Download or read book The Effects of Processing Induced Damage on Electrical Conduction Mechanisms and Time dependent Dielectric Breakdown of Low k Organosilicates written by and published by . This book was released on 2013 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: During plasma processing, low-k dielectric materials are necessarily exposed to a variety of potential damage sources, including energetic charged-particle bombardment, photon irradiation, and interaction with gas-phase radicals. Due to the possibility of significant modification of the electrical properties of low-k dielectrics, exposure to these damage sources can have deleterious effects on the long-term reliability of low-k materials. This work examines the role of plasma-processing-induced damage on leakage currents and time-dependent dielectric breakdown in low-k organosilicates. For this work, two types of organosilicate dielectrics were studied: PECVD SiCOH and a silsesquioxane-based photopatternable low-k material. ¬¬¬To determine the effects of processing-induced damage on low-k organosilicate materials, an electron-cyclotron resonance plasma reactor was used to expose low-k dielectrics to charged particle bombardment and energetic photon radiation. The UW-Madison synchrotron was also used as a source of high-intensity monochromatic VUV radiation. Leakage-current conduction mechanisms in pristine and plasma-exposed low-k organosilicate dielectrics were investigated using deposited MIS structures and ramped-voltage current-voltage characteristics. Schottky emission and Poole-Frenkel conduction were identified as the dominant conduction mechanisms in both materials. Plasma exposure was found to increase leakage currents and reduce breakdown voltage, and it was shown that this effect is driven by ion-bombardment energy at the sample surface. X-ray photoelectron spectroscopy (XPS) measurements confirmed plasma-induced carbon loss and formation of a thin oxide-like layer near the surface leading to degraded electrical performance. Measurements of the bandgap energy in low-k organosilicates were made by examining the onset of inelastic energy loss from XPS measurements. For UV-cured SiCOH films, the bandgap energy is measured to be 7.75 eV +/- 0.5 eV, and a bandgap of 8.25 +/- 0.5 eV is found for PPLK materials. Time-dependent dielectric breakdown (TDDB) measurements were made on unexposed, VUV-exposed, and plasma-exposed UV-cured SiCOH. Weibull statistics were used to investigate the dielectric lifetimes. It was found that processing-induced damage results in decreased lifetime and reduced charge-to-breakdown.
Download or read book Damage to and Copper Migration Into Low k Organosilicate Dielectrics from Vacuum ultraviolet Irradiation written by Xiangyu Guo and published by . This book was released on 2016 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: To extend Moore's law as far as possible, backend-of-the-line (BEOL) dielectrics, both intermetal and interlevel, with low dielectric constants (i.e. low-k) are needed to improve the performance of nano-electronic metal-interconnect structures in current and future integrated circuit. However, the reliability and yield issues associated with integration and implementation of such low-k dielectric materials are more challenging than expected. In this work, under the hypothesis that Cu migration into and breakdown of the organosilicate-based low-k dielectrics (a-SiOC:H) can be exacerbated by vacuum ultraviolet (VUV) irradiation, we characterize the VUV-induced damage to and Cu migration into a-SiOC:H low-k thin films. A state-of-the-art dense low-k a-SiOC:H dielectric thin film, which has being considered to be the next generation low-k capping layer dielectrics, was utilized in this work. Using a synchrotron radiation system as a monochromatic VUV source, VUV-induced modifications to a-SiOC:H were examined mechanically, electrically and chemically. To examine the roles of VUV photons on the Cu migration into and related time-dependent breakdown of low-k a-SiOC:H dielectrics, XPS depth profiles were measured on both pristine and VUV-exposed dense a-SiOC:H/Cu film stacks under various bias-temperature stress (BTS) conditions. We found that Cu migration in VUV-exposed a-SiOC:H dielectrics depends on the VUV photon energy. A threshold photon energy of 8.3 eV was found by measuring the Cu migration as a function of photon energy. Above this value, VUV irradiation will cause the Cu to be oxidized. In the presence of an electric field, Cu ions drift into a-SiOC:H and deteriorate the time-dependent dielectric breakdown (TDDB). Finally, a combined band alignment and defect energy-level diagrams are presented, so as to illustrate the barrier potential at the Cu/a-SiOC:H interface, alignments of the valence and conduction bands in the dielectric and the energy levels of processing-induced defect states. This allows many reported electrical-leakage mechanisms and reliability issues in low-k dielectrics and integrated low-k/Cu interconnects to be determined in greater detail.
Download or read book Dielectric Breakdown in Gigascale Electronics written by Juan Pablo Borja and published by Springer. This book was released on 2016-09-16 with total page 109 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the experimental and theoretical aspects of the time-dependent breakdown of advanced dielectric films used in gigascale electronics. Coverage includes the most important failure mechanisms for thin low-k films, new and established experimental techniques, recent advances in the area of dielectric failure, and advanced simulations/models to resolve and predict dielectric breakdown, all of which are of considerable importance for engineers and scientists working on developing and integrating present and future chip architectures. The book is specifically designed to aid scientists in assessing the reliability and robustness of electronic systems employing low-k dielectric materials such as nano-porous films. Similarly, the models presented here will help to improve current methodologies for estimating the failure of gigascale electronics at device operating conditions from accelerated lab test conditions. Numerous graphs, tables, and illustrations are included to facilitate understanding of the topics. Readers will be able to understand dielectric breakdown in thin films along with the main failure modes and characterization techniques. In addition, they will gain expertise on conventional as well as new field acceleration test models for predicting long term dielectric degradation.
Download or read book Effects of Moisture on the Breakdown Strength and Lifetime of Low Permittivity Dielectric for Nanometer Scale Interconnects written by Soo Young Choi (doctor of materials science and engineering.) and published by . This book was released on 2009 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: Advanced integrated circuit (IC) technology has implemented new materials for necessary and timely performance improvements. New materials are now required at both the front-end-of-line (FEoL) and back-end-of-line (BEoL) of the device because simple dimensional scaling with standard materials has come with performance costs that negate dimensional scaling performance improvements. At the FEoL, high-[kappa]/metal gate processes are being developed to reduce gate oxide leakage. At the BEoL, Cu-based metallization and low-[kappa] dielectric materials have been developed to reduce BEoL contribution to RC-propagation delay. Cu-based metallization has required change in integration strategy, which has led to concerns about new material reliability performance. Furthermore, continuing pressure to improve device performance requires that a new, more advanced low-[kappa] dielectric be used, which are mechanically and electrically inferior. These performance demands and greater reliability concerns must be balanced. This kind of balance requires that better understanding of the extrinsic threats to device reliability be understood and is the general area of interest for this work. In particular, this study examines the extent of degradation found in low-[kappa] dielectric when it is exposed to ambient moisture and the potential impact of this degradation on intrinsic reliability performance under electrical stress. The integration method is described for low-[kappa] dielectric processing so that potential damages during process can be explained. Local damages can allow moisture incorporation at the expense of additional dielectric performance and reliability degradation. The molecular form of moisture incorporation into low-[kappa] dielectric and potential process methods to reduce moisture incorporation are also discussed. The electrical reliability performance is shown using interdigitated structures through voltage ramped dielectric breakdown study of inter-metal dielectric (IMD). Clear evidence of dielectric degradation is found after extreme moisture incorporation. Moisture penetration impact is also examined on the long-term reliability of integrated low-[kappa] dielectric using time-dependent dielectric breakdown (TDDB). Results show a dramatic change in the observed field acceleration parameter through moisture exposure that is not easily explained in a standard way according to proposed dielectric breakdown models for low-[kappa] dielectrics. A simple modification of the thermochemical [Epsilon]-model is proposed to explain the results.
Download or read book Plasma processing induced Damage Of Thin Dielectric Films written by He Ren and published by LAP Lambert Academic Publishing. This book was released on 2012 with total page 188 pages. Available in PDF, EPUB and Kindle. Book excerpt: In semiconductor industry, material property degradation due to process is a critical factor that limits the device performance. Process-induced damage on a variety of dielectric materials is discussed and measured. Results from various metrologies are packaged and correlated into systematic theory. Charge-induced, chemical, and physical damage source in plasma process environment is identified and optimized. Two sample types of dielectrics are investigated: high-k dielectrics used in device technology and low-k dielectrics as observed in interconnect technology.
Download or read book Analysis of Time Dependent Dielectric Failures written by J. S. Kim and published by . This book was released on 1985 with total page 85 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Time Dependent Dielectric Breakdown (TDDB) has been studied for silicon dioxide by using a staircase voltage ramping technique. The result of the ramp tests on MOS capacitors indicates a definitive substrate effect on the TDDB, which manifests itself as an enhancement of the intermediate field breakdown in the breakdown histogram. The substrate effect observed may be caused by the oxygen impurities of the starting material. This conclusion is based on the observed fact that the gate oxide grown on the high oxygen content Czochralski wafers (35 ppm) shows the breakdown enhancement, while the gate oxide grown on the low oxygen content (
Download or read book Failure Analysis written by Marius Bazu and published by John Wiley & Sons. This book was released on 2011-03-08 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt: Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Download or read book Nanofluid Flow in Porous Media written by Mohsen Sheikholeslami Kandelousi and published by BoD – Books on Demand. This book was released on 2020-08-19 with total page 246 pages. Available in PDF, EPUB and Kindle. Book excerpt: Studies of fluid flow and heat transfer in a porous medium have been the subject of continuous interest for the past several decades because of the wide range of applications, such as geothermal systems, drying technologies, production of thermal isolators, control of pollutant spread in groundwater, insulation of buildings, solar power collectors, design of nuclear reactors, and compact heat exchangers, etc. There are several models for simulating porous media such as the Darcy model, Non-Darcy model, and non-equilibrium model. In porous media applications, such as the environmental impact of buried nuclear heat-generating waste, chemical reactors, thermal energy transport/storage systems, the cooling of electronic devices, etc., a temperature discrepancy between the solid matrix and the saturating fluid has been observed and recognized.
Download or read book Advanced Coating Materials written by Liang Li and published by John Wiley & Sons. This book was released on 2018-12-06 with total page 546 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides a comprehensive, yet practical source of reference, and excellent foundation for comparing the properties and performance of coatings and selecting the most suitable materials based on specific service needs and environmental factors. Coating technology has developed significant techniques for protecting existing infrastructure from corrosion and erosion, maintaining and enhancing the performance of equipment, and provided novel functions such as smart coatings greatly benefiting the medical device, energy, automotive and construction industries. The mechanisms, usage, and manipulation of cutting-edge coating methods are the focus of this book. Not only are the working mechanisms of coating materials explored in great detail, but also craft designs for further optimization of more uniform, safe, stable, and scalable coatings. A group of leading experts in different coating technologies demonstrate their main applications, identify the key bottlenecks, and outline future prospects. Advanced Coating Materials broadly covers the coating techniques, including cold spray, plasma vapor deposition, chemical vapor deposition, sol–gel method, etc., and their significant applications in microreactor technology, super(de)wetting, joint implants, electrocatalyst, etc. Numerous kinds of coating structures are addressed, including nanosize particles, biomimicry structures, metals and complexed materials, along with the environmental and human compatible biopolymers resulting from microbial activities. This state-of-the-art book is divided into three parts: (1) Materials and Methods: Design and Fabrication, (2) Coating Materials: Nanotechnology, and (3) Advanced Coating Technology and Applications.
Download or read book Polyhedral Oligomeric Silsesquioxane POSS Polymer Nanocomposites written by Sabu Thomas and published by Elsevier. This book was released on 2021-03-25 with total page 578 pages. Available in PDF, EPUB and Kindle. Book excerpt: Polyhedral Oligomeric Silsesquioxane (POSS) Polymer Nanocomposites: From Synthesis to Applications offers extensive coverage of polyhedral oligomeric silsesquioxanes and their nanocomposites, including their synthesis, characterization, interfacial interactions and advanced applications. Sections introduce essentials, information on their preparation and discussions on polymeric materials, including elastomers, thermoplastics, thermosetting polymers, polymer blends and IPNs. Further sections cover the latest analysis techniques, examine the properties of POSS-polymer nanocomposites, and discuss key application areas, such as biological, energy, defense, and space. Finally, issues surrounding industry implementation and lifecycle are explored. This is a valuable reference for researchers, scientists and advanced students in the areas of polymer composites and nanocomposites, polymer chemistry, polymer physics, polymer science, and materials science and engineering. In an industrial setting, this book will be of great interest to scientists, R&D professionals, and engineers across industries and disciplines. Covers all aspects of polyhedral oligomeric silsesquioxanes (POSS) and their nanocomposites, including synthesis and characterization techniques, properties, analysis, applications and trends Targets POSS nanocomposites, describing synthesis, characterization and the selection of POSS filler types according to polymeric material Explains the preparation and utilization of POSS polymer nanocomposites for cutting-edge applications, including biological, energy, and defense field applications
Download or read book Supercritical Fluid Cleaning written by Samuel P. Sawan and published by Elsevier. This book was released on 1998-12-31 with total page 307 pages. Available in PDF, EPUB and Kindle. Book excerpt: Although supercritial fluid (SCF) technology is now widely used in extraction and purification processes (in the petrochemical, food and pharmaceuticals industries), this book is the first to address the new application of cleaning. The objective is to provide a roadmap for readers who want to know whether SCF technology can meet their own processing and cleaning needs. It is particularly helpful to those striving to balance the requirements for a clean product and a clean environment. The interdisciplinary subject matter will appeal to scientists and engineers in all specialties ranging from materials and polymer sciences to chemistry and physics. It is also useful to those developing new processes for other applications, and references given at the end of each chapter provide links to the wider body of SCF literature. The book is organized with topics progressing from the fundamental nature of the supercritical state, through process conditions and materials interactions, to economic considerations. Practical examples are included to show how the technology has been successfully applied. The first four chapters consider principles governing SCF processing, detailing issues such as solubility, design for cleanability, and the dynamics of particle removal. The next three chapters discuss surfactants and microemulsions, SCF interaction with polymers, and the use of supercritical carbon dioxide (CO2) as a cleaning solvent. The closing chapters focus on more practical considerations such as scaleup, equipment costs, and financial analysis.
Download or read book National Semiconductor Metrology Program written by National Institute of Standards and Technology (U.S.) and published by . This book was released on 1995 with total page 146 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Rubber Nanocomposites written by Sabu Thomas and published by John Wiley & Sons. This book was released on 2010-04-09 with total page 729 pages. Available in PDF, EPUB and Kindle. Book excerpt: Rubber Nanocomposites: Preparation, Properties and Applications focuses on the preparation, characterization and properties of natural and synthetic rubber nanocomposites. The book carefully debates the preparation of unmodified and modified nanofillers, various manufacturing techniques of rubber nanocomposites, structure, morphology and properties of nanocomposites. The text reviews the processing; characterization and properties of 0-, 1D and 2D nanofiller reinforced rubber nanocomposites. It examines the polymer/filler interaction, i.e., the compatibility between matrix and filler using unmodified and modified nanofillers. The book also examines the applications of rubber nanocomposites in various engineering fields, which include tyre engineering. The book also examines the current state of the art, challenges and applications in the field of rubber nanocomposites. The handpicked selection of topics and expert contributions make this survey of rubber nanocomposites an outstanding resource for anyone involved in the field of polymer materials design. A handy "one stop" reference resource for important research accomplishments in the area of rubber nanocomposites. Covers the various aspects of preparation, characterization, morphology, properties and applications of rubber nanocomposites. Summarizes many of the recent technical research accomplishments in the area of nanocomposites, in a comprehensive manner It covers an up to date record on the major findings and observations in the field
Download or read book Logic Synthesis for Asynchronous Controllers and Interfaces written by J. Cortadella and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is the result of a long friendship, of a broad international co operation, and of a bold dream. It is the summary of work carried out by the authors, and several other wonderful people, during more than 15 years, across 3 continents, in the course of countless meetings, workshops and discus sions. It shows that neither language nor distance can be an obstacle to close scientific cooperation, when there is unity of goals and true collaboration. When we started, we had very different approaches to handling the mys terious, almost magical world of asynchronous circuits. Some were more theo retical, some were closer to physical reality, some were driven mostly by design needs. In the end, we all shared the same belief that true Electronic Design Automation research must be solidly grounded in formal models, practically minded to avoid excessive complexity, and tested "in the field" in the form of experimental tools. The results are this book, and the CAD tool petrify. The latter can be downloaded and tried by anybody bold (or desperate) enough to tread into the clockless (but not lawless) domain of small-scale asynchronicity. The URL is http://www.lsi. upc. esr j ordic/petrify. We believe that asynchronous circuits are a wonderful object, that aban dons some of the almost militaristic law and order that governs synchronous circuits, to improve in terms of simplicity, energy efficiency and performance.
Download or read book Polymer POSS Nanocomposites and Hybrid Materials written by Susheel Kalia and published by Springer. This book was released on 2018-11-27 with total page 462 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an overview of polymer nanocomposites and hybrid materials with polyhedral oligomeric silsesquioxanes (POSS). Among inorganic nanoparticles, functionalized POSS are unique nano-building blocks that can be used to create a wide variety of hybrid and composite materials, where precise control of nanostructures and properties is required. This book describes the influence of incorporation of POSS moieties into (organic) polymer matrices on the mechanical, thermal and flammability behavior of composites and hybrid organic-inorganic materials. Importantly, POSS-containing materials can be bio-functionalized by linking e.g. peptides and growth factors through appropriate surface modification in order to enhance the haemo-compatibility of cardiovascular devices made of these materials. This volume includes descriptions of synthesis routes of POSS and POSS-containing polymeric materials (e.g. based on polyolefines, epoxy resins and polyurethanes), presentation of POSS’ role as flame retardants and as biocompatible linker, as well as the depiction of decomposition and ageing processes.
Download or read book Advances in Elastomers I written by P. M. Visakh and published by Springer Science & Business Media. This book was released on 2013-03-29 with total page 497 pages. Available in PDF, EPUB and Kindle. Book excerpt: This is the first volume of a two-volume work which summarizes in an edited format and in a fairly comprehensive manner many of the recent technical research accomplishments in the area of Elastomers. “Advances in Elastomers” discusses the various attempts reported on solving these problems from the point of view of the chemistry and the structure of elastomers, highlighting the drawbacks and advantages of each method. It summarize the importance of elastomers and their multiphase systems in human life and industry, and covers all the topics related to recent advances in elastomers, their blends, IPNs, composites and nanocomposites. This first volume focuses on advances on the blends and interpenetrating networks (IPNs) of elastomers.
