Download or read book Study of Low k Dielectric Reliability of Cu Dual Damascene Interconnect written by 李守忠 and published by . This book was released on 2011 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Copper Interconnect Technology written by Tapan Gupta and published by Springer Science & Business Media. This book was released on 2010-01-22 with total page 433 pages. Available in PDF, EPUB and Kindle. Book excerpt: Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.
Download or read book Materials Technology and Reliability for Advanced Interconnects and Low k Dielectrics written by and published by . This book was released on 2004 with total page 440 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials Technology and Reliability of Low k Dielectrics and Copper Interconnects written by Ting Y. Tsui and published by . This book was released on 2006 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ISTFA 2012 written by ASM International and published by ASM International. This book was released on 2012 with total page 643 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Copper Interconnects New Contact Metallurgies structures and Low k Interlevel Dielectrics written by G. S. Mathad and published by The Electrochemical Society. This book was released on 2001 with total page 262 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections written by Cher Ming Tan and published by Springer Science & Business Media. This book was released on 2011-03-28 with total page 154 pages. Available in PDF, EPUB and Kindle. Book excerpt: Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections provides a detailed description of the application of finite element methods (FEMs) to the study of ULSI interconnect reliability. Over the past two decades the application of FEMs has become widespread and continues to lead to a much better understanding of reliability physics. To help readers cope with the increasing sophistication of FEMs’ applications to interconnect reliability, Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections will: introduce the principle of FEMs; review numerical modeling of ULSI interconnect reliability; describe the physical mechanism of ULSI interconnect reliability encountered in the electronics industry; and discuss in detail the use of FEMs to understand and improve ULSI interconnect reliability from both the physical and practical perspective, incorporating the Monte Carlo method. A full-scale review of the numerical modeling methodology used in the study of interconnect reliability highlights useful and noteworthy techniques that have been developed recently. Many illustrations are used throughout the book to improve the reader’s understanding of the methodology and its verification. Actual experimental results and micrographs on ULSI interconnects are also included. Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections is a good reference for researchers who are working on interconnect reliability modeling, as well as for those who want to know more about FEMs for reliability applications. It gives readers a thorough understanding of the applications of FEM to reliability modeling and an appreciation of the strengths and weaknesses of various numerical models for interconnect reliability.
Download or read book Anisotropy of low dielectric constant materials and reliability of Cu low k interconnects written by Taiheui Cho and published by . This book was released on 2000 with total page 336 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials Technology and Reliability for Advanced Interconnects and Low k Dielectrics 2003 written by Materials Research Society. Meeting and published by . This book was released on 2003 with total page 544 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book ISTFA 2013 written by A. S. M. International and published by ASM International. This book was released on 2013-01-01 with total page 634 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.
Download or read book 50 Years Of Materials Science In Singapore written by Freddy Yin Chiang Boey and published by World Scientific. This book was released on 2016-06-17 with total page 244 pages. Available in PDF, EPUB and Kindle. Book excerpt: 50 Years of Materials Science in Singapore describes in vivid detail how a newly independent nation like Singapore developed world-class research capabilities in materials science that helped the country make rapid progress in energy, biomedical and electronics sectors. The economy mirrored this rapid trail of progress, utilizing home-grown technology and the contribution of materials science to the various sectors is undeniable in ensuring the economic growth and stability of Singapore.
Download or read book MEMS and Nanotechnology Volume 2 written by Tom Proulx and published by Springer Science & Business Media. This book was released on 2011-03-24 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: This the second volume of six from the Annual Conference of the Society for Experimental Mechanics, 2010, brings together 40 chapters on Microelectromechanical Systems and Nanotechnology. It presents early findings from experimental and computational investigations on MEMS and Nanotechnology including contributions on Nanomechanical Standards, Magneto-mechanical MEMS Sensors, Piezoelectric MEMS for Energy Harvesting, and Linear and Nonlinear Mass Sensing.
Download or read book Materials Technology and Reliability for Advanced Interconnects and Low k Dielectrics written by and published by . This book was released on 2003 with total page 562 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Materials for Information Technology written by Ehrenfried Zschech and published by Springer Science & Business Media. This book was released on 2006-07-02 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
Download or read book Copper Interconnect Technology written by Christoph Steinbruchel and published by SPIE Press. This book was released on 2001 with total page 138 pages. Available in PDF, EPUB and Kindle. Book excerpt: A textbook designed to accompany The Society of Photo-Optical Instrumentation Engineers' short course on improving interconnect performance for increased speed in overall circuit performance authored by Steinbrnchel (materials science and engineering, Renselaer Polytechnic Institute) and Chin (senio
Download or read book IEEE International Reliability Physics Symposium Proceedings written by International Reliability Physics Symposium and published by . This book was released on 2004 with total page 766 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Technology to Improve the Interface Reliability of SiCN and Cu low K Dielectrics for Deep Submicron Dual Damascene Scheme written by 李濬譯 and published by . This book was released on 2006 with total page 56 pages. Available in PDF, EPUB and Kindle. Book excerpt:
