Download or read book The Mechanics of Solder Alloy Wetting and Spreading written by Michael Hosking and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 367 pages. Available in PDF, EPUB and Kindle. Book excerpt: In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing science were inhibiting the evolution of new manufacturing technologies that are required for the U.S. to maintain a competitive posture in the world marketplace. The Army Research Laboratory and Sandia National Laboratories sought to contribute to the congressional intent by initiating a new series of graduate level college textbooks. The goal was to focus next-generation scientists onto issues that were common to the needs of the commercial market, the affordability of DoD weapons systems, and the mobilization readiness of the U.S. Armed Forces. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research ers using the book are encouraged to formulate programs that will establish scien tific correlations between manufacturing process controls and product reliability. Such correlations are essential to the building of a new electronics industry which is based upon the futuristic concepts of Virtual Factories, Prototyping, and Testing.

Download or read book The Mechanics of Solder Alloy Wetting and Spreading written by Michael Hosking and published by . This book was released on 1993-11-30 with total page 380 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Mechanics of Solder Alloy Interconnects written by Darrel R. Frear and published by Springer Science & Business Media. This book was released on 1994-01-31 with total page 434 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Download or read book Area Array Interconnection Handbook written by Karl J. Puttlitz and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 1250 pages. Available in PDF, EPUB and Kindle. Book excerpt: Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Download or read book Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2023-07-02 with total page 873 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ​

Download or read book Semiconductor Measurement Technology written by National Institute of Standards and Technology (U.S.) and published by . This book was released on with total page 72 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book National Semiconductor Metrology Program written by National Semiconductor Metrology Program (U.S.) and published by . This book was released on 1997 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book National Semiconductor Metrology Program NIST List OF Publications LP 103 May 2000 written by and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book National Semiconductor Metrology Program written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 2000 with total page 160 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book National Semiconductor Metrology Program Semiconductor Electronics Division NIST List Of Publications LP 103 March 1999 written by and published by . This book was released on 1999 with total page 148 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Principles of Soldering written by Giles Humpston and published by ASM International. This book was released on 2004 with total page 284 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Solder Joint Technology written by King-Ning Tu and published by Springer Science & Business Media. This book was released on 2007-07-27 with total page 376 pages. Available in PDF, EPUB and Kindle. Book excerpt: The European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.

Download or read book Handbook of Lead Free Solder Technology for Microelectronic Assemblies written by Karl J. Puttlitz and published by CRC Press. This book was released on 2004-02-27 with total page 1044 pages. Available in PDF, EPUB and Kindle. Book excerpt: This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif

Download or read book Energy Materials Coordinating Committe EMaCC Fiscal Year 2001 Annual Technical Report written by and published by DIANE Publishing. This book was released on with total page 214 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Soldering written by Mel Schwartz and published by ASM International. This book was released on 2014-03-01 with total page 207 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction.

Download or read book Advanced Joining Processes written by Lucas F. M. da Silva and published by Elsevier. This book was released on 2020-10-31 with total page 402 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced Joining Processes: Welding, Plastic Deformation, and Adhesion brings together a range of advanced thermal, mechanical, and chemical methods of joining, offering an up-to-date resource for those looking to understand and utilize the very latest techniques. Efficient joining techniques are critical to a range of innovative applications, with technology in constant development. The first section of the book provides in-depth information on advanced welding techniques, including friction stir, explosive, ultrasonic, laser, electron beam, and computational weld analysis and fatigue of structures. The second section highlights key developments in joining by plastic deformation, adhesive bonding, and hybrid joining. The coverage of each technique is supported by practical guidance, detailed analysis, and finite element simulations. This is an essential reference for researchers and advanced students in joining, welding, adhesion, materials processing, mechanical engineering, plastics engineering, manufacturing, civil engineering, and automotive/aerospace engineering, as well as engineers, scientists, and R&D professionals, using joining, welding, and adhesion methods, across a range of industries. Presents the latest research findings and developments across welding, joining by plastic deformation, and adhesion Includes state-of-the-art methods, such as laser, ultrasonic and electron beam welding, hybrid joining, and the use of electromagnetic pulses Offers practical guidance, detailed analysis, and finite element simulations, for all techniques covered

Download or read book Tailored Light 2 written by Reinhart Poprawe and published by Springer Nature. This book was released on 2023-11-05 with total page 894 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers the application technology of lasers, focusing more on the vast range of processes than on individual applications, in order to motivate and enable future innovations. The physical basics are presented in the first half of the book. The following examination of application categories and their processes is documented by experts from their practical points of view but always refers back to the underlying physical principles. In this way, readers are free to choose their own individual level of depth in understanding this globally relevant field of innovation. This new edition of Tailored Light 2: Laser Applications birings the book up to date with the latest applications of laster technology.