Download or read book Study of SiO2 to Si Etching Selectivity in High Density Low Pressure Fluorocarbon Plasmas written by Karen Hildegard Ralston Kirmse and published by . This book was released on 1996 with total page 298 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Mechanism for the Selective Etch of Silicon Dioxide in a High density Low pressure Inductively Coupled Fluorocarbon Plasma written by Mark Justin Sowa and published by . This book was released on 1999 with total page 350 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Dry Etching Using NF3 Ar and NF3 He Plasmas written by J. Barkanic and published by . This book was released on 1984 with total page 14 pages. Available in PDF, EPUB and Kindle. Book excerpt: Dry etching of silicon, silicon dioxide and photoresist has been studied using NF3 plasmas diluted with helium and argon in both reactive ion etch and plasma etch modes. NF3 concentrations in Ar and He ranged from 10 to 80% for these experiments. Power densities varied from 0.02 to 0.8W/cm2 and pressure from 15 to 500 ?m depending on the etching mode selected. Etch rates increased with power density in both PE and RIE modes. Si etch rates as high as 14800Å/min. were obtained with an 80% NF3/Ar mixture at 0.8W/cm2 and 500 ?m pressure. Oxide etch rates varied from 30 to 1500Å/min. depending on mode selected. Silicon over oxide selectivity tended to be higher for low power densities for all mixtures studied in either PE or RIE mode. Values obtained were ~ 30 to 40 for low power densities (0.12 W/cm2) and ~ 5 for the highest power density used. Selectivities were higher in PE than RIE mode. X-ray photoelectron spectroscopy analysis of etched Si, SiO2, and photoresist coated samples indicated that the surface layer had become fluorinated. Photoresist etch rates of ~ 500Å/min. were measured for positive photoresist etched in a 40% NF3/He plasma. Loading experiments indicated 10 and 13% decreases in Si and SiO2 etch rates respectively, as the area being etched doubled and, the uniformity of etch rate was approximately 7% over the entire batch.
Download or read book Plasma Etching Processes for Sub quarter Micron Devices written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2000 with total page 396 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Plasma Processing for VLSI written by Norman G. Einspruch and published by Academic Press. This book was released on 2014-12-01 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics: Microstructure Science, Volume 8: Plasma Processing for VLSI (Very Large Scale Integration) discusses the utilization of plasmas for general semiconductor processing. It also includes expositions on advanced deposition of materials for metallization, lithographic methods that use plasmas as exposure sources and for multiple resist patterning, and device structures made possible by anisotropic etching. This volume is divided into four sections. It begins with the history of plasma processing, a discussion of some of the early developments and trends for VLSI. The second section, Deposition, discusses deposition techniques for VLSI such as sputtering metals for metallization and contacts, plasma-enhanced chemical vapor deposition of metals and suicides, and plasma enhanced chemical vapor deposition of dielectrics. The part on Lithography presents the high-resolution trilayer resist system, pulsed x-ray sources for submicrometer x-ray lithography, and high-intensity deep-UV sources. The last part, Etching, provides methods in etching, like ion-beam etching using reactive gases, low-pressure reactive ion etching, and the uses of inert-gas ion milling. The theory and mechanisms of plasma etching are described and a number of new device structures made possible by anisotropic etching are enumerated as well. Scientists, engineers, researchers, device designers, and systems architects will find the book useful.
Download or read book JJAP written by and published by . This book was released on 2007 with total page 800 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Silicon Nitride and Silicon Dioxide Thin Insulating Films written by M. Jamal Deen and published by The Electrochemical Society. This book was released on 1997 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Dry Etching Technology for Semiconductors written by Kazuo Nojiri and published by Springer. This book was released on 2014-10-25 with total page 126 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.
Download or read book High Density Helicon Plasma Science written by Shunjiro Shinohara and published by Springer Nature. This book was released on 2023-02-03 with total page 339 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book highlights a high-density helicon plasma source produced by radio frequency excitation in the presence of magnetic fields, which has attracted considerable attention thanks to its wide applicability in various fields, from basic science to industrial use. Presenting specific applications such as plasma thrusters, nuclear fusion, and plasma processing, it offers a review of modern helicon plasma science for a broad readership. The book covers a wide range of topics, including the fundamental physics of helicon plasma and their cutting-edge applications, based on his abundant and broad experience from low to high temperature plasmas, using various linear magnetized machines and nuclear fusion ones such as tokamaks and reversed field pinches. It first provides a brief overview of the field and a crash course on the fundamentals of plasma, including miscellaneous diagnostics, for advanced undergraduate and early graduate students in plasma science, and presents the basics of helicon plasma for beginners in the field. Further, digesting advanced application topics is also useful for experts to have a quick overview of extensive helicon plasma science research.
Download or read book Plasma Processing of Semiconductors written by P.F. Williams and published by Springer Science & Business Media. This book was released on 2013-11-11 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: Plasma Processing of Semiconductors contains 28 contributions from 18 experts and covers plasma etching, plasma deposition, plasma-surface interactions, numerical modelling, plasma diagnostics, less conventional processing applications of plasmas, and industrial applications. Audience: Coverage ranges from introductory to state of the art, thus the book is suitable for graduate-level students seeking an introduction to the field as well as established workers wishing to broaden or update their knowledge.
Download or read book Silicon Oxide and Silicon Nitride Etch Mechanisms in Nitrogen Trifloride ethylene Plasma written by Puthajat Machima and published by . This book was released on 2005 with total page 288 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Plasma Processing of Semiconductors written by Paul Williams and published by Springer Science & Business Media. This book was released on 1997-05-31 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt: Plasma Processing of Semiconductors contains 28 contributions from 18 experts and covers plasma etching, plasma deposition, plasma-surface interactions, numerical modelling, plasma diagnostics, less conventional processing applications of plasmas, and industrial applications. Audience: Coverage ranges from introductory to state of the art, thus the book is suitable for graduate-level students seeking an introduction to the field as well as established workers wishing to broaden or update their knowledge.
Download or read book Proceedings of the Symposium on Highly Selective Dry Etching and Damage Control written by G. S. Mathad and published by The Electrochemical Society. This book was released on 1993 with total page 452 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advances in Manufacturing Technology written by Somashekhar S. Hiremath and published by Springer. This book was released on 2019-04-17 with total page 640 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume comprises select papers presented at the International Conference on Advances in Manufacturing Technology (ICAMT 2018). It includes contributions from different researchers and practitioners working in the field of advanced manufacturing technology. This book covers diverse topics of contemporary manufacturing technology including material processes, machine tools, cutting tools, robotics and automation, manufacturing systems, optimization technologies, 3D scanning and re-engineering, and 3D printing. Computer applications in design, analysis, and simulation tools for solving manufacturing problems at various levels starting from material designs to complex manufacturing systems are also discussed. This book will be useful for students, researchers, and practitioners working in the field of manufacturing technology.
Download or read book Negative Ion Study Electron Cyclotron Resonance Etching Plasmas written by Pon-ung Ku and published by . This book was released on 1999 with total page 198 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book The Plasma Etching Characterization of SiO2 and Si Using Plasma surface Reaction Parameters with CF4 O2 Ar CHF3 Plasmas written by Ji Ding and published by . This book was released on 1994 with total page 374 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Japanese Journal of Applied Physics written by and published by . This book was released on 2007 with total page 786 pages. Available in PDF, EPUB and Kindle. Book excerpt:
