Download or read book System in package RF Design and Applications written by Michael P. Gaynor and published by Artech House Publishers. This book was released on 2007 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.
Download or read book SiP System in Package Design and Simulation written by Suny Li (Li Yang) and published by John Wiley & Sons. This book was released on 2017-07-12 with total page 507 pages. Available in PDF, EPUB and Kindle. Book excerpt: An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Download or read book Introduction to RF Design Using EM Simulators written by Hiroaki Kogure and published by Artech House. This book was released on 2011 with total page 309 pages. Available in PDF, EPUB and Kindle. Book excerpt: Richly illustrated and written in an easy-to-comprehend style, this highly accessible resource provides novice engineers and engineering students with a solid introduction to the use of electromagnetics (EM) simulation in RF design. Engineers learn how to use EM software to design microwave circuits and to conduct signal integrity analysis of high-speed digital circuits. This authoritative book describes exactly how microwave and high-speed digital circuits operate, offering practitioners clear troubleshooting guidance for their work with these circuits. Professionals and students also benefit from a thorough overview of the wide range of high-frequency circuits and related EM tools being utilized in the field today.
Download or read book Substrate Integrated Suspended Line Circuits and Systems written by Kaixue Ma and published by Artech House. This book was released on 2024-03-31 with total page 305 pages. Available in PDF, EPUB and Kindle. Book excerpt: Substrate Integrated Suspended Line Circuits and Systems provides a systematic overview of the new transmission line - the substrate-integrated suspension line (SISL). It details the fundamentals and classical application examples of the SISL. The basic SISL concept and structure, various passive circuits and active circuits, and front-end sub-systems are systematically introduced. Featuring research on topics such as high-performance RF/microwave/mm-wave circuits and system, this book is ideal for researchers, engineers, scientists, scholars, educators, and students. Since transmission line is a fundamental component of microwave and mm-wave circuits, the properties of a transmission line, such as losses, size, and dispersion, are vital to the performance of the whole system. Suspended line has been proved to be an excellent transmission line, as it has attractive features such as low loss, weak dispersion, high power capacity, and low effective dielectric constant. However, Conventional waveguide suspended line circuits require metal housing to form air cavities which is Substrate Integrated Suspended Line Circuits and Systems essential to the operation of suspended lines circuits. Also, the metal shell should provide mechanical support and shielding, which contribute to large size and heavy weight. Meanwhile, precise mechanical fabrication and assembling are strongly required, which brings difficulties to the design and fabrication of conventional suspended line circuits, and the manufacturing cost of suspended line circuits increases correspondingly. In this book, we will introduce a new platform of high-performance transmission line, i.e. substrate integrated suspended line (SISL). SISL keeps all the merits of the suspended line while overcomes the drawbacks of conventional waveguide suspended line circuits. Moreover, it is self-packaged and highly integrated. The basic SISL concept and structure, various passive circuits and active circuits, and front-end sub-systems will be systematically introduced. Featuring research on topics such as high-performance RF/microwave/mm-wave circuits and system, this book is ideally designed for researchers, engineers, scientists, scholars, educators, and students.
Download or read book Lumped Elements for RF and Microwave Circuits Second Edition written by Inder J. Bahl and published by Artech House. This book was released on 2022-12-31 with total page 593 pages. Available in PDF, EPUB and Kindle. Book excerpt: Fully updated and including entirely new chapters, this Second Edition provides in-depth coverage of the different types of RF and microwave circuit elements, including inductors, capacitors, resistors, transformers, via holes, airbridges, and crossovers. Featuring extensive formulas for lumped elements, design trade-offs, and an updated and current list of references, the book helps you understand the value and usefulness of lumped elements in the design of RF, microwave and millimeter wave components and circuits. You’ll find a balanced treatment between standalone lumped elements and their circuits using MICs, MMICs and RFICs technologies. You’ll also find detailed information on a broader range RFICs that was not available when the popular first edition was published. The book captures – in one consolidated volume -- the fundamentals, equations, modeling, examples, references and overall procedures to design, test and produce microwave components that are indispensable in industry and academia today. With its superb organization and expanded coverage of the subject, this is a must-have, go-to resource for practicing engineers and researchers in industry, government and university and microwave engineers working in the antenna area. Students will also find it a useful reference with its clear explanations, many examples and practical modeling guidelines.
Download or read book System in Package written by Lei He and published by Now Publishers Inc. This book was released on 2011-06-20 with total page 93 pages. Available in PDF, EPUB and Kindle. Book excerpt: Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.
Download or read book Nonlinear Design FETs and HEMTs written by Peter H. Ladbrooke and published by Artech House. This book was released on 2021-11-30 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: Despite its continuing popularity, the so-called standard circuit model of compound semiconductor field-effect transistors (FETs) and high electron mobility transistors (HEMTs) is shown to have a limitation for nonlinear analysis and design: it is valid only in the static limit. When the voltages and currents are time-varying, as they must be for these devices to have any practical use, the model progressively fails for higher specification circuits. This book shows how to reform the standard model to render it fully compliant with the way FETs and HEMTs actually function, thus rendering it valid dynamically. Proof-of-principle is demonstrated for several practical circuits, including a frequency doubler and amplifiers with demanding performance criteria. Methods for extracting both the reformulated model and the standard model are described, including a scheme for re-constructing from S-parameters the bias-dependent dynamic (or RF) I(V) characteristics along which devices work in real-world applications, and as needed for the design of nonlinear circuits using harmonic-balance and time-domain simulators. The book includes a historical review of how variations on the standard model theme evolved, leading up to one of the most widely used—the Angelov (or Chalmers) model.
Download or read book Modeling and Simulation for RF System Design written by Ronny Frevert and published by Springer Science & Business Media. This book was released on 2006-06-28 with total page 296 pages. Available in PDF, EPUB and Kindle. Book excerpt: Modern telecommunication systems are highly complex from an algorithmic point of view. The complexity continues to increase due to advanced modulation schemes, multiple protocols and standards, as well as additional functionality such as personal organizers or navigation aids. To have short and reliable design cycles, efficient verification methods and tools are necessary. Modeling and simulation need to accompany the design steps from the specification to the overall system verification in order to bridge the gaps between system specification, system simulation, and circuit level simulation. Very high carrier frequencies together with long observation periods result in extremely large computation times and requires, therefore, specialized modeling methods and simulation tools on all design levels. The focus of Modeling and Simulation for RF System Design lies on RF specific modeling and simulation methods and the consideration of system and circuit level descriptions. It contains application-oriented training material for RF designers which combines the presentation of a mixed-signal design flow, an introduction into the powerful standardized hardware description languages VHDL-AMS and Verilog-A, and the application of commercially available simulators. Modeling and Simulation for RF System Design is addressed to graduate students and industrial professionals who are engaged in communication system design and want to gain insight into the system structure by own simulation experiences. The authors are experts in design, modeling and simulation of communication systems engaged at the Nokia Research Center (Bochum, Germany) and the Fraunhofer Institute for Integrated Circuits, Branch Lab Design Automation (Dresden, Germany).
Download or read book Microwave and Millimeter Wave Vacuum Electron Devices Inductive Output Tubes Klystrons Traveling Wave Tubes Magnetrons Crossed Field Amplifiers and Gyrotrons written by A.S. Gilmour, Jr. and published by Artech House. This book was released on 2020-04-30 with total page 880 pages. Available in PDF, EPUB and Kindle. Book excerpt: Written by an internationally recognized as an expert on the subject of microwave (MW) tubes, this book presents and describes the many types of microwave tubes, and despite competition from solid-state devices (those using GaN, SiC, et cetera), which continue to be used widely and find new applications in defense, communications, medical, and industrial drying. Helix traveling wave tubes (TWTs), as well as coupled cavity TWTs are covered. Klystrons, and how they work, are described, along with the physics behind it and examples of devices and their uses. Vacuum electron devices are explained in detail and examines the harsh environment that must exist in tubes if they are to operate properly. The secondary emission process and its role in the operation of crossed-field devices is also discussed. The design of collectors for linear-beam tubes, including power dissipation and power recovery, are explored. Discussions of important noise sources and techniques that can be used to minimize their effects are also included. Presented in full color, this book contains a balance of practical and theoretical material so that those new to microwave tubes as well as experienced microwave tube technicians, engineers, and managers can benefit from its use.
Download or read book RF and Microwave Applications and Systems written by Mike Golio and published by CRC Press. This book was released on 2018-10-03 with total page 690 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume, RF and Microwave Applications and Systems, includes a wide range of articles that discuss RF and microwave systems used for communication and radar and heating applications. Commercial, avionics, medical, and military applications are addressed. An overview of commercial communications systems is provided. Past, current, and emerging cellular systems, navigation systems, and satellite-based systems are discussed. Specific voice and data commercial systems are investigated more thoroughly in individual chapters that follow. Detailed discussions of military electronics, avionics, and radar (both military and automotive) are provided in separate chapters. A chapter focusing on FR/microwave energy used for therapeutic medicine is also provided. Systems considerations including thermal, mechanical, reliability, power management, and safety are discussed in separate chapters. Engineering processes are also explored in articles about corporate initiatives, cost modeling, and design reviews. The book closes with a discussion of the underlying physics of electromagnetic propagation and interference. In addition to new chapters on WiMAX and broadband cable, nearly every existing chapter features extensive updates and several were completely rewritten to reflect the massive changes areas such as radio navigation and electronic warfare.
Download or read book Microwave Power Amplifier Design with MMIC Modules written by Howard Hausman and published by Artech House. This book was released on 2018-06-30 with total page 395 pages. Available in PDF, EPUB and Kindle. Book excerpt: Solid state power amplifiers (SSPA) are a critical part of many microwave systems. Designing SSPAs with monolithic microwave integrated circuits (MMIC) has boosted device performance to much higher levels focused on PA modules. This cutting-edge book offers engineers practical guidance in selecting the best power amplifier module for a particular application and interfacing the selected module with other power amplifier modules in the system. It also explains how to identify and mitigate peripheral issues concerning the PA modules, SSPAs, and microwave systems. This authoritative volume presents the critical techniques and underpinnings of SSPA design, enabling professionals to optimize device and system performance. Engineers gain the knowledge they need to evaluate the optimum topologies for the design of a chain of microwave devices, including power amplifiers. Additionally, the book addresses the interface between the microwave subsystems and the primary DC power, the control and monitoring circuits, and the thermal and EMI paths. Packed with 240 illustrations and over 430 equations, this detailed book provides the practical tools engineers need for their challenging projects in the field.
Download or read book Parameter Extraction and Complex Nonlinear Transistor Models written by Gunter Kompa and published by Artech House. This book was released on 2019-12-31 with total page 609 pages. Available in PDF, EPUB and Kindle. Book excerpt: All model parameters are fundamentally coupled together, so that directly measured individual parameters, although widely used and accepted, may initially only serve as good estimates. This comprehensive resource presents all aspects concerning the modeling of semiconductor field-effect device parameters based on gallium-arsenide (GaAs) and gallium nitride (GaN) technology. Metal-semiconductor field-effect transistors (MESFETs), high electron mobility transistors (HEMTs) and heterojunction bipolar transistors (HBTs), their structures and functions, and existing transistor models are also classified. The Shockley model is presented in order to give insight into semiconductor field-effect transistor (FET) device physics and explain the relationship between geometric and material parameters and device performance. Extraction of trapping and thermal time constants is discussed. A special section is devoted to standard nonlinear FET models applied to large-signal measurements, including static-/pulsed-DC and single-/two-tone stimulation. High power measurement setups for signal waveform measurement, wideband source-/load-pull measurement (including envelope source-/load pull) are also included, along with high-power intermodulation distortion (IMD) measurement setup (including envelope load-pull). Written by a world-renowned expert in the field, this book is the first to cover of all aspects of semiconductor FET device modeling in a single volume.
Download or read book Microwave Transmission Line Circuits written by William T. Joines and published by Artech House. This book was released on 2013 with total page 318 pages. Available in PDF, EPUB and Kindle. Book excerpt: This authoritative resource offers professionals and students valuable assistance with their work and studies involving microwave circuit analysis and design. Readers gain a thorough understanding of the properties of planar transmission lines for integrated circuits. Moreover, this practical book presents matrix and computer-aided methods for analysis and design of circuit components. Engineers find in-depth details on input, output, and interstage networks, as well as coverage of stability, noise, and signal distortion.
Download or read book System on Package written by Rao Tummala and published by McGraw Hill Professional. This book was released on 2007-07-22 with total page 807 pages. Available in PDF, EPUB and Kindle. Book excerpt: System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Download or read book Electronic Packaging Science and Technology written by King-Ning Tu and published by John Wiley & Sons. This book was released on 2021-12-14 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt: Must-have reference on electronic packaging technology! The electronics industry is shifting towards system packaging technology due to the need for higher chip circuit density without increasing production costs. Electronic packaging, or circuit integration, is seen as a necessary strategy to achieve a performance growth of electronic circuitry in next-generation electronics. With the implementation of novel materials with specific and tunable electrical and magnetic properties, electronic packaging is highly attractive as a solution to achieve denser levels of circuit integration. The first part of the book gives an overview of electronic packaging and provides the reader with the fundamentals of the most important packaging techniques such as wire bonding, tap automatic bonding, flip chip solder joint bonding, microbump bonding, and low temperature direct Cu-to-Cu bonding. Part two consists of concepts of electronic circuit design and its role in low power devices, biomedical devices, and circuit integration. The last part of the book contains topics based on the science of electronic packaging and the reliability of packaging technology.
Download or read book Microwave Network Design Using the Scattering Matrix written by Janusz Dobrowolski and published by Artech House. This book was released on 2010 with total page 287 pages. Available in PDF, EPUB and Kindle. Book excerpt: This authoritative resource provides you with comprehensive and detailed coverage of the wave approach to microwave network characterization, analysis, and design using scattering parameters. For the first time in any book, all aspects and approaches to wave variables and the scattering matrix are explored. The book compares and contrasts voltage waves, travelling waves, pseudo waves, and power waves, and explains the differences between real scattering parameters, pseudo scattering parameters, and power scattering parameters. You find important discussions on standard scattering matrices and wave quantities, mixed mode wave variables, and noise wave variables with noise wave correlation matrices. Moreover, the book presents clear methods for standard single ended multiport network design and noise analysis. This in-depth reference is packed with over 1,100 equations and numerous illustrations.
Download or read book Introduction to Microsystem Packaging Technology written by Yufeng Jin and published by CRC Press. This book was released on 2017-12-19 with total page 232 pages. Available in PDF, EPUB and Kindle. Book excerpt: The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
