Download or read book The International Journal for Hybrid Microelectronics written by and published by . This book was released on 1986 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The International Journal for Hybrid Microelectronics written by and published by . This book was released on 1983 with total page 660 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The International Journal of Microcircuits and Electronic Packaging written by and published by . This book was released on 2002 with total page 194 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The International Journal of Microcircuits and Electronic Packaging written by and published by . This book was released on 2000 with total page 90 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Special Issue on the 1981 International Microelectronics Symposium written by and published by . This book was released on 1981 with total page 461 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Special Issue on the 1981 International Microelectronics Symposium October 12 14 1981 Chicago Ill written by and published by . This book was released on 1981 with total page 461 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Hybrid Microelectronics Handbook written by Jerry E. Sergent and published by McGraw-Hill Companies. This book was released on 1995 with total page 778 pages. Available in PDF, EPUB and Kindle. Book excerpt: Featuring new contributions from experts in the field, the second edition of the Handbook provides electronics design, process, and packaging engineers with the data they need to design, test, and manufacture today's most-wanted hybrid microcircuits.
Download or read book Printed Films written by Maria Prudenziati and published by Elsevier. This book was released on 2012-08-30 with total page 609 pages. Available in PDF, EPUB and Kindle. Book excerpt: Whilst printed films are currently used in varied devices across a wide range of fields, research into their development and properties is increasingly uncovering even greater potential. Printed films provides comprehensive coverage of the most significant recent developments in printed films and their applications.Materials and properties of printed films are the focus of part one, beginning with a review of the concepts, technologies and materials involved in their production and use. Printed films as electrical components and silicon metallization for solar cells are discussed, as are conduction mechanisms in printed film resistors, and thick films in packaging and microelectronics. Part two goes on to review the varied applications of printed films in devices. Printed resistive sensors are considered, as is the role of printed films in capacitive, piezoelectric and pyroelectric sensors, mechanical micro-systems and gas sensors. The applications of printed films in biosensors, actuators, heater elements, varistors and polymer solar cells are then explored, followed by a review of screen printing for the fabrication of solid oxide fuel cells and laser printed micro- and meso-scale power generating devices.With its distinguished editors and international team of expert contributors, Printed films is a key text for anyone working in such fields as microelectronics, fuel cell and sensor technology in both industry and academia. - Provides a comprehensive analysis of the most significant recent developments in printed films and their applications - Reviews the concepts, properties, technologies and materials involved in the production and use of printed films - Analyses the varied applications of printed films in devices, including printed restrictive sensors for physical quantities and printed thick film mechanical micro-systems (MEMS), among others
Download or read book Chip On Board written by John H. Lau and published by Springer Science & Business Media. This book was released on 1994-06-30 with total page 584 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field. It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.
Download or read book StarBriefs Plus written by Andre Heck and published by Springer Science & Business Media. This book was released on 2004-04-30 with total page 1132 pages. Available in PDF, EPUB and Kindle. Book excerpt: With about 200,000 entries, StarBriefs Plus represents the most comprehensive and accurately validated collection of abbreviations, acronyms, contractions and symbols within astronomy, related space sciences and other related fields. As such, this invaluable reference source (and its companion volume, StarGuides Plus) should be on the reference shelf of every library, organization or individual with any interest in these areas. Besides astronomy and associated space sciences, related fields such as aeronautics, aeronomy, astronautics, atmospheric sciences, chemistry, communications, computer sciences, data processing, education, electronics, engineering, energetics, environment, geodesy, geophysics, information handling, management, mathematics, meteorology, optics, physics, remote sensing, and so on, are also covered when justified. Terms in common use and/or of general interest have also been included where appropriate.
Download or read book Special Issue on the 1983 International Microelectronics Symposium October 31 November 2 1983 Philadelphia PA written by and published by . This book was released on 1983 with total page 664 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Wafer Scale Integration written by Earl E. Swartzlander Jr. and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 515 pages. Available in PDF, EPUB and Kindle. Book excerpt: Wafer Scale Integration (WSI) is the culmination of the quest for larger integrated circuits. In VLSI chips are developed by fabricating a wafer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells are interconnected to realize a system on the wafer. Since most signal lines stay on the wafer, stray capacitance is low, so that high speeds are achieved with low power consumption. For the same technology a WSI implementation may be a factor of five faster, dissipate a factor of ten less power, and require one hundredth to one thousandth the volume. Successful development of WSI involves many overlapping disciplines, ranging from architecture to test design to fabrication (including laser linking and cutting, multiple levels of interconnection, and packaging). This book concentrates on the areas that are unique to WSI and that are as a result not well covered by any of the many books on VLSI design. A unique aspect of WSI is that the finished circuits are so large that there will be defects in some portions of the circuit. Accordingly much attention must be devoted to designing architectures that facilitate fault detection and reconfiguration to of WSI include fabrication circumvent the faults. Other unique aspects technology and packaging.
Download or read book Influence of Temperature on Microelectronics and System Reliability written by Pradeep Lall and published by CRC Press. This book was released on 2020-07-09 with total page 332 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
Download or read book Proceedings of the International Microelectronics Symposium written by and published by . This book was released on 1982 with total page 576 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book RF and Microwave Microelectronics Packaging written by Ken Kuang and published by Springer Science & Business Media. This book was released on 2009-12-01 with total page 295 pages. Available in PDF, EPUB and Kindle. Book excerpt: RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
Download or read book Long Term Non Operating Reliability of Electronic Products written by Judy Pecht and published by CRC Press. This book was released on 2019-07-23 with total page 130 pages. Available in PDF, EPUB and Kindle. Book excerpt: In today's electronic environment, operating reliability for continued daily use of electronic products is essential. This book discusses the reliability of products that lie dormant for long periods of time and are subject to stresses such as humidity, ionic contaminants, temperature, radiation, shock, and vibration. Non-operating reliability is especially critical for life-saving electronic products such as fire alarm systems, standby power sources, and burglar alarms. Air bags in automobiles, earthquake alarm systems, and radiation warning systems in nuclear power plants are also covered. This physics-of-failure approach is also important to maintaining defense hardware such as missiles and munitions systems which often lie dormant for years before being deployed on very short notice
Download or read book Surface Mount and Related Technologies written by Gerald L. Ginsberg and published by CRC Press. This book was released on 1989-04-24 with total page 416 pages. Available in PDF, EPUB and Kindle. Book excerpt:
