Download or read book Silicides for VLSI Applications written by Shyam P. Murarka and published by Academic Press. This book was released on 2012-12-02 with total page 213 pages. Available in PDF, EPUB and Kindle. Book excerpt: Most of the subject matter of this book has previously been available only in the form of research papers and review articles. I have not attempted to refer to all the published papers. The reader may find it advantageous to refer to the references listed.
Download or read book Silicides for VLSI Applications written by S. P. Murarka and published by . This book was released on 1983 with total page 200 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Handbook of Semiconductor Manufacturing Technology written by Yoshio Nishi and published by CRC Press. This book was released on 2000-08-09 with total page 1186 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."
Download or read book Chemical Vapor Deposition of Tungsten and Tungsten Silicides for VLSI ULSI Applications written by John E.J. Schmitz and published by William Andrew. This book was released on 1992-12-31 with total page 264 pages. Available in PDF, EPUB and Kindle. Book excerpt: Publisher description.
Download or read book Silicides Fundamentals Applications written by Francois D'heurle and published by World Scientific. This book was released on 2000-12-18 with total page 390 pages. Available in PDF, EPUB and Kindle. Book excerpt: Silicides were introduced into the technology of electronic devices some thirty years ago; since then, they have been continuously used to form both ohmic and rectifying contacts to silicon. Silicides are also important for other applications (thermoelectric devices and structural applications, such as jet engines), but it is not easy to find an updated reference containing both their basic properties, either chemical or physical, and the latest applications.The 16th Course of the International School of Solid State Physics, held in Erice (Italy) in the late spring of 1999, was intended to break artificial barriers between disciplines, and to gather people concerned with the properties and applications of silicides, regardless of the formal fields to which they belong, or of the practical goals they pursue. This book is therefore concerned with theory as well as applications, metallurgy as well as physics, and materials science as well as microelectronics.
Download or read book Electronics fundamentals And Applications written by D. Chattopadhyay and published by New Age International. This book was released on 2006 with total page 652 pages. Available in PDF, EPUB and Kindle. Book excerpt: The Book Is Meant For The Students Pursuing A Beginners' Course In Electronics. Current Syllabi Of Basic Electronics Included In Physics (Honours) Curriculum Of Different Universities And Those Offered In Various Engineering And Technical Institutions Have Been Consulted In Preparing The Material Contained Herein.In 22 Chapters, The Book Deals With Formation Of Energy Bands In Solids; Electron Emission From Solid Surfaces; Vacuum Tubes; Properties Of Semiconductors; Pn Junction Diodes; Rectifiers; Voltage Multipliers; Clipping And Clamping Circuits; Bipolar Junction Transistors; Basic Voltage And Poweramplifiers; Feedback In Amplifiers; Regulated Power Supply; Sinusoidal Oscillators; Multivibrators; Modulation And Demodulation; Jfet And Mosfet; Ics; Op Amps; Special Semiconductor Devices, Such As Phototransistor, Scr, Triac, Diac, Ujt, Impatt Diode, Gunn Diode, Pin Diode, Igbt; Digital Circuits; Cathode Ray Oscilloscope; Radio Communication; Television; Radar And Laser.Fundamental Principles And Applications Are Discussed Herein With Explanatory Diagrams In A Clear Concise Way.Physical Aspects Are Emphasized; Mathematical Details Are Given, When Necessary. Many Of The Problems And Review Questions Included In The Book Are Taken From Recent Examination Papers. Some Objective-Type Questions Typically Set In Different Competitive Examinations Are Also Given At The End Of Each Chapter.Salient Features: * Small Geometry Effects And Effects Of Interconnects Included In Chapter 18. * A Quick Discussion On Fibre Optic Communication System In Chapter 22. * Revised And Updated To Cope With The Current Syllabii Of Some More Universities And Technical Institutions. * Chapters 6, 8, 16, 18, And 22 Have Been Changed With The Addition Of New Material. * Some More University Questions And Problems Have Been Included.
Download or read book Semiconducting Silicides written by Victor E. Borisenko and published by Springer Science & Business Media. This book was released on 2013-03-07 with total page 362 pages. Available in PDF, EPUB and Kindle. Book excerpt: A comprehensive presentation and analysis of properties and methods of formation of semiconducting silicides. Fundamental electronic, optical and transport properties of the silicides collected from recent publications will help readers choose their application in new generations of solid-state devices. A comprehensive presentation of thermodynamic and kinetic data is given in combination with their technical application, as is information on corresponding thin-film or bulk crystal formation techniques.
Download or read book VLSI Science and Technology 1982 written by Conrad J. Dell'Oca and published by . This book was released on 1982 with total page 398 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book High Temperature Corrosion written by César A. C. Sequeira and published by John Wiley & Sons. This book was released on 2019-01-23 with total page 656 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviews the science and engineering of high-temperature corrosion and provides guidelines for selecting the best materials for an array of system processes High-temperature corrosion (HTC) is a widespread problem in an array of industries, including power generation, aerospace, automotive, and mineral and chemical processing, to name a few. This book provides engineers, physicists, and chemists with a balanced presentation of all relevant basic science and engineering aspects of high-temperature corrosion. It covers most HTC types, including oxidation, sulfidation, nitridation, molten salts, fuel-ash corrosion, H2S/H2 corrosion, molten fluoride/HF corrosion, and carburization. It also provides corrosion data essential for making the appropriate choices of candidate materials for high-temperature service in process conditions. A form of corrosion that does not require the presence of liquids, high-temperature corrosion occurs due to the interaction at high temperatures of gases, liquids, or solids with materials. HTC is a subject is of increasing importance in many areas of science and engineering, and students, researchers, and engineers need to be aware of the nature of the processes that occur in high-temperature materials and equipment in common use today, especially in the chemical, gas, petroleum, electric power, metal manufacturing, automotive, and nuclear industries. Provides engineers and scientists with the essential data needed to make the most informed decisions on materials selection Includes up-to-date information accompanied by more than 1,000 references, 80% of which from within the past fifteen years Includes details on systems of critical engineering importance, especially the corrosion induced by low-energy radionuclides Includes practical guidelines for testing and research in HTC, along with both the European and International Standards for high-temperature corrosion engineering Offering balanced, in-depth coverage of the fundamental science behind and engineering of HTC, High Temperature Corrosion: Fundamentals and Engineering is a valuable resource for academic researchers, students, and professionals in the material sciences, solid state physics, solid state chemistry, electrochemistry, metallurgy, and mechanical, chemical, and structural engineers.
Download or read book Sputtering Materials for VLSI and Thin Film Devices written by Jaydeep Sarkar and published by William Andrew. This book was released on 2010-12-13 with total page 614 pages. Available in PDF, EPUB and Kindle. Book excerpt: An important resource for students, engineers and researchers working in the area of thin film deposition using physical vapor deposition (e.g. sputtering) for semiconductor, liquid crystal displays, high density recording media and photovoltaic device (e.g. thin film solar cell) manufacturing. This book also reviews microelectronics industry topics such as history of inventions and technology trends, recent developments in sputtering technologies, manufacturing steps that require sputtering of thin films, the properties of thin films and the role of sputtering target performance on overall productivity of various processes. Two unique chapters of this book deal with productivity and troubleshooting issues. The content of the book has been divided into two sections: (a) the first section (Chapter 1 to Chapter 3) has been prepared for the readers from a range of disciplines (e.g. electrical, chemical, chemistry, physics) trying to get an insight into use of sputtered films in various devices (e.g. semiconductor, display, photovoltaic, data storage), basic of sputtering and performance of sputtering target in relation to productivity, and (b) the second section (Chapter 4 to Chapter 8) has been prepared for readers who already have background knowledge of sputter deposition of thin films, materials science principles and interested in the details of sputtering target manufacturing methods, sputtering behavior and thin film properties specific to semiconductor, liquid crystal display, photovoltaic and magnetic data storage applications. In Chapters 5 to 8, a general structure has been used, i.e. a description of the applications of sputtered thin films, sputtering target manufacturing methods (including flow charts), sputtering behavior of targets (e.g. current - voltage relationship, deposition rate) and thin film properties (e.g. microstructure, stresses, electrical properties, in-film particles). While discussing these topics, attempts have been made to include examples from the actual commercial processes to highlight the increased complexity of the commercial processes with the growth of advanced technologies. In addition to personnel working in industry setting, university researchers with advanced knowledge of sputtering would also find discussion of such topics (e.g. attributes of target design, chamber design, target microstructure, sputter surface characteristics, various troubleshooting issues) useful. . Unique coverage of sputtering target manufacturing methods in the light of semiconductor, displays, data storage and photovoltaic industry requirements Practical information on technology trends, role of sputtering and major OEMs Discussion on properties of a wide variety of thin films which include silicides, conductors, diffusion barriers, transparent conducting oxides, magnetic films etc. Practical case-studies on target performance and troubleshooting Essential technological information for students, engineers and scientists working in the semiconductor, display, data storage and photovoltaic industry
Download or read book VLSI Metallization written by Norman G. Einspruch and published by Academic Press. This book was released on 2014-12-01 with total page 491 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Electronics Microstructure Science, Volume 15: VLSI Metallization discusses the various issues and problems related to VLSI metallization. It details the available solutions and presents emerging trends. This volume is comprised of 10 chapters. The two introductory chapters, Chapter 1 and 2 serve as general references for the electrical and metallurgical properties of thin conducting films. Subsequent chapters review the various aspects of VLSI metallization. The order of presentation has been chosen to follow the common processing sequence. In Chapter 3, some relevant metal deposition techniques are discussed. Chapter 4 presents the methods of VLSI lithography and etching. Conducting films are first deposited at the gate definition step; therefore, the issues related to gate metallization are discussed next in Chapter 5.In Chapter 6, contact metallization is elaborated, and Chapter 7 is devoted to multilevel metallization schemes. Long-time reliability is the subject of Chapter 8, which discusses the issues of contact and interconnect electromigration. GaAs metallization is tackled in Chapter 9. The volume concludes with a general discussion of the functions of interconnect systems in VLSI. Materials scientists, processing and design engineers, and device physicists will find the book very useful.
Download or read book Mechanical Properties of Silicon Based Compounds Silicides written by Joshua Pelleg and published by . This book was released on 2019 with total page 272 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book focuses on the mechanical properties of silicides for very large scale integration (VLSI) applications. It presents the fabrication process for bulk silicides and thin films, and list complete testing deformation for a variety of silicon based compounds. The author also presents dislocation in silicides, fatigue and fracture aspects. A special chapter is given on deformation in silicides in the nano scale. Composites and alloys are also considered.
Download or read book VLSI Handbook written by Norman Einspruch and published by Academic Press. This book was released on 2012-12-02 with total page 929 pages. Available in PDF, EPUB and Kindle. Book excerpt: VLSI Handbook is a reference guide on very large scale integration (VLSI) microelectronics and its aspects such as circuits, fabrication, and systems applications. This handbook readily answers specific questions and presents a systematic compilation of information regarding the VLSI technology. There are a total of 52 chapters in this book and are grouped according to the fields of design, materials and processes, and examples of specific system applications. Some of the chapters under fields of design are design automation for integrated circuits and computer tools for integrated circuit design. For the materials and processes, there are many chapters that discuss this aspect. Some of them are manufacturing process technology for metal-oxide semiconductor (MOS) VLSI; MOS VLSI circuit technology; and facilities for VLSI circuit fabrication. Other concepts and materials discussed in the book are the use of silicon material in different processes of VLSI, nitrides, silicides, metallization, and plasma. This handbook is very useful to students of engineering and physics. Also, researchers (in physics and chemistry of materials and processes), device designers, and system designers can also benefit from this book.
Download or read book VLSI Science and Technology written by and published by . This book was released on 1984 with total page 526 pages. Available in PDF, EPUB and Kindle. Book excerpt:
Download or read book Advanced Nanoscale ULSI Interconnects Fundamentals and Applications written by Yosi Shacham-Diamand and published by Springer Science & Business Media. This book was released on 2009-09-19 with total page 545 pages. Available in PDF, EPUB and Kindle. Book excerpt: In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Download or read book Fundamentals of Semiconductor Processing Technology written by Badih El-Kareh and published by Springer Science & Business Media. This book was released on 1994-12-31 with total page 620 pages. Available in PDF, EPUB and Kindle. Book excerpt: The drive toward new semiconductor technologies is intricately related to market demands for cheaper, smaller, faster, and more reliable circuits with lower power consumption. The development of new processing tools and technologies is aimed at optimizing one or more of these requirements. This goal can, however, only be achieved by a concerted effort between scientists, engineers, technicians, and operators in research, development, and manufac turing. It is therefore important that experts in specific disciplines, such as device and circuit design, understand the principle, capabil ities, and limitations of tools and processing technologies. It is also important that those working on specific unit processes, such as lithography or hot processes, be familiar with other unit processes used to manufacture the product. Several excellent books have been published on the subject of process technologies. These texts, however, cover subjects in too much detail, or do not cover topics important to modem tech nologies. This book is written with the need for a "bridge" between different disciplines in mind. It is intended to present to engineers and scientists those parts of modem processing technologies that are of greatest importance to the design and manufacture of semi conductor circuits. The material is presented with sufficient detail to understand and analyze interactions between processing and other semiconductor disciplines, such as design of devices and cir cuits, their electrical parameters, reliability, and yield.
Download or read book Semiconductor Silicon written by and published by . This book was released on 1986 with total page 1146 pages. Available in PDF, EPUB and Kindle. Book excerpt:
