMIC) suitable for wearable devices, powered by either battery or harvesting energy; • Introduces a dual outputs switched capacitor, using a single voltage regulator to minimize the area overhead and discusses the effect of having more than two outputs on the area and power efficiency; • Introduces a novel clock-less digital LDO regulator that eliminates the use of the clocked comparator and serial shift register in the conventional design; • Presents experimental results of energy harvesting-based power management units (PMU), using different combinations of power converters and voltage regulators, providing a guide for designers to select the appropriate option based on device requirements.

Download or read book Energy Efficient Servers written by Corey Gough and published by Apress. This book was released on 2015-04-07 with total page 347 pages. Available in PDF, EPUB and Kindle. Book excerpt: Energy Efficient Servers: Blueprints for Data Center Optimization introduces engineers and IT professionals to the power management technologies and techniques used in energy efficient servers. The book includes a deep examination of different features used in processors, memory, interconnects, I/O devices, and other platform components. It outlines the power and performance impact of these features and the role firmware and software play in initialization and control. Using examples from cloud, HPC, and enterprise environments, the book demonstrates how various power management technologies are utilized across a range of server utilization. It teaches the reader how to monitor, analyze, and optimize their environment to best suit their needs. It shares optimization techniques used by data center administrators and system optimization experts at the world’s most advanced data centers.

Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Download or read book Emerging Trends in Energy Storage Systems and Industrial Applications written by Prabhansu and published by Elsevier. This book was released on 2022-10-09 with total page 700 pages. Available in PDF, EPUB and Kindle. Book excerpt: Energy storage plays an important role in supporting power-hungry devices and achieving stable power supply by optimally balancing supply and demand with ever-increasing requirement for computing power and the intermittent nature of renewable resources. Emerging Trends in Energy Storage Systems and Industrial Applications focuses on emerging trends in energy storage systems, applicable to various types of applications including heat and power generation, electrical and hybrid transportation. With performance limitations in current energy storage devices, such as limited energy density, power density, and cycle life, major challenges in the complex and dynamic environments of energy storage applications are examined in this reference. High-performance components, proper system configuration, effective modelling and control are keys to achieving seamlessly integrated and functional energy storage systems are also addressed, in order to provide guidance to achieving more reliable and efficient systems. Outcomes from this book serve as a resource for industrialists, academia and researchers working in the domain of advance energy storage technologies and their applications, giving them an overview of energy storage options, availability and technological trends enabling them to make longer-term, safe storage system decisions. - Presents a better understanding of the smart energy storage technologies: system, management, and implementation - Explores all energy storage system: integration, power quality, and operation - Offers an interdisciplinary look across electrical, electronics, energy, mechanical, civil, and chemical engineering aspects of energy storage

Download or read book Antenna in Package Technology and Applications written by Duixian Liu and published by John Wiley & Sons. This book was released on 2020-03-31 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.