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EBookClubs

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Book ISTFA 2011

Download or read book ISTFA 2011 written by and published by ASM International. This book was released on 2011 with total page 479 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Component Reliability for Electronic Systems

Download or read book Component Reliability for Electronic Systems written by Titu I. Băjenescu and published by Artech House. This book was released on 2010 with total page 706 pages. Available in PDF, EPUB and Kindle. Book excerpt: The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.

Book ISTFA 2019  Proceedings of the 45th International Symposium for Testing and Failure Analysis

Download or read book ISTFA 2019 Proceedings of the 45th International Symposium for Testing and Failure Analysis written by ASM International and published by ASM International. This book was released on 2019-12-01 with total page 540 pages. Available in PDF, EPUB and Kindle. Book excerpt: The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

Book Hot Carrier Degradation in Semiconductor Devices

Download or read book Hot Carrier Degradation in Semiconductor Devices written by Tibor Grasser and published by Springer. This book was released on 2014-10-29 with total page 518 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book provides readers with a variety of tools to address the challenges posed by hot carrier degradation, one of today’s most complicated reliability issues in semiconductor devices. Coverage includes an explanation of carrier transport within devices and book-keeping of how they acquire energy (“become hot”), interaction of an ensemble of colder and hotter carriers with defect precursors, which eventually leads to the creation of a defect, and a description of how these defects interact with the device, degrading its performance.

Book Index of Conference Proceedings

Download or read book Index of Conference Proceedings written by British Library. Document Supply Centre and published by . This book was released on 2002 with total page 696 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Signal Integrity Effects in Custom IC and ASIC Designs

Download or read book Signal Integrity Effects in Custom IC and ASIC Designs written by Raminderpal Singh and published by John Wiley & Sons. This book was released on 2001-12-12 with total page 484 pages. Available in PDF, EPUB and Kindle. Book excerpt: "...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." —Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc. Covers signal integrity effects in high performance Radio Frequency (RF) IC Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future A Wiley-IEEE Press publication

Book Electrical   Electronics Abstracts

Download or read book Electrical Electronics Abstracts written by and published by . This book was released on 1997 with total page 2240 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book IEEE International Reliability Physics Symposium Proceedings

Download or read book IEEE International Reliability Physics Symposium Proceedings written by International Reliability Physics Symposium and published by . This book was released on 2004 with total page 766 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Energy Research Abstracts

Download or read book Energy Research Abstracts written by and published by . This book was released on 1978 with total page 684 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Publications in Engineering

Download or read book Publications in Engineering written by and published by . This book was released on 2002 with total page 636 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book The British National Bibliography

Download or read book The British National Bibliography written by Arthur James Wells and published by . This book was released on 2007 with total page 870 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book Failure Analysis of Integrated Circuits

Download or read book Failure Analysis of Integrated Circuits written by Lawrence C. Wagner and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 256 pages. Available in PDF, EPUB and Kindle. Book excerpt: This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.

Book Proceedings of the 13th European Symposium on the Reliability of Electron Devices  Failure Physics and Analysis

Download or read book Proceedings of the 13th European Symposium on the Reliability of Electron Devices Failure Physics and Analysis written by F. Fantini and published by Pergamon Press. This book was released on 2002 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt: This Proceedings contains the papers presented at the 13th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis (ESREF 2002), held in Bellaria, Italy, 7-11 Oct 2002. The Proceedings are being published concurrently as a special issue of Microelectronics Reliability. Since its foundation in 1990, the annual ESREF symposium has been the premier European forum for the discussion of research in all aspects of specification, technology and manufacturing, test, control and analysis for microelectronic devices and circuits. Researchers at top institutions, in Europe and elsewhere, present high-quality experimental results at ESREF. The ESREF Proceedings have been published by Elsevier Science since 1996. This year's Proceedings follow the format and style of previous books in the series, and as always the list of topics addressed changes to keep up with developments in the field. Two new topics this year are optical devices and microelectromechanical systems (MEMS); both have attracted a high number of scientific contributions. The Proceedings contains nine invited papers and approximately 100 submitted contributions on the following topics: • Quality and reliability techniques for components and system • Failure mechanisms in silicon devices • Failure mechanisms in compound semiconductors devices • Non-volatile and programmable device reliability • Power devices reliability • Photonics reliability • Packaging and assembly reliability • Advanced failure analysis: defect detection and analysis • Electron and optical beam testing (EOBT) • Electrostatic discharge (ESD) • MEMS/MOEMS (Special Session) All papers are reviewed prior to publication. In this, the 40th year of publication of the journal Microelectronics Reliability, two of the invited papers are contributed by senior members of the Journal's Editorial Board, and are dedicated to that anniversary. This Proceedings will be indispensable for scientists and engineers working on the quality and reliability of microelectronic devices and circuits, and for anyone with a general interest in microelectronics research. For more information on Microelectronics Reliability, visit http://www.elsevier.com/locate/microrelhttp://www.elsevier.com/locate/microrel

Book ISTFA 2010

Download or read book ISTFA 2010 written by and published by ASM International. This book was released on 2010-01-01 with total page 487 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Book The Electrical Engineering Handbook

Download or read book The Electrical Engineering Handbook written by Wai Kai Chen and published by Elsevier. This book was released on 2004-11-16 with total page 1227 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Electrical Engineer's Handbook is an invaluable reference source for all practicing electrical engineers and students. Encompassing 79 chapters, this book is intended to enlighten and refresh knowledge of the practicing engineer or to help educate engineering students. This text will most likely be the engineer's first choice in looking for a solution; extensive, complete references to other sources are provided throughout. No other book has the breadth and depth of coverage available here. This is a must-have for all practitioners and students! The Electrical Engineer's Handbook provides the most up-to-date information in: Circuits and Networks, Electric Power Systems, Electronics, Computer-Aided Design and Optimization, VLSI Systems, Signal Processing, Digital Systems and Computer Engineering, Digital Communication and Communication Networks, Electromagnetics and Control and Systems.About the Editor-in-Chief...Wai-Kai Chen is Professor and Head Emeritus of the Department of Electrical Engineering and Computer Science at the University of Illinois at Chicago. He has extensive experience in education and industry and is very active professionally in the fields of circuits and systems. He was Editor-in-Chief of the IEEE Transactions on Circuits and Systems, Series I and II, President of the IEEE Circuits and Systems Society and is the Founding Editor and Editor-in-Chief of the Journal of Circuits, Systems and Computers. He is the recipient of the Golden Jubilee Medal, the Education Award, and the Meritorious Service Award from the IEEE Circuits and Systems Society, and the Third Millennium Medal from the IEEE. Professor Chen is a fellow of the IEEE and the American Association for the Advancement of Science.* 77 chapters encompass the entire field of electrical engineering.* THOUSANDS of valuable figures, tables, formulas, and definitions.* Extensive bibliographic references.

Book International Congress Calendar

Download or read book International Congress Calendar written by and published by . This book was released on 2000 with total page 804 pages. Available in PDF, EPUB and Kindle. Book excerpt: