Download or read book The Printed Circuit Designer s Guide To Thermal Management written by American Standard Circuits and published by . This book was released on 2020-10-06 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Thermal management is one of the fastest-growing areas of the PCB segment, far outpacing the projected growth for the overall industry. While demand was originally driven by high-power telecommunication and mil-aero applications, it has rapidly expanded to include automotive, consumer electronics, and medical sectors.Written by Anaya Vardya, this book serves as a desk reference for designers on the most current thermal management techniques and methods from a PCB fabrication perspective, including a case study on an extreme mixed-technology design. Vardya also shares considerations designers should discuss with their PCB fabricators to ensure manufacturability, cost-effective solutions, and successful product launches.PCB designers and design engineers, both new and veteran, will learn how to "beat the heat" by gaining a thorough understanding of thermal management design processes.
Download or read book The Printed Circuit Designer s Guide To Thermal Management with Insulated Metal Substrates Vol 2 written by Ventec International Group and published by . This book was released on 2022-07-25 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is meant to be a companion to The Printed Circuit Designer's Guide to Thermal Management with Insulated Metal Substrates, which describes material selection for cost-effective solutions and reliable designs. This second volume covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples and focusing on specific solutions and enhanced properties of IMS. These include not only the heat dissipation and the drive to increase thermal conductivity (W/mK), but the total thermal balance as well.Among the most pertinent questions is how to improve reliability of components as they become smaller and smaller, while being more efficient.Readers will also learn the value of understanding the various methods that have been applied to the modeling and testing of thermal materials. Different approaches give varying values of thermal conductivity when applied to the same material, and the effects of measurement errors and tolerance in dielectric thickness can also vary.
Download or read book The Printed Circuit Designer s Guide To Thermal Management with Insulated Metal Substrates written by Ventec International and published by . This book was released on 2018-03-22 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Considering thermal issues in the earliest stages of the design process is critical. Written by Didier Mauve, sales and marketing manager at Ventec International Group, and Ian Mayoh, technical support manager, this book highlights the need to dissipate heat from electronic devices.
Download or read book Thermal Management Handbook For Electronic Assemblies written by Jerry E. Sergent and published by McGraw Hill Professional. This book was released on 1998 with total page 386 pages. Available in PDF, EPUB and Kindle. Book excerpt: Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.
Download or read book The Printed Circuit Designer s Guide To Fundamentals of RF Microwave PCBs written by American Standard Circuits and published by . This book was released on 2018-01-18 with total page 80 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Circuit Designer s Companion written by Tim Williams and published by . This book was released on 1993-01-01 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is a compendium of practical wisdom concerning real world aspects of electronic circuit design gathered during years of experience in industry. The Companion enables circuit designers to produce more effective working circuits. Valued by linear and digital designers alike, this guide explains and outlines solutions that take into account the imperfect behaviour of real components, interconnections and circuits. Electronic circuit design can be divided into two areas: the first consists in designing a circuit that will fulfil its specified function; the second consists in designing the same circuit so that every production model of it will fulfil its specified function reliably over its lifetime. Designers who can appreciate the techniques and tools used in the latter area are becoming increasingly rare. The aim of this guide is to help such people. The subjects covered include grounding, printed circuit design and layout, the characteristics of practical active and passive components, cables, linear ICs, logic circuits and their interfaces, power supplies, electromagnetic compatibility, safety and thermal management. Throughout, the implications of manufacturability and cost are stressed. The style is direct and lucid, providing straightforward practical advice. This is the ideal guide to real world design for both students and practitioners.
Download or read book The Art of Software Thermal Management for Embedded Systems written by Mark Benson and published by Springer Science & Business Media. This book was released on 2014-01-03 with total page 130 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book introduces Software Thermal Management (STM) as a means of reducing power consumption in a computing system in order to manage heat, improve component reliability and increase system safety. Readers will benefit from this pragmatic guide to the field of STM for embedded systems and its catalog of software power management techniques. Since thermal management is a key bottleneck in embedded systems design, this book focuses on root cause of heat in embedded systems: power. Since software has an enormous impact on power consumption in an embedded system, this book urges software engineers to manage heat effectively by understanding, categorizing and developing new ways to reduce static and dynamic power consumption. Whereas most books on thermal management describe mechanisms to remove heat, this book focuses on ways for software engineers to avoid generating heat in the first place.
Download or read book PCB Design Guide to Via and Trace Currents and Temperatures written by Douglas Brooks and published by Artech House. This book was released on 2021-02-28 with total page 246 pages. Available in PDF, EPUB and Kindle. Book excerpt: A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.
Download or read book The Printed Circuit Designer s Guide To DFM written by David Marrakchi and published by . This book was released on 2017-02-28 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an in-depth look at DFM: what DFM entails, why it's so critical today, and how to implement the DFM techniques necessary to produce a manufacturable and functional board. With something to offer for both the seasoned designer and the newbie, after reading this book, PCB designers will have all the DFM knowledge they need to eliminate costly design re-spins and get a good board back, every time.
Download or read book Printed Circuit Assembly Design written by Leonard Marks and published by McGraw Hill Professional. This book was released on 2000-08-17 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Nuts-and-bolts guide to designing printed circuit assemblies Want to build circuit boards for today's smaller, faster electronics applications? This how-to tutorial puts a PCA design roadmap at your fingertips--valuable whether you're neophyte just starting out or an experienced designer, engineer or a manager associated with the electronics industry, as printed circuit assemblies are key building blocks in almost every commodity made today with any electronics content. In this unique one-stop design guide you'll find complete coverage of electrical and mechanical design considerations as you explore: design process flow; the latest design methods and tools; circuit board layout; documentation; more.
Download or read book Reliability Engineering written by Alessandro Birolini and published by Springer Science & Business Media. This book was released on 2003-08-20 with total page 564 pages. Available in PDF, EPUB and Kindle. Book excerpt: Using clear language, this book shows you how to build in, evaluate, and demonstrate reliability and availability of components, equipment, and systems. It presents the state of the art in theory and practice, and is based on the author's 30 years' experience, half in industry and half as professor of reliability engineering at the ETH, Zurich. In this extended edition, new models and considerations have been added for reliability data analysis and fault tolerant reconfigurable repairable systems including reward and frequency / duration aspects. New design rules for imperfect switching, incomplete coverage, items with more than 2 states, and phased-mission systems, as well as a Monte Carlo approach useful for rare events are given. Trends in quality management are outlined. Methods and tools are given in such a way that they can be tailored to cover different reliability requirement levels and be used to investigate safety as well. The book contains a large number of tables, figures, and examples to support the practical aspects.
Download or read book A Thermal Management Design for System on chip Circuits and Advanced Computer Systems written by Herming Chiueh and published by . This book was released on 2002 with total page 242 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Analog Circuit Design written by Bob Dobkin and published by Elsevier. This book was released on 2011-09-26 with total page 949 pages. Available in PDF, EPUB and Kindle. Book excerpt: Analog circuit and system design today is more essential than ever before. With the growth of digital systems, wireless communications, complex industrial and automotive systems, designers are challenged to develop sophisticated analog solutions. This comprehensive source book of circuit design solutions will aid systems designers with elegant and practical design techniques that focus on common circuit design challenges. The book’s in-depth application examples provide insight into circuit design and application solutions that you can apply in today’s demanding designs. Covers the fundamentals of linear/analog circuit and system design to guide engineers with their design challenges Based on the Application Notes of Linear Technology, the foremost designer of high performance analog products, readers will gain practical insights into design techniques and practice Broad range of topics, including power management tutorials, switching regulator design, linear regulator design, data conversion, signal conditioning, and high frequency/RF design Contributors include the leading lights in analog design, Robert Dobkin, Jim Williams and Carl Nelson, among others
Download or read book Advanced Materials for Thermal Management of Electronic Packaging written by Xingcun Colin Tong and published by Springer Science & Business Media. This book was released on 2011-01-05 with total page 633 pages. Available in PDF, EPUB and Kindle. Book excerpt: The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.
Download or read book Thermal and Power Management of Integrated Circuits written by Arman Vassighi and published by Springer Science & Business Media. This book was released on 2006-06-01 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book.
Download or read book Heat Transfer written by Younes Shabany and published by CRC Press. This book was released on 2009-12-17 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt: The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Download or read book Thermodynamics and Heat Power Ninth Edition written by Irving Granet and published by CRC Press. This book was released on 2020-11-05 with total page 865 pages. Available in PDF, EPUB and Kindle. Book excerpt: The ninth edition of Thermodynamics and Heat Power contains a revised sequence of thermodynamics concepts including physical properties, processes, and energy systems, to enable the attainment of learning outcomes by Engineering and Engineering Technology students taking an introductory course in thermodynamics. Built around an easily understandable approach, this updated text focuses on thermodynamics fundamentals, and explores renewable energy generation, IC engines, power plants, HVAC, and applied heat transfer. Energy, heat, and work are examined in relation to thermodynamics cycles, and the effects of fluid properties on system performance are explained. Numerous step-by-step examples and problems make this text ideal for undergraduate students. This new edition: Introduces physics-based mathematical formulations and examples in a way that enables problem-solving. Contains extensive learning features within each chapter, and basic computational exercises for in-class and laboratory activities. Includes a straightforward review of applicable calculus concepts. Uses everyday examples to foster a better understanding of thermal science and engineering concepts. This book is suitable for undergraduate students in engineering and engineering technology.
