Download or read book Surface and Mechanical Stress Effects in AlGaN GaN High Electron Mobility Transistors written by Sameer Jayanta Joglekar and published by . This book was released on 2017 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: Gallium Nitride (GaN) belongs to a class of materials called wide band-gap semiconductors. In recent years, the versatile nature of this material has been exploited for a wide range of applications from solid state lighting to RF and microwave communication, as well as high power switching. The first part of this thesis discusses planar AlGaN/GaN transistors. GaN is a piezoelectric material, and changes in mechanical stress result in a change in the charge density which in turn affects the maximum current in AlGaN/GaN transistors. Finite element modelling techniques were applied to quantify the mechanical stress distribution in planar AlGaN/GaN RF transistors resulting from device fabrication, and operation in the on- and off-state. Thereafter, two important surface and interface effects were studied in this thesis. In the first one, the impact of surface cleanings, surface treatments and plasma-based dry etch conditions on two different types of ohmic contact technologies was investigated. Contact resistance measurements were correlated with surface characterization results. The second was that of interface positive charges at the Al2O3-GaN interface and the increase in electron density in the device resulting from them. In both these problems, a combination of device electrical measurements and material characterization techniques was used to establish direct correlations between device behavior and material properties. The second part of the thesis deals exclusively with nano-ribbon (NR) or fin-like AlGaN/GaN transistors. Fundamental transport properties of charge density and mobility in NR devices were studied in order to understand the difference in behavior of these devices from planar devices. The influence of passivation films on the charge density in these structures was investigated, using Al2O3 passivation as a specific example. Electron mobility degradation due to sidewall-scattering in NR devices was quantified using different mobility extraction methods based on device measurements. The thesis concludes with a potential application of NR AlGaN/GaN transistors for high linearity power amplification. A new kind of transistor with varying threshold voltages along the gate width is proposed to improve the DC and RF linearity of GaN-based devices.

Download or read book A Study of Effect of Stress on the AlGaN GaN High Electron Mobility Transistor written by 徐啓桓 and published by . This book was released on 2019 with total page 70 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Analysis and Optimization of AlGaN GaN High Electron Mobility Transistors for Microwave Applications written by Michael Hosch and published by Cuvillier Verlag. This book was released on 2011-08-08 with total page 129 pages. Available in PDF, EPUB and Kindle. Book excerpt: This thesis deals with the analysis and optimization of some of the most prominent non-ideal effects in AlGaN/GaN high electron mobility transistors used in microwave applications as well as the optimization of the RF gain. The effect of current collapse, the root cause of leakage currents as well as field-dependent self-heating effects have been investigated by eletrical characterization using well established techniques and have been analyzed using 2-dimensional physical device simulations. It will be shown that the origin of all effects is strongly related to the device surface and some are even competing effects making device optimization a challenge. However, a detailed localization of the regions affecting device performance will be given leading to a better understanding for fabrication process optimization. Finally, I simulation study is conducted giving suggestions for RF gain improvement based on very simple device layout variations.

Download or read book Handbook for III V High Electron Mobility Transistor Technologies written by D. Nirmal and published by CRC Press. This book was released on 2019-05-14 with total page 446 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focusses on III-V high electron mobility transistors (HEMTs) including basic physics, material used, fabrications details, modeling, simulation, and other important aspects. It initiates by describing principle of operation, material systems and material technologies followed by description of the structure, I-V characteristics, modeling of DC and RF parameters of AlGaN/GaN HEMTs. The book also provides information about source/drain engineering, gate engineering and channel engineering techniques used to improve the DC-RF and breakdown performance of HEMTs. Finally, the book also highlights the importance of metal oxide semiconductor high electron mobility transistors (MOS-HEMT). Key Features Combines III-As/P/N HEMTs with reliability and current status in single volume Includes AC/DC modelling and (sub)millimeter wave devices with reliability analysis Covers all theoretical and experimental aspects of HEMTs Discusses AlGaN/GaN transistors Presents DC, RF and breakdown characteristics of HEMTs on various material systems using graphs and plots

Download or read book Current Collapse Induced in AlGaN GaN High Electron Mobility Transistors by Bias Stress written by and published by . This book was released on 2003 with total page 4 pages. Available in PDF, EPUB and Kindle. Book excerpt: Current collapse is observed to be induced in AlGaN/GaN high-electron-mobility transistors as a result of short-term bias stress. This effect was seen in devices grown by both metalorganic chemical vapor deposition (MOCVD) and molecular-beam epitaxy (MBE). The induced collapse appears to be permanent and can be reversed by SiN passivation. The traps responsible for the collapse have been studied by photoionization spectroscopy. For the MOCVD-grown devices, the same traps cause the collapse in both unstressed and stressed devices. These effects are thought to result from hot-carrier damage during stress.

Download or read book Surface Pretreatment in AlGaN GaN Metal Oxide Semiconductor High Electron Mobility Transistors with Post Gate Annealing written by 許紹倫 and published by . This book was released on 2020 with total page 97 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Surface Passivation Studies of ALGAN GAN High Electron Mobility Transistors written by David J. Meyer and published by . This book was released on 2008 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Modeling of AlGaN GaN High Electron Mobility Transistors written by D. Nirmal and published by Springer. This book was released on 2025-02-11 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume focuses on GaN HEMT, the most promising transistor technology for RF power applications such as 5G communications, space and defense. The contents include accurate small signal models required to predict the RF power performance of RF electronic circuits, large signal modeling of GaN HEMTs, accurate and compact physical models to assist the RF circuit designers to optimize GaN HEMT-based power amplifiers and integrated circuits, among others. The book also covers thermal resistance modeling of GaN HEMTs, charge-based compact models, and surface potential-based models to study the impact of gate leakage current on the RF power performance of GaN HEMTs. This book also deals with the analytical modeling of intrinsic charges and surface potential of GaN HEMTs, physical modeling of charge trapping, neural network-based GaN HEMT models, numerical-based GaN HEMT models, modeling of short channel effects in GaN HEMTs, modeling of parasitic capacitances and resistances, modelingof current collapse and kink effects in HGaN HEMTs, etc. This volume will be a useful to those in industry and academia.

Download or read book Investigation of Electrical Bias Mechanical Stress Temperature and Ambient Effect on AlGaN GaN Hemt Time Dependent Degradation written by Amit Gupta and published by . This book was released on 2013 with total page 143 pages. Available in PDF, EPUB and Kindle. Book excerpt: AlGaN/GaN HEMT technology is promising for RF and high power applications. However commercial usability of this technology is currently hindered because of its limited electrical reliability which still remains a major concern. AlGaN/GaN HEMTs have been shown to degrade irreversibly under typical device operation and there is widespread disagreement on the underlying fundamental physics for the observed device degradation. Electrical degradation in AlGaN/GaN HEMTs due to DC stressing is studied typically by performing electrical step stress tests and a critical voltage is determined. Device degradation is characterized by changes measured in electrical parameters, such as increase in Rs and RD, decrease in IDsat, decrease in gm, Vt shift and sub-threshold change. The widely accepted theory attributes such degradation to the inverse piezoelectric effect. Electric field due to applied bias generates biaxial tensile stress which together with intrinsic stress from lattice mismatch increases the elastic energy of AlGaN layer.

Download or read book Design Growth and Characterization of AlGaN GaN High Electron Mobility Transistors written by Michael James Murphy and published by . This book was released on 2000 with total page 226 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Fabrication Characterization and Modeling of AlGaN GaN High Electron Mobility Transistors written by Ekaterina Harvard and published by . This book was released on 2013 with total page 230 pages. Available in PDF, EPUB and Kindle. Book excerpt: Initially, advances in the high frequency markets were begun by work in Gallium Arsenide systems. In recent years, however, the focus has shifted to the promise of ever higher power at ever higher frequency with the emergence of wide bandgap group III-V semiconductors, including Gallium Nitride. One area receiving attention is that of novel passivation materials for the active areas of AlGaN/GaN devices. Passivation is a critical issue because surface trapping effects are essentially unavoidable, even with the highest queality epitaxial layers, due to the polarized nature of the material. The question then becomes, which passivation materials offer the best mitigation of surface trapping effects with the least impact on parasitic elements detrimental to device performance. In this work, AlGaN/GaN devices passivated with AlSiN for both high frequency and high power operation are studied. The high frequency devices were fabricated alongside devices passivated with SiN, a standard passivation material, and characterized for both small signal and large signal performance. The AlSiN passivation was found to enhance both small and large signal performance, and so another set of devices was fabricated with high voltage, high power switching as the intended application. These devices were characterized for off-state breakdown, which was more than 4 times that of typical SiN-passivated devices, and time-domain and loadline measurements were performed.

Download or read book Impact of Electrochemical Process on the Degradation Mechanisms of AlGaN GaN HEMTs written by Feng Gao (Ph. D.) and published by . This book was released on 2014 with total page 121 pages. Available in PDF, EPUB and Kindle. Book excerpt: AlGaN/GaN high electron mobility transistors (HEMTs) constitute a new generation of transistors with excellent electrical characteristics and great potential to replace silicon technology in the future, especially in high power and high frequency applications. However, the poor long term reliability of these devices is an important bottleneck for their wide market insertion and limits their advanced development. This thesis tackles this problem by focusing on understanding the physics behind various degradation modes and providing new quantitative models to explain these mechanisms. The first part of the thesis, Chapters 2 and 3, reports studies of the origin of permanent structural and electrical degradation in AlGaN/GaN HEMTs. Hydroxyl groups (OH-) from the environment and/or adsorbed water on the III-N surface are found to play an important role in the formation of surface pits during the OFF-state electrical stress. The mechanism of this water-related structural degradation is explained by an electrochemical cell formed at the gate edge where gate metal, the II-N surface and the passivation layer meet. Moreover, the permanent decrease of the drain current is directly linked with the formation of the surface pits, while the permanent increase of the gate current is found to be uncorrelated with the structural degradation. The second part of the thesis, Chapters 4 and 5, identifies water-related redox couples in ambient air as important sources of dynamic on-resistance and drain current collapse in AlGaN/GaN HEMTs. Through in-situ X-ray photoelectron spectroscopy (XPS), direct signature of the water-related species is found at the AlGaN surface at room temperature. It is also found that these species, as well as the current collapse, can be thermally removed above 200 °C in vacuum conditions. An electron trapping mechanism based on H2O/H2 and H2O/O2 redox couples is proposed to explain the 0.5 eV energy level commonly attributed to surface trapping states. Moreover, the role of silicon nitride passivation in successfully removing current collapse in these devices is explained by blocking the water molecules away from the AlGaN surface. Finally, fluorocarbon, a highly hydrophobic material, is proven to be an excellent passivation to overcome transient degradation mechanisms in AlGaN/GaN HEMTs.

Download or read book Modeling of AlGaN GaN High Electron Mobility Transistor for Sensors and High temperature Circuit Applications written by Sazia Afreen Eliza and published by . This book was released on 2008 with total page 87 pages. Available in PDF, EPUB and Kindle. Book excerpt: With the most advanced and mature technology for electronic devices, silicon (Si) based devices can be processed with practically no material defects. However, Si technology has difficulty meeting the demand for some high-power, high-speed, and high-temperature applications due to limitations in its intrinsic properties. Wide bandgap semiconductors have greater prospects compared to Si based devices. The wide band gap material system shows higher breakdown voltage, lower leakage, higher saturation velocity, larger thermal conductivity and better thermal stability suitable for high-power, high-speed, and high-temperature operations of the devices. In recent years, GaN based devices have drawn much research attention due to their superior performances compared to other wide bandgap semiconductor (SiC) devices. Specifically, implementation of AlGaN/GaN high electron mobility transistor (HEMT) based power amplifiers have become very promising for applications in base stations or radar. With the increase in device power, channel temperature rises. This introduces high-temperature effects in the device characteristics. In addition, high-power, high-frequency and high-temperature operation of AlGaN/GaN HEMT is required for telemetry in extreme environment. AlGaN/GaN HEMT also shows great potential as chemically selective field-effect transistor (CHEMFET). Due to simpler imprint technique and amplification advantages CHEMFET based detection and characterization of bio-molecules has become very popular. AlGaN/GaN HEMT has high mobility two-dimensional electron gas (2 DEG) at the hetero-interface closer to the surface and hence it shows high sensitivity to any surface charge conditions. The primary objective of this research is to develop a temperature dependent physics based model of AlGaN/GaN HEMT to predict the performance for high-power and high-speed applications at varying temperatures. The physics based model has also been applied to predict the characteristics of AlGaN/GaN HEMT based CHEMFET for the characterization of bio-molecular solar batteries - Photosystem I reaction centers. Using the CHEMFET model, the number of reaction centers with effective orientation on the gate surface of the HEMT can be estimated.

Download or read book Microstructural Buffer Effects in AlGaN GaN High Electron Mobility Transistors written by Markus Wohlfahrt and published by . This book was released on 2022 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Modeling and Simulation of GaN based High Electron Mobility Transistors written by Elias W. Faraclas and published by . This book was released on 2006 with total page 302 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Power GaN Devices written by Matteo Meneghini and published by Springer. This book was released on 2016-09-08 with total page 383 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the first comprehensive overview of the properties and fabrication methods of GaN-based power transistors, with contributions from the most active research groups in the field. It describes how gallium nitride has emerged as an excellent material for the fabrication of power transistors; thanks to the high energy gap, high breakdown field, and saturation velocity of GaN, these devices can reach breakdown voltages beyond the kV range, and very high switching frequencies, thus being suitable for application in power conversion systems. Based on GaN, switching-mode power converters with efficiency in excess of 99 % have been already demonstrated, thus clearing the way for massive adoption of GaN transistors in the power conversion market. This is expected to have important advantages at both the environmental and economic level, since power conversion losses account for 10 % of global electricity consumption. The first part of the book describes the properties and advantages of gallium nitride compared to conventional semiconductor materials. The second part of the book describes the techniques used for device fabrication, and the methods for GaN-on-Silicon mass production. Specific attention is paid to the three most advanced device structures: lateral transistors, vertical power devices, and nanowire-based HEMTs. Other relevant topics covered by the book are the strategies for normally-off operation, and the problems related to device reliability. The last chapter reviews the switching characteristics of GaN HEMTs based on a systems level approach. This book is a unique reference for people working in the materials, device and power electronics fields; it provides interdisciplinary information on material growth, device fabrication, reliability issues and circuit-level switching investigation.

Download or read book Characterization and Reliability of AlGaN GaN High Electron Mobility Transistors written by Erica Ann Douglas and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: High reverse bias of the gate has been shown to induce the inverse piezoelectric effect, resulting in a sharp increase in gate leakage current due to crack formation. The introduction of elevated temperatures during high reverse gate bias indicated that device failure is due to the breakdown of an unintentional gate oxide. RF stress of AlGaN/GaN HEMTs showed comparable critical voltage breakdown regime as that of similar devices stressed under dc conditions. Though RF device characteristics showed stability up to a drain bias of 20 V, Schottky diode characteristics degraded substantially at all voltages investigated. Results from both dc and RF stress conditions, under several bias regimes, confirm that the primary root for stress induced degradation was due to the Schottky contact.