Download or read book Texture and Microstructure of Copper Thin Films written by Daniel P. Tracy and published by . This book was released on 1994 with total page 166 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Texture Evolution in Aluminum copper Thin Films written by Conal Eugene Murray and published by . This book was released on 2000 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: The presence of 20 nm Ti barrier layers on ILD's modified the growth of Al and Al(Cu) films by providing an epitaxial template for the AI atoms to follow. Results from cross-sectional TEM and analytical electron microscopy (AEM) indicated that a TiAl3 reaction layer formed between the sputter deposited Al/Ti films deposited at temperatures as low as 150°C. The microstructure of the resultant Al(Cu) films was highly dependent on the ILD topography, which was not modified by the Ti layer. On ILD's with RMS roughnesses less than 2 nm 500 nm Al(Cu) films with pronounced (111) texture were produced with no discernible offset. For rougher ILD surfaces, a model that incorporated the underlying ILD morphology, as characterized by atomic force microscopy (AFM), was created to quantitatively describe the observed offset in Al (111) texture.

Download or read book Microstructure and Texture of Electroplated Copper Films and Damascene Lines written by Tejodher Muppidi and published by . This book was released on 2003 with total page 212 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Proceedings from the Symposia Textures in Non Metallic Materials and Microstructure and Texture Evolution During Annealing of Deformed Materials written by D. B. Knorr and published by CRC Press. This book was released on 1991 with total page 120 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Sputtering Materials for VLSI and Thin Film Devices written by Jaydeep Sarkar and published by William Andrew. This book was released on 2010-12-13 with total page 614 pages. Available in PDF, EPUB and Kindle. Book excerpt: An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues. The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) the second section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications. In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure, stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful. . - Unique coverage of sputtering target manufacturing methods in the light of semiconductor, displays, data storage and photovoltaic industry requirements - Practical information on technology trends, role of sputtering and major OEMs - Discussion on properties of a wide variety of thin films which include silicides, conductors, diffusion barriers, transparent conducting oxides, magnetic films etc. - Practical case-studies on target performance and troubleshooting - Essential technological information for students, engineers and scientists working in the semiconductor, display, data storage and photovoltaic industry

Download or read book A Comparative Study of Stress Resistivity and Microstructure in Copper and Copper alloy Thin Films written by Julie Gupta and published by . This book was released on 1992 with total page 170 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Magnetic and Electronic Films Microstructure Texture and Application to Data Storage Volume 721 written by Patrick W. DeHaven and published by . This book was released on 2002-08-02 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Download or read book Applications of Texture Analysis written by A. D. Rollett and published by John Wiley & Sons. This book was released on 2008-12-05 with total page 838 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume contains papers presented at The 15th International Conference on the Texture of Materials from June 1-5th, 2008 in Pittsburgh, PA. Chapters include: Thin Films Texture at Non-Ambient Conditions Novel Texture Measurement Techniques Including 3D Complex Oxides Interface Textures Recrystallization Texture Biomaterials Texture Effects on Damage Accumulation Digital Microstructures View information on Materials Processing and Texture: Ceramic Transactions, Volume 200.

Download or read book Grain Growth and Texture Evolution in Copper Thin Films written by Petra Sonnweber-Ribic and published by . This book was released on 2010 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Microstructure and Properties of Copper Thin Films on Silicon Substrates written by Vibhor Vinodkumar Jain and published by . This book was released on 2010 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: Copper has become the metal of choice for metallization, owing to its high electrical and thermal conductivity, relatively higher melting temperature and correspondingly lower rate of diffusivity. Most of the current studies can get high strength copper thin films but on an expense of conductivity. This study proposes a technique to deposit high strength and high conductivity copper thin films on different silicon substrates at room temperature. Single crystal Cu (100) and Cu (111) have been grown on Si (100) and Si (110) substrates, respectively. Single crystal Cu (111) films have a high density of growth twins, oriented parallel to the substrate surface due to low twin boundary energy and a high deposition rate. The yield strengths of these twinned Cu films are much higher than that of bulk copper, with an electrical resistivity value close to that of bulk copper. X-ray diffraction, transmission electron microscopy and nanoindentation techniques were used to show that high density twins are sole reason for the increase in hardness of these thin films. The formation of growth twins and their roles in enhancing the mechanical strength of Cu films while maintaining low resistivity are discussed.

Download or read book Thin Film Analysis by X Ray Scattering written by Mario Birkholz and published by John Wiley & Sons. This book was released on 2006-05-12 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt: With contributions by Paul F. Fewster and Christoph Genzel While X-ray diffraction investigation of powders and polycrystalline matter was at the forefront of materials science in the 1960s and 70s, high-tech applications at the beginning of the 21st century are driven by the materials science of thin films. Very much an interdisciplinary field, chemists, biochemists, materials scientists, physicists and engineers all have a common interest in thin films and their manifold uses and applications. Grain size, porosity, density, preferred orientation and other properties are important to know: whether thin films fulfill their intended function depends crucially on their structure and morphology once a chemical composition has been chosen. Although their backgrounds differ greatly, all the involved specialists a profound understanding of how structural properties may be determined in order to perform their respective tasks in search of new and modern materials, coatings and functions. The author undertakes this in-depth introduction to the field of thin film X-ray characterization in a clear and precise manner.

Download or read book Plasticity in Cu Thin Films written by Yong Xiang and published by . This book was released on 2005 with total page 372 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Controllable Growth Microstructure and Electronic Structure of Copper Oxide Thin Films written by Yong Wang and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Microstructure Evolution in Electrodeposited Copper Thin Films for Advanced Microelectronic Applications written by Nidal Khalaf Alshwawreh and published by . This book was released on 2012 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.

Download or read book Thin Films of Copper Oxide and Copper Grown by Atomic Layer Deposition for Applications in Metallization Systems of Microelectronic Devices written by Thomas Wächtler and published by Thomas Waechtler. This book was released on 2010 with total page 247 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Diffusion Processes in Advanced Technological Materials written by Devendra Gupta and published by Springer Science & Business Media. This book was released on 2013-01-15 with total page 552 pages. Available in PDF, EPUB and Kindle. Book excerpt: This new game book for understanding atoms at play aims to document diffusion processes and various other properties operative in advanced technological materials. Diffusion in functional organic chemicals, polymers, granular materials, complex oxides, metallic glasses, and quasi-crystals among other advanced materials is a highly interactive and synergic phenomenon. A large variety of atomic arrangements are possible. Each arrangement affects the performance of these advanced, polycrystalline multiphase materials used in photonics, MEMS, electronics, and other applications of current and developing interest. This book is written by pioneers in industry and academia for engineers, chemists, and physicists in industry and academia at the forefront of today's challenges in nanotechnology, surface science, materials science, and semiconductors.