Download or read book Structural Integrity and Reliability in Electronics written by W.J. Plumbridge and published by Springer Science & Business Media. This book was released on 2007-05-08 with total page 341 pages. Available in PDF, EPUB and Kindle. Book excerpt: Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.

Download or read book Product Integrity and Reliability in Design written by John W. Evans and published by Springer Science & Business Media. This book was released on 2011-06-28 with total page 411 pages. Available in PDF, EPUB and Kindle. Book excerpt: The book develops the root-cause approach to reliability - often referred to as "physics of failure" in the reliability engineering field. It approaches the subject from the point of view of a process and integrates the necessary methods to support that process. The book can be used to teach first- or second-year postgraduate students in mechanical, electrical, manufacturing and materials engineering about addressing issues of reliability during product development. It will also serve practicing engineers involved in the design and development of electrical and mechanical components and systems, as a reference.

Download or read book Practical Reliability Of Electronic Equipment And Products written by Eugene R. Hnatek and published by CRC Press. This book was released on 2002-10-25 with total page 465 pages. Available in PDF, EPUB and Kindle. Book excerpt: Examining numerous examples of highly sensitive products, this book reviews basic reliability mathematics, describes robust design practices, and discusses the process of selecting suppliers and components. He focuses on the specific issues of thermal management, electrostatic discharge, electromagnetic compatibility, printed wiring assembly, environmental stress testing, and failure analysis. The book presents methods for meeting the reliability goals established for the manufacture of electronic product hardware and addresses the development of reliable software. The appendix provides example guidelines for the derating of electrical and electromechanical components.

Download or read book Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging written by Ephraim Suhir and published by Springer Science & Business Media. This book was released on 2007-05-26 with total page 1471 pages. Available in PDF, EPUB and Kindle. Book excerpt: This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Download or read book Structural Dynamics of Electronic and Photonic Systems written by Ephraim Suhir and published by John Wiley & Sons. This book was released on 2011-04-04 with total page 610 pages. Available in PDF, EPUB and Kindle. Book excerpt: The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.

Download or read book Computational Methods in Engineering Science written by Zhenhan Yao and published by Springer Science & Business Media. This book was released on 2007-12-31 with total page 354 pages. Available in PDF, EPUB and Kindle. Book excerpt: Here are the printed proceedings of EPMESC X, held on August 21-23, 2006 in Sanya, Hainan Island of China. It includes 14 full papers of plenary and semi-plenary lectures and approximately 166 one-page summaries. The accompanying CD-ROM includes all 180 full papers presented at the conference.

Download or read book Practical Electronic Reliability Engineering written by Jerome Klion and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 616 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book is intended for the engineer or engineering student with little or no prior background in reliability. Its purpose is to provide the background material and guidance necessary to comprehend and carry out all the tasks associated with a reliability program from specification generation to final demonstration of reliability achieved. Most available texts on reliability concentrate on the mathematics and statistics used for reliability analysis, evaluation, and demonstration. They are more often suited more for the professional with a heavier mathematical background that most engineers have, and more often than not, ignore or pay short-shrift to basic engineering design and organizational efforts associated with a reliability program. A reliability engineer must be familiar with both the mathematics and engineering aspects of a reliability program. This text: 1. Describes the mathematics needed for reliability analysis, evaluation, and demonstration commensurate with an engineer's background. 2. Provides background material, guidance, and references necessary to the structure and implementation of a reliability program including: • identification of the reliability standards in most common use • how to generate and respond to a reliability specification • how reliability can be increased • the tasks which make up a reliability program and how to judge the need and scope of each; how each is commonly performed; caution and comments about their application.

Download or read book Handbook of Materials Failure Analysis written by Abdel Salam Hamdy Makhlouf, Ph.D. and published by Butterworth-Heinemann. This book was released on 2019-07-15 with total page 386 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance, and then logically proceeds from a discussion of the failure analysis process, types of failure analysis, specific tools and techniques, and analysis of materials failure from various causes. The book covers the most common types of materials failure analysis and possible solutions. Failure can occur for several reasons: materials defects-related failure; materials design-related failure; or corrosion-related failures. The suitability of the materials to work in a definite environment is an important issue. Provides the most up-to-date and balanced coverage of failure analysis, combining foundational knowledge and current research on the latest developments and innovations in the field Offers an ideal accompaniment for those interested in materials forensic investigation, failure of materials, static failure analysis, dynamic failure analysis, and fatigue life prediction Presents compelling new case studies from key industries to demonstrate concepts

Download or read book Lead Free Electronic Solders written by KV Subramanian and published by Springer Science & Business Media. This book was released on 2007-06-28 with total page 370 pages. Available in PDF, EPUB and Kindle. Book excerpt: Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.

Download or read book Reliability of Electronic Components written by Titu I. Bajenescu and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 547 pages. Available in PDF, EPUB and Kindle. Book excerpt: This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.

Download or read book Reliability Abstracts and Technical Reviews written by and published by . This book was released on 1962 with total page 704 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Statistical Methods for QTL Mapping written by Zehua Chen and published by CRC Press. This book was released on 2013-11-01 with total page 944 pages. Available in PDF, EPUB and Kindle. Book excerpt: While numerous advanced statistical approaches have recently been developed for quantitative trait loci (QTL) mapping, the methods are scattered throughout the literature. Statistical Methods for QTL Mapping brings together many recent statistical techniques that address the data complexity of QTL mapping. After introducing basic genetics topics and statistical principles, the author discusses the principles of quantitative genetics, general statistical issues of QTL mapping, commonly used one-dimensional QTL mapping approaches, and multiple interval mapping methods. He then explains how to use a feature selection approach to tackle a QTL mapping problem with dense markers. The book also provides comprehensive coverage of Bayesian models and MCMC algorithms and describes methods for multi-trait QTL mapping and eQTL mapping, including meta-trait methods and multivariate sequential procedures. This book emphasizes the modern statistical methodology for QTL mapping as well as the statistical issues that arise during this process. It gives the necessary biological background for statisticians without training in genetics and, likewise, covers statistical thinking and principles for geneticists. Written primarily for geneticists and statisticians specializing in QTL mapping, the book can also be used as a supplement in graduate courses or for self-study by PhD students working on QTL mapping projects.

Download or read book Advances in Fracture Research written by K. Salama and published by Elsevier. This book was released on 2013-10-22 with total page 3063 pages. Available in PDF, EPUB and Kindle. Book excerpt: Held every four years, the International Congress on Fracture is the premier international forum for the exchange of ideas between scientists and engineers involved in producing and using materials resistant to fracture and fatigue. This major six-volume work which forms the proceedings of the Seventh International Congress on Fracture therefore provides the most comprehensive account available of the current status of research into fracture and fatigue, and the application of this knowledge to the design, fabrication and operation of materials and structures. As such, it will be an essential reference for materials scientists and mechanical, structural, aeronautical and design engineers with an interest in fracture and its prevention.

Download or read book Thin Films On Silicon Electronic And Photonic Applications written by Vijay Narayanan and published by World Scientific. This book was released on 2016-08-15 with total page 550 pages. Available in PDF, EPUB and Kindle. Book excerpt: This volume provides a broad overview of the fundamental materials science of thin films that use silicon as an active substrate or passive template, with an emphasis on opportunities and challenges for practical applications in electronics and photonics. It covers three materials classes on silicon: Semiconductors such as undoped and doped Si and SiGe, SiC, GaN, and III-V arsenides and phosphides; dielectrics including silicon nitride and high-k, low-k, and electro-optically active oxides; and metals, in particular silicide alloys. The impact of film growth and integration on physical, electrical, and optical properties, and ultimately device performance, is highlighted.

Download or read book Engineering Design under Uncertainty and Health Prognostics written by Chao Hu and published by Springer. This book was released on 2018-06-16 with total page 342 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents state-of-the-art probabilistic methods for the reliability analysis and design of engineering products and processes. It seeks to facilitate practical application of probabilistic analysis and design by providing an authoritative, in-depth, and practical description of what probabilistic analysis and design is and how it can be implemented. The text is packed with many practical engineering examples (e.g., electric power transmission systems, aircraft power generating systems, and mechanical transmission systems) and exercise problems. It is an up-to-date, fully illustrated reference suitable for both undergraduate and graduate engineering students, researchers, and professional engineers who are interested in exploring the fundamentals, implementation, and applications of probabilistic analysis and design methods.

Download or read book Space Programs Summary written by Jet Propulsion Laboratory (U.S.) and published by . This book was released on 1970-04 with total page 262 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Moisture Sensitivity of Plastic Packages of IC Devices written by X.J. Fan and published by Springer Science & Business Media. This book was released on 2010-07-23 with total page 573 pages. Available in PDF, EPUB and Kindle. Book excerpt: Moisture Sensitivity of Plastic Packages of IC Devices provides information on the state-of-the-art techniques and methodologies related to moisture issues in plastic packages. The most updated, in-depth and systematic technical and theoretical approaches are addressed in the book. Numerous industrial applications are provided, along with the results of the most recent research and development efforts, including, but not limited to: thorough exploration of moisture's effects based on lectures and tutorials by the authors, consistent focus on solution-based approaches and methodologies for improved reliability in plastic packaging, emerging theories and cutting-edge industiral applications presented by the leading professionals in the field. Moisture plays a key role in the reliability of plastic packages of IC devices, and moisture-induced failures have become an increasing concern with the development of advanced IC devices. This second volume in the Micro- and Opto-Electronic Materials, Structures, and Systems series is a must-read for researchers and engineers alike.