Download or read book Stress Induced Phenomena in Metallization written by Shefford P. Baker and published by American Institute of Physics. This book was released on 2002-04-09 with total page 268 pages. Available in PDF, EPUB and Kindle. Book excerpt: Tiny metal structures, less than a millionth of a meter across, are critical building blocks in a number of high-tech devices such as computer chips. These "metallizations" are subjected to extreme conditions of temperature, electric current density, and mechanical load, which may cause the device they are in to fail. This book contains research papers on these metallizations and on the reliability problems associated with them. The papers were peer reviewed for these proceedings.
Download or read book Stress Induced Phenomena in Metallization written by Shinichi Ogawa and published by American Institute of Physics. This book was released on 2007-11-13 with total page 220 pages. Available in PDF, EPUB and Kindle. Book excerpt: Kyoto, Japan, 4-7 April 2007
Download or read book Stress Induced Phenomena in Metallization written by Ehrenfried Zschech and published by American Institute of Physics. This book was released on 2006-02-16 with total page 394 pages. Available in PDF, EPUB and Kindle. Book excerpt: These proceedings present current research on issues related to stress-induced phenomena in on-chip metal interconnects and solder joints. The volume will appeal to scientists, engineers, graduate students interested in research and development of microelectronic devices as well as technology integration, and semiconductor industry professionals and equipment suppliers.
Download or read book Stress Induced Phenomena in Metallization written by P. S. Ho and published by A I P Press. This book was released on 2004-12-14 with total page 300 pages. Available in PDF, EPUB and Kindle. Book excerpt: Continuing the spirit of the previous workshops, the proceedings contain new research results and advances in basic understanding of stress-induced phenomena in metallization. The current technology drive to implement low dielectric constant materials into copper metallization has brought new and significant challenges in process integration and reliability. Stresses arising in metallizations and surrounding dielectric structures due to thermal mismatch, electromigration, microstructure changes or process integration can lead to damage and failure of interconnect structures. Understanding stress-related phenomena in new materials and structures becomes critical for reliability improvement and metallization development. This is reflected in the papers included in the proceedings, which report results on electromigration, thermal stresses and void formation in copper-low k interconnect structures. The book also includes new results on fracture of low k dielectric structures, an important research area for reliability and integration of copper metallization.
Download or read book Stress induced Phenomena in Metallization written by Paul Totta and published by American Institute of Physics. This book was released on 1994 with total page 328 pages. Available in PDF, EPUB and Kindle. Book excerpt: The aim of this text of stress-induced phenomena in metallization is to assess the current understanding of the problems, to discuss the implications for the reliability of future devices, and to identify needs and directions for future research.
Download or read book Stress Induced Phenomena in Metallization written by Paul S. Ho and published by American Institute of Physics. This book was released on 2009-07-02 with total page 250 pages. Available in PDF, EPUB and Kindle. Book excerpt: This symposium focuses on new developments in the fields of experimental and theoretical nuclear physics, including nuclear dynamics, nuclear structure including hypernuclei, nuclear matter, nuclear astrophysics, applications. The participants also reported on the innovative instrumentation, including future large-scale facility both in Japan and Italy that will be essential for future studies.
Download or read book Stress and Current induced Phenomena in Thin Constrained Metallizations written by Dirk Dewar Brown and published by . This book was released on 1996 with total page 898 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Proceedings of the Symposia on Interconnects Contact Metallization and Multilevel Metallization and Reliability for Semiconductor Devices Interconnects and Thin Insulator Materials written by T. O. Herndon and published by . This book was released on 1993 with total page 520 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Thirty fourth International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2008-01-01 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Electromigration In Ulsi Interconnections written by Cher Ming Tan and published by World Scientific. This book was released on 2010-06-25 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Electromigration in ULSI Interconnections provides a comprehensive description of the electromigration in integrated circuits. It is intended for both beginner and advanced readers on electromigration in ULSI interconnections. It begins with the basic knowledge required for a detailed study on electromigration, and examines the various interconnected systems and their evolution employed in integrated circuit technology. The subsequent chapters provide a detailed description of the physics of electromigration in both Al- and Cu-based Interconnections, in the form of theoretical, experimental and numerical modeling studies. The differences in the electromigration of Al- and Cu-based interconnections and the corresponding underlying physical mechanisms for these differences are explained.The test structures, testing methodology, failure analysis methodology and statistical analysis of the test data for the experimental studies on electromigration are presented in a concise and rigorous manner. Methods of numerical modeling for the interconnect electromigration and their applications to the understanding of electromigration physics are described in detail with the aspects of material properties, interconnection design, and interconnect process parameters on the electromigration performances of interconnects in ULSI further elaborated upon. Finally, the extension of the studies to narrow interconnections is introduced, and future challenges on the study of electromigration are outlined and discussed.
Download or read book Fundamental World of Quantum Chemistry written by Erkki Brändas and published by Springer Science & Business Media. This book was released on 2003 with total page 744 pages. Available in PDF, EPUB and Kindle. Book excerpt: Per-Olov Löwdin's stature has been a symbol of the world of quantum theory during the past five decades, through his basic contributions to the development of the conceptual framework of Quantum Chemistry and introduction of the fundamental concepts; through a staggering number of regular summer schools, winter institutes, innumerable lectures at Uppsala, Gainesville and elsewhere, and Sanibel Symposia; by founding the International Journal of Quantum Chemistry and Advances in Quantum Chemistry; and through his vision of the possible and his optimism for the future, which has inspired generations of physicists, chemists, mathematicians, and biologists to devote their lives to molecular electronic theory and dynamics, solid state, and quantum biology. Fundamental World of Quantum Chemistry: Volumes I, II and III form a collection of papers dedicated to the memory of Per-Olov Löwdin. These volumes are of interest to a broad audience of quantum, theoretical, physical, biological, and computational chemists; atomic, molecular, and condensed matter physicists; biophysicists; mathematicians working in many-body theory; and historians and philosophers of natural science.
Download or read book New Aspects of Quantum Electrodynamics written by Akitomo Tachibana and published by Springer. This book was released on 2017-02-08 with total page 197 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents new aspects of quantum electrodynamics (QED), a quantum theory of photons with electrons, from basic physics to physical chemistry with mathematical rigor. Topics covered include spin dynamics, chemical reactivity, the dual Cauchy problem, and more. Readers interested in modern applications of quantum field theory in nano-, bio-, and open systems will enjoy learning how the up-to-date quantum theory of radiation with matter works in the world of QED. In particular, chemical ideas restricted now to nonrelativistic quantum theory are shown to be unified and extended to relativistic quantum field theory that is basic to particle physics and cosmology: realization of the new-generation quantum theory. Readers are assumed to have a background equivalent to an undergraduate student's elementary knowledge in electromagnetism, quantum mechanics, chemistry, and mathematics.
Download or read book More than Moore Devices and Integration for Semiconductors written by Francesca Iacopi and published by Springer Nature. This book was released on 2023-02-17 with total page 271 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems with a broad range of functionalities that can be added to 3D microsystems, including flexible electronics, metasurfaces and power sources. The book also includes examples of applications for brain-computer interfaces and event-driven imaging systems. Provides a comprehensive, state-of-the-art reference for miniaturized More-than-Moore systems; Covers functionalities to add to 3D microsystems, including flexible electronics, metasurfaces and power sources; Includes current applications, such as brain-computer interfaces, event - driven imaging and edge computing.
Download or read book The Foundations of Vacuum Coating Technology written by Donald M. Mattox and published by Elsevier. This book was released on 2003-04-16 with total page 161 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Foundations of Vacuum Coating Technology is a concise review of the developments that have led to the wide variety of applications of this technology. This book is a must have for materials scientists and engineers working with vacuum coating in the invention of new technologies or applications in all industries. With over 370 references, this is an excellent starting point for those who don't want to reinvent the wheel. In particular, the book is a valuable reference for those interested in researching proposed or existing patents. This unique book provides a starting point for more in-depth surveys of past and recent work in all aspects of vacuum coating. The author uses his extensive knowledge of the subject to draw comparisons and place the information into the proper context. This is particularly important for the patent literature where the terminology does not always match industry jargon. A section of acronyms for vacuum coating and glossary of terms at the end of the book are critical additions to the information every reader needs.
Download or read book Handbook of Physical Vapor Deposition PVD Processing written by D. M. Mattox and published by Cambridge University Press. This book was released on 2014-09-19 with total page 947 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book covers all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the book is on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications. The book covers subjects seldom treated in the literature: substrate characterization, adhesion, cleaning and the processing. The book also covers the widely discussed subjects of vacuum technology and the fundamentals of individual deposition processes. However, the author uniquely relates these topics to the practical issues that arise in PVD processing, such as contamination control and film growth effects, which are also rarely discussed in the literature. In bringing these subjects together in one book, the reader can understand the interrelationship between various aspects of the film deposition processing and the resulting film properties. The author draws upon his long experience with developing PVD processes and troubleshooting the processes in the manufacturing environment, to provide useful hints for not only avoiding problems, but also for solving problems when they arise. He uses actual experiences, called ""war stories"", to emphasize certain points. Special formatting of the text allows a reader who is already knowledgeable in the subject to scan through a section and find discussions that are of particular interest. The author has tried to make the subject index as useful as possible so that the reader can rapidly go to sections of particular interest. Extensive references allow the reader to pursue subjects in greater detail if desired. The book is intended to be both an introduction for those who are new to the field and a valuable resource to those already in the field. The discussion of transferring technology between R&D and manufacturing provided in Appendix 1, will be of special interest to the manager or engineer responsible for moving a PVD product and process from R&D into production. Appendix 2 has an extensive listing of periodical publications and professional societies that relate to PVD processing. The extensive Glossary of Terms and Acronyms provided in Appendix 3 will be of particular use to students and to those not fully conversant with the terminology of PVD processing or with the English language.
Download or read book Handbook of Thin Film Deposition written by Dominic Schepis and published by Elsevier. This book was released on 2024-10-08 with total page 428 pages. Available in PDF, EPUB and Kindle. Book excerpt: Handbook of Thin Film Deposition, Fifth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry. When pursuing patents, there is a phase called 'reduction to practice' where the idea for a technology transitions from a concept to actual use. The section 'Thin Film Reduction to Practice' includes chapters that review the most relevant methods to fabricate thin films towards practical applications. Then, the latest applications of thin film deposition technologies are discussed. Handbook of Thin Film Deposition, 5th Edition is suitable for materials scientists and engineers in academia and working in semiconductor R&D. - Offers a practical survey of thin film technologies including design, fabrication, and reliability - Covers core processes and applications in the semiconductor industry and discusses latest advances in new thin film development - Features new chapters that review methods on front-end and back-end thin films
Download or read book Ceramic Integration and Joining Technologies written by Mrityunjay Singh and published by John Wiley & Sons. This book was released on 2011-10-11 with total page 830 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book joins and integrates ceramics and ceramic-based materials in various sectors of technology. A major imperative is to extract scientific information on joining and integration response of real, as well as model, material systems currently in a developmental stage. This book envisions integration in its broadest sense as a fundamental enabling technology at multiple length scales that span the macro, millimeter, micrometer and nanometer ranges. Consequently, the book addresses integration issues in such diverse areas as space power and propulsion, thermoelectric power generation, solar energy, micro-electro-mechanical systems (MEMS), solid oxide fuel cells (SOFC), multi-chip modules, prosthetic devices, and implanted biosensors and stimulators. The engineering challenge of designing and manufacturing complex structural, functional, and smart components and devices for the above applications from smaller, geometrically simpler units requires innovative development of new integration technology and skillful adaptation of existing technology.
