Download or read book Simulation of Polyatomic Discharges for Thin Film Deposition Processes in Low Pressure Plasma Reactors written by Kallol Bera and published by . This book was released on 1999 with total page 378 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Film Deposition by Plasma Techniques written by Mitsuharu Konuma and published by Springer Science & Business Media. This book was released on 2012-12-06 with total page 234 pages. Available in PDF, EPUB and Kindle. Book excerpt: Properties of thin films depend strongly upon the deposition technique and conditions chosen. In order to achieve the desired film, optimum deposition conditions have to be found by carrying out experiments in a trial-and error fashion with varying parameters. The data obtained on one growth apparatus are often not transferable to another. This is especially true for film deposition processes using a cold plasma because of our poor under standing of the mechanisms. Relatively precise studies have been carried out on the role that physical effects play in film formation such as sputter deposition. However, there are many open questions regarding processes that involve chemical reactions, for example, reactive sputter deposition or plasma enhanced chemical vapor deposition. Much further research is re quired in order to understand the fundamental deposition processes. A sys tematic collection of basic data, some of which may be readily available in other branches of science, for example, reaction cross sections for gases with energetic electrons, is also required. The need for pfasma deposition techniques is felt strongly in industrial applications because these techniques are superior to traditional thin-film deposition techniques in many ways. In fact, plasma deposition techniques have developed rapidly in the semiconductor and electronics industries. Fields of possible application are still expanding. A reliable plasma reactor with an adequate in situ system for monitoring the deposition conditions and film properties must be developed to improve reproducibility and pro ductivity at the industrial level.

Download or read book Low Pressure Plasmas and Microstructuring Technology written by Gerhard Franz and published by Springer Science & Business Media. This book was released on 2009-04-09 with total page 743 pages. Available in PDF, EPUB and Kindle. Book excerpt: Over the last forty years, plasma supported processes have attracted ever - creasing interest, and now, all modern semiconductor devices undergo at least one plasma-involved processing step, starting from surface cleaning via coating to etching. In total, the range of the treated substrates covers some orders of magnitude: Trenches and linewidths of commercially available devices have - ready passed the boundary of 100 nm, decorative surface treatment will happen 2 in the mm range, and the upper limit is reached with surface protecting layers of windows which are coated with ?/4 layers against IR radiation. The rapid development of the semiconductor industry is inconceivable wi- outthegiantprogressintheplasmatechnology.Moore’slawisnotcarvedinto 1 stone, and not only the ITRS map is subject to change every ?ve years but also new branches develop and others mingle together. Moreover, the quality of conventional materials can be improved by plasma treatment:Cottonbecomesmorecrease-resistant,leathermoredurable,andthe shrinking of wool ?bers during the washing process can be signi?cantly reduced. To cut a long story short: More than 150 years after the discovery of the sputtering e?ect by Grove, plasma-based processes are about to spread out into new ?elds of research and application [1]—no wonder that the market for etching machines kept growing by an annual rate of 17 % up to the burst of the internet bubble, and it took only some years of recovery to continue the voyage [2].

Download or read book Plasma Sources for Thin Film Deposition and Etching written by Maurice H. Francombe and published by Elsevier. This book was released on 1994-08-18 with total page 352 pages. Available in PDF, EPUB and Kindle. Book excerpt: Steinbrüchel, Christoph; The formation of particles in thin-film processing plasmas.

Download or read book Investigation of Atmospheric pressure Plasma Discharges for Thin Film Deposition written by Frédéric Bless and published by . This book was released on 2015 with total page pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Principles of Plasma Discharges and Materials Processing written by Michael A. Lieberman and published by John Wiley & Sons. This book was released on 2024-08-28 with total page 837 pages. Available in PDF, EPUB and Kindle. Book excerpt: A new edition of this industry classic on the principles of plasma processing Plasma-based technology and materials processes have been central to the revolution of the last half-century in micro- and nano-electronics. From anisotropic plasma etching on microprocessors, memory, and analog chips, to plasma deposition for creating solar panels and flat-panel displays, plasma-based materials processes have reached huge areas of technology. As key technologies scale down in size from the nano- to the atomic level, further developments in plasma materials processing will only become more essential. Principles of Plasma Discharges and Materials Processing is the foundational introduction to the subject. It offers detailed information and procedures for designing plasma-based equipment and analyzing plasma-based processes, with an emphasis on the abiding fundamentals. Now fully updated to reflect the latest research and data, it promises to continue as an indispensable resource for graduate students and industry professionals in a myriad of technological fields. Readers of the third edition of Principles of Plasma Discharges and Materials Processing will also find: Extensive figures and tables to facilitate understanding A new chapter covering the recent development of processes involving high-pressure capacitive discharges New subsections on discharge and processing chemistry, physics, and diagnostics Principles of Plasma Discharges and Materials Processing is ideal for professionals and process engineers in the field of plasma-assisted materials processing with experience in the field of science or engineering. It is the premiere world-wide basic text for graduate courses in the field.

Download or read book Low Temperature Pulsed Plasma Deposition Part 2 The Production of Novel Amorphous Compounds of Germanium in Thin Film written by G. A. Scarsbrook and published by . This book was released on 1988 with total page 24 pages. Available in PDF, EPUB and Kindle. Book excerpt: Recently, a new process for the room temperature, low pressure, deposition of thin films has been published, which uses pulsed radio-frequency discharges of very high power levels. Here we describe the use of the process for the deposition of amorphous compounds containing germanium, sulphur, and phosphorus. The deposited compounds, many for which cannot be readily deposited using any other method, are shown to have useful properties as infra-red coatings and as compound semiconductors with band gaps extending into the visible spectrum. The stability of the deposited compounds on exposure to high temperatures and on exposure to moisture is found to correlate with deposition conditions and compound stoichiometry, and the use of these materials under adverse environmental conditions is discussed. Keywords: Pulsed plasma, Thin film deposition, Complete gas dissociation, Amorphous compounds, Germanium sulphide-phosphide. (mjm).

Download or read book Simulation of Deposition Processes with PECVD Apparatus written by Juergen Geiser and published by Nova Science Publishers. This book was released on 2012 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book discusses the study of simulating the growth of a thin film by chemical vapour deposition (CVD) processes. In recent years, due to the research in producing high-temperature films by depositing low pressures, the processes have increased and understanding the control mechanism of such processes has become very important. An underlying hierarchy of models for low-temperature and low-pressure plasma is presented in order to discuss the processes that can be used to implant or deposit thin layers of important materials. Due to the multi-scale problem of the flow and reaction processes, the authors propose multi-scale problems which are divided into near-field and far-field models.

Download or read book Dissertation Abstracts International written by and published by . This book was released on 2000 with total page 852 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Meeting Abstracts written by Electrochemical Society. Meeting and published by . This book was released on 1998 with total page 1536 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Computer Simulation of Low Pressure Plasma Discharges written by Justin David Bukowski and published by . This book was released on 1996 with total page 402 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Modelling and Diagnostics of Low Pressure Plasma Discharges written by and published by . This book was released on 2002 with total page 0 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Particle Simulation of CH4 H2 RF Glow Discharges for DLC Film Deposition written by and published by . This book was released on 2000 with total page 9 pages. Available in PDF, EPUB and Kindle. Book excerpt: Particle-in-cell/Monte Carlo (PIC/MC) simulations of capacitively coupled radio-frequency (RF) glow discharges were carried out for low pressure CH4/H2 plasmas. The present computational scheme considers the motions and collisions of both neutral and charged particles. The CH4/H2 plasma is modeled by combining a one dimensional PIC/MC method with a polyatomic particle collision scheme. The model considers the motions of neutrals CH4, CH3, C2H5, H2, and H, positive ions (CH4+) and electrons. Space and time dependent results show that ionization rate is high at the sheath region. Deposition rate of carbon film is calculated by sampling impinging particles at the powered electrode. When CH4 flow rate is decreased and the H2 flow rate is increased, the gas density in the chamber and deposition rate decreased significantly for carbon containing radicals. On the other hand, when CH4 flow rate is fixed and H2 flow rate is increased, deposition rate again decreased, but the gas density in the chamber did not change much.

Download or read book Plasma Jet Properties in a New Spraying Process at Low Pressure for Large Area Thin Film Deposition written by and published by . This book was released on 2001 with total page 6 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Multiscale Computational Fluid Dynamics Modeling of Thermal and Plasma Atomic Layer Deposition written by Yichi Zhang and published by . This book was released on 2021 with total page 151 pages. Available in PDF, EPUB and Kindle. Book excerpt: Facilitated by the increasing importance and demand of semiconductors for the smartphoneand even the automobile industry, thermal atomic layer deposition (ALD) has gained tremendous industrial interest as it offers a way to efficiently deposit thin-films with ultra-high conformity. It is chosen largely due to its superior ability to deliver ultra-conformal dielectric thin-films with high aspect-ratio surface structures, which are encountered more and more often in the novel design of metal-oxide-semiconductor field-effect transistors (MOSFETs) in the NAND (Not-And)-type flash memory devices. Based on the traditional thermal ALD method, the plasma enhanced atomic layer deposition (PEALD) allows for lower operating temperature and speeds up the deposition process with the involvement of plasma species. Despite the popularity of these two methods, the development of their operation policies remains a complicated and expensive task, which motivates the construction of an accurate and comprehensive simulation model. A series of studies have been carried out to elucidate the mechanisms and the conceptof the PEALD process. In particular, process characterization focuses on the development of a first-principles-based three-dimensional, multiscale computational fluid dynamics (CFD) model, together with reactor geometry optimizations, of SiO2 thinfilm thermal atomic layer deposition (ALD) using bis(tertiary-butylamino)silane (BTBAS) and ozone as precursors. Also, a comprehensive multiscale computational fluid dynamics (CFD) model incorporating the plasma generation chamber is used in the deposition of HfO2 thin-films utilizing tetrakis(dimethylamido) hafnium (TDMAHf) and O2 plasma as precursors. Despite the great deal of research effort, ALD and PEALD processes have not been fullycharacterized from the view point of process control. This study aims to use previously developed multiscale CFD simulation model to design and evaluate an optimized control scheme to deal with industrially-relevant disturbances. Specifically, an integrated control scheme using a proportional-integral (PI) controller and a run-to-run (R2R) controller is proposed and evaluated to ensure the deposition of high-quality conformal thin-films. The ALD and PEALD processes under typical disturbances are simulated using the multiscale CFD model, and the integrated controllers are applied in the process domain. Using the controller parameters determined from the open-loop results, the developed integrated PI-R2R controller successfully mitigates the disturbances in the reactor with the combined effort of both controllers.

Download or read book American Doctoral Dissertations written by and published by . This book was released on 2001 with total page 776 pages. Available in PDF, EPUB and Kindle. Book excerpt:

Download or read book Simulations of Atmospheric Pressure Plasma Discharges written by Douglas Paul Breden and published by . This book was released on 2013 with total page 382 pages. Available in PDF, EPUB and Kindle. Book excerpt: This document presents a study of the numerical simulation of non-equilibrium plasma discharges in air mixtures in the atmospheric pressure regime. Such plasma is formed by applying a very high electric field over a very short time duration (nano-microsecond) which preferentially heats the electrons to very high temperatures (10 electron Volts or more) while preventing thermalization of the gas. Preferentially heating the electrons to very high temperatures allows the discharge to efficiently and rapidly ionize and dissociate the gas mixture without losing too much energy to thermalization or vibrational excitation. Consequently, two useful characteristics of these discharges are low gas temperatures and rapid electron chemistry. This study focuses on two applications of interest: ignition of fuel-air mixtures and plasma enhanced medicine. For ignition, there are two situations that arise where it is difficult for traditional spark ignition systems to operate. The first is at the supersonic flow regime where the residence time of the flow in the engine is low. The second is high pressure ignition of lean fuel-air mixtures. For plasma medicine and surface treatment, non-equilibrium plasma is an effective means of delivering reactive radical species to the surface while limiting damage due to thermal heating. The problems of interest are characterized by the formation of weakly ionized plasma in the presence of flow fields such as supersonic boundary layers or low speed jets. To simulate the coupled plasma-fluid flow physics of these discharges, two numerical tools are utilized. The first is a two-temperature, multiple species, self-consistent plasma solver with finite rate chemistry which is used to simulate the plasma as it forms in a neutral background gas. The second tool is a multiple-species compressible flow solver which calculates the flow field properties of the background gas mixture.