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Book Specification for Electroless Nickel Immersion Gold ENIG Plating for Printed Circuit Boards English Language 4552 WAM1 2

Download or read book Specification for Electroless Nickel Immersion Gold ENIG Plating for Printed Circuit Boards English Language 4552 WAM1 2 written by IPC (Organization) and published by . This book was released on 2012-12 with total page 26 pages. Available in PDF, EPUB and Kindle. Book excerpt: "This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses based on performance criteria. It is intended for use by supplier, printed circuit manufacturer, electronics manufacturing services (EMS) and original equipment manufacturer (OEM)."--P. 1.

Book Uhlig s Corrosion Handbook

Download or read book Uhlig s Corrosion Handbook written by R. Winston Revie and published by John Wiley & Sons. This book was released on 2011-04-12 with total page 1299 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book serves as a reference for engineers, scientists, and students concerned with the use of materials in applications where reliability and resistance to corrosion are important. It updates the coverage of its predecessor, including coverage of: corrosion rates of steel in major river systems and atmospheric corrosion rates, the corrosion behavior of materials such as weathering steels and newer stainless alloys, and the corrosion behavior and engineering approaches to corrosion control for nonmetallic materials. New chapters include: high-temperature oxidation of metals and alloys, nanomaterials, and dental materials, anodic protection. Also featured are chapters dealing with standards for corrosion testing, microbiological corrosion, and electrochemical noise.

Book Lead Free Electronics

Download or read book Lead Free Electronics written by Edwin Bradley and published by John Wiley & Sons. This book was released on 2007-10-26 with total page 472 pages. Available in PDF, EPUB and Kindle. Book excerpt: Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.

Book Lead Free Soldering

Download or read book Lead Free Soldering written by Jasbir Bath and published by Springer Science & Business Media. This book was released on 2007-06-26 with total page 307 pages. Available in PDF, EPUB and Kindle. Book excerpt: The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.

Book Lead free Soldering Process Development and Reliability

Download or read book Lead free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-06-23 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Book Printed Circuit Boards

Download or read book Printed Circuit Boards written by R. S. Khandpur and published by McGraw Hill Professional. This book was released on 2005-09-07 with total page 717 pages. Available in PDF, EPUB and Kindle. Book excerpt: The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing.

Book X Ray Fluorescence Spectroscopy for Laboratory Applications

Download or read book X Ray Fluorescence Spectroscopy for Laboratory Applications written by Michael Haschke and published by John Wiley & Sons. This book was released on 2021-01-12 with total page 496 pages. Available in PDF, EPUB and Kindle. Book excerpt: Provides comprehensive coverage on using X-ray fluorescence for laboratory applications This book focuses on the practical aspects of X-ray fluorescence (XRF) spectroscopy and discusses the requirements for a successful sample analysis, such as sample preparation, measurement techniques and calibration, as well as the quality of the analysis results. X-Ray Fluorescence Spectroscopy for Laboratory Applications begins with a short overview of the physical fundamentals of the generation of X-rays and their interaction with the sample material, followed by a presentation of the different methods of sample preparation in dependence on the quality of the source material and the objective of the measurement. After a short description of the different available equipment types and their respective performance, the book provides in-depth information on the choice of the optimal measurement conditions and the processing of the measurement results. It covers instrument types for XRF; acquisition and evaluation of X-Ray spectra; analytical errors; analysis of homogeneous materials, powders, and liquids; special applications of XRF; process control and automation. An important resource for the analytical chemist, providing concrete guidelines and support for everyday analyses Focuses on daily laboratory work with commercially available devices Offers a unique compilation of knowledge and best practices from equipment manufacturers and users Covers the entire work process: sample preparation, the actual measurement, data processing, assessment of uncertainty, and accuracy of the obtained results X-Ray Fluorescence Spectroscopy for Laboratory Applications appeals to analytical chemists, analytical laboratories, materials scientists, environmental chemists, chemical engineers, biotechnologists, and pharma engineers.

Book Brazing and Soldering

Download or read book Brazing and Soldering written by John J. Stephens and published by ASM International. This book was released on 2006-01-01 with total page 430 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Die Attach Materials for High Temperature Applications in Microelectronics Packaging

Download or read book Die Attach Materials for High Temperature Applications in Microelectronics Packaging written by Kim S. Siow and published by Springer. This book was released on 2019-01-29 with total page 279 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Book Electrical Contacts

Download or read book Electrical Contacts written by Paul G. Slade and published by CRC Press. This book was released on 2017-12-19 with total page 1311 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the theory, application, and testing of contact materials, Electrical Contacts: Principles and Applications, Second Edition introduces a thorough discussion on making electric contact and contact interface conduction; presents a general outline of, and measurement techniques for, important corrosion mechanisms; considers the results of contact wear when plug-in connections are made and broken; investigates the effect of thin noble metal plating on electronic connections; and relates crucial considerations for making high- and low-power contact joints. It examines contact use in switching devices, including the interruption of AC and DC circuits with currents in the range 10mA to 100kA and circuits up to 1000V, and describes arc formation between open contacts and between opening contacts. Arcing effects on contacts such as erosion, welding, and contamination are also addressed. Containing nearly 3,000 references, tables, equations, figures, drawings, and photographs, the book provides practical examples encompassing everything from electronic circuits to high power circuits, or microamperes to mega amperes. The new edition: Reflects the latest advances in electrical contact science and technology Examines current research on contact corrosion, materials, and switching Includes updates and revisions in each chapter, as well as up-to-date references and new figures and examples throughout Delivers three new chapters on the effects of dust contamination, electronic sensing for switching systems, and contact phenomena for micro-electronic systems (MEMS) applications With contributions from recognized experts in the field, Electrical Contacts: Principles and Applications, Second Edition assists practicing scientists and engineers in the prevention of costly system failures, as well as offers a comprehensive introduction to the subject for technology graduate students, by expanding their knowledge of electrical contact phenomena.

Book Lead free Soldering Process Development and Reliability

Download or read book Lead free Soldering Process Development and Reliability written by Jasbir Bath and published by John Wiley & Sons. This book was released on 2020-06-12 with total page 512 pages. Available in PDF, EPUB and Kindle. Book excerpt: Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.